CONFERENCES IN 2008:

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008)
April 20-23, 2008   Freiburg, Germany
Contact: Olivier de Saint Leger, olivier.desaintleger@astefo.com

31st International Spring Seminar on Electronics Technology (ISSE 2008)
May 7-11, 2008   Budapest, Hungary
Contact: info.isse2008@ett.bme.hu

IEEE Workshop on Signal Propagation on Interconnects (SPI 2008)
May 12-15, 2008   Avignon, France
Contact: Denis Deschacht, Denis.Deschacht@lirmm.fr

58th Electronic Components and Technology Conference (ECTC 2008)
May 27 - 30, 2008;   Disney's Contemporary Resort
Lake Buena Vista, Florida USA
Advance Program in early February
Contact: Jean Trewhella, IBM, Jean Trewhella, jeanmh@us.ibm.com

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM 2008)
May 28-31, 2008   Orlando, FL USA
Contact: Ms. Kelly Sutton, epd@engr.arizona.edu

18th IEEE Semiconductor Wafer Test Workshop (SWTW 2008)
June 8-11, 2008   San Diego, CA USA
Abstracts Due March 14
Contact: Bill Mann, william.mann@ieee.org

International Conference on Electronics Packaging (ICEP 2008)
June 10-12, 2008   Tokyo Big Sight, Tokyo, Japan
Contact: ICEP Secretariat at icep@jiep.or.jp

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
July 28~31, 2008   Shanghai, China
CFP Abstracts Deadline: April 11, 2008
Contact: ICEPT-HDP Secretariat at icept2008@fudan.edu.cn

Joint Event: PORTABLE 2008 with 7th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008)
August 17—22, 2008   Edelweiss Hotel & Conference Center
Garmisch-Partenkirken, Germany
Contact: info@polytronic2008.com

Electronics System-Integration Technology Conference (ESTC 2008)
September 1-4, 2008;   University of Greenwich
Greenwich, London UK
Contact: Chris Bailey, Greenwich University, chris.bailey@estc.biz

4th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
September 24-26, 2008   Rome, Italy
Contact: Chantal Bénis-Morel, CMP, chantal.benis@imag.fr

2008 Workshop on Accelerated Stress Testing & Reliability (ASTR)
October 1 - 3, 2008   Portland, OR   USA
Abstracts Due: April 28, 2008
Contact: Cheryl Tulkoff, National Instruments, cheryl.tulkoff@ni.com

Joint Event: 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, with the 10th International Conference on Electronics Materials and Packaging (EMAP)
October 22 - 24, 2008   Taipei, Taiwan
Abstracts Due: May 31, 2008
Contact: Mr. Long-Shien Lin, tw2008@isu.edu.tw

54th IEEE Holm Conference on Electrical Contacts (HOLM 2008)
27-29 October, 2008   Orlando, FL   USA
Contact: Chi H. Leung, AMID DODUCO, cleung@amidoduco.com

33rd International Electronics Manufacturing Technology Symposium (IEMT 2008)
November 4-6, 2008;   Penang, Malaysia
Abstracts Due: Extended to June 15, 2008
Contact: Ir. Dr. Cheong Kuan Yew, USM cheong@eng.usm.my

9th VLSI Packaging Workshop in Japan
December 1 - 2, 2008;   Kyoto, Japan
Abstracts Due: May 31, 2008
Contact: Michitaka Kimura, Renesas Technology Corp, kimura.michitaka@renesas.com

10th Electronics Packaging Technology Conference (EPTC 2008)
December 9-12, 2008;   Singapore
Abstracts due June 15, 2008
Contact: Dr. Tong Yan Tee, tytee@amkor.com

Electrical Design of Advanced Packaging and Systems (EDAPS 2008)
December 10-12, 2008   COEX Conference Center
Seoul, Korea
Papers due: July 31, 2008
Contact: S.M Yang, yangsm@ee.kaist.ac.kr (Office: 82-42-869-5458)

2nd Int'l Conference on Thermal issues in Emerging Technologies, Theory and Applications (ThETA2)
December 17 – 20, 2008   Cairo, Egypt
Papers due: July 31, 2008
Contact: thetaconf@gmail.com

CONFERENCES IN 2009:

European Microelectronics and Packaging Conference & Exhibition (EMPC 2009)
June 14-17, 2009   Rimini, Italy
Abstracts due: December 31, 2008
Contact: Pragma Congressi, segreteria@empc2009.org (Office: +39 0382309579)