CONFERENCES IN 2008:

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
July 28~31, 2008   Shanghai, China
Contact: ICEPT-HDP Secretariat at icept2008@fudan.edu.cn

Joint Event: PORTABLE 2008 with 7th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008)
August 17—22, 2008   Edelweiss Hotel & Conference Center
Garmisch-Partenkirken, Germany
Contact: info@polytronic2008.com

Electronics System-Integration Technology Conference (ESTC 2008)
September 1-4, 2008;   University of Greenwich
Greenwich, London UK
Contact: Chris Bailey, Greenwich University, chris.bailey@estc.biz

4th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
September 24-26, 2008   Rome, Italy
Contact: Chantal Bénis-Morel, CMP, chantal.benis@imag.fr

2008 Workshop on Accelerated Stress Testing & Reliability (ASTR)
October 1 - 3, 2008   Portland, OR   USA
Contact: Cheryl Tulkoff, National Instruments, cheryl.tulkoff@ni.com

Joint Event: 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, with the 10th International Conference on Electronics Materials and Packaging (EMAP)
October 22 - 24, 2008   Taipei, Taiwan
Contact: Mr. Long-Shien Lin, tw2008@isu.edu.tw

54th IEEE Holm Conference on Electrical Contacts (HOLM 2008)
27-29 October, 2008   Orlando, FL   USA
Contact: Chi H. Leung, AMID DODUCO, cleung@amidoduco.com

Electrical Performance of Electronic Packaging (EPEP 2008)
27-29 October, 2008   San Jose, CA   USA
Contact: Kelly, Univ of Arizona Professional Development, epd@engr.arizona.edu

33rd International Electronics Manufacturing Technology Symposium (IEMT 2008)
November 4-6, 2008;   Penang, Malaysia
Abstracts Due: Extended to June 30, 2008
Contact: Ir. Dr. Cheong Kuan Yew, USM cheong@eng.usm.my

9th VLSI Packaging Workshop in Japan
December 1 - 2, 2008;   Kyoto, Japan
Contact: Michitaka Kimura, Renesas Technology Corp, kimura.michitaka@renesas.com

10th Electronics Packaging Technology Conference (EPTC 2008)
December 9-12, 2008;   Singapore
Contact: Dr. Tong Yan Tee, tytee@amkor.com

Electrical Design of Advanced Packaging and Systems (EDAPS 2008)
December 10-12, 2008   COEX Conference Center
Seoul, Korea
Papers due: July 31, 2008
Contact: S.M Yang, yangsm@ee.kaist.ac.kr (Office: 82-42-869-5458)

2nd Int'l Conference on Thermal issues in Emerging Technologies, Theory and Applications (ThETA2)
December 17 – 20, 2008   Cairo, Egypt
Papers due: July 31, 2008
Contact: thetaconf@gmail.com

CONFERENCES IN 2009:

2009 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 25)
March 15-19, 2009   San Jose, CA USA
Abstracts due: October 15, 2008
Contact: Tom Tarter, ttarter@ieee.org

59th Electronic Components and Technology Conference (ECTC 2009)
May 25-29, 2009   San Diego, CA USA
Abstracts due: October 15, 2008
Contact: Jean Trewhella, jeanmh@us.ibm.com (Office: +39 0382309579)

European Microelectronics and Packaging Conference & Exhibition (EMPC 2009)
June 14-17, 2009   Rimini, Italy
Abstracts due: December 31, 2008
Contact: Pragma Congressi, segreteria@empc2009.org (Office: +39 0382309579)

IEEE International Workshop On Advances in Sensors and Interfaces (IWASI'09)
June 25-26, 2009   Trani, Italy
Papers due: February 28, 2009
Contact: Prof. Daniela De Venuto, d.devenuto@poliba.it