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Who we are ||
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日本語
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The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.
If youre looking for technical excellence, professional development and international networking opportunities, the CPMT Society can help you through its
journals,
conferences
and workshops, committee activities,
local chapter events,
educational programs and
awards.

  
11th Electronic Material and Packaging Conference (EMAP 2009)
December 1-3, 2009
Penang, Malaysia
2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009)
December 2-4, 2009
Hong Kong, China
11th Electronics Packaging Technology Conference (EPTC 2009)
December 9-11, 2009
Singapore
ADDITIONAL CONFERENCES AND WORKSHOPS

   
CPMT Transactions
Profiles of our three IEEE Transactions; how to submit papers or contact the Editors
CPMT Society Newsletter
Read the latest Society news from around the globe.
More Publications Information
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