CONFERENCES IN 2009:

IEEE International Workshop On Advances in Sensors and Interfaces (IWASI'09)
June 25-26, 2009   Trani, Italy
Contact: Prof. Daniela De Venuto, d.devenuto@poliba.it

2009 5th Annual Organic Microelectronics and Optoelectronics Workshop
July 6-9, 2009   San Francisco CA, USA
Contact: organic_microelectronics@acs.org

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
August 10-13, 2009   Beijing, China
Contact: icept2009@tsinghua.edu.cn

2009 IEEE Holm Conference on Electrical Contacts (Holm 2009)
Sept. 14-16, 2009   Vancouver, BC, Canada
Contact: April Coles, a.coles@ieee.org

2009 IEEE International Conference on Portable Information Devices (PORTABLE)
September 21-22, 2009   Anchorage, AK, USA
Contact: Ephraim Suhir, suhire@aol.com

2009 3rd International Conference on 3D System Integration (3DIC 2009)
September 28–30, 2009   San Fancisco, CA, USA
Contact: P. Garrou, pgarrou@rti.org

2009 15th Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009)
October 7 – 9, 2009   Leuven, Belgium
Contact: Chantal Bénis-Morel, chantal.benis@imag.fr

2009 IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (ASTR 2009)
October 7-9 2009   Jersey City, NJ, USA
Contact: Cheryl Tulkoff, ctulkoff@austin.rr.com

Future Directions in IC and Package Design Workshop (FDIP)
October 18, 2009,   Portland, OR USA (co-located with EPEP)
Contact: Kelly Sutton, pasutton@email.arizona.edu

2009 18th IEEE Electrical Performance of Electronic Packaging (EPEP 2009)
October 19-21, 2009   Portland, OR, USA
Contact: Kelly Sutton, epd@engr.arizona.edu

2009 4th Int'l Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2009)
October 21-23, 2009   Taipei, Taiwan
Contact: Ms.Yaffy Liu, service@impact.org.tw

11th Electronic Material and Packaging Conference (EMAP 2009)
December 1-3, 2009   Penang, Malaysia
Abstracts due June 30th
Contact: M. Abdul Mujeebu, mamujeeb5@yahoo.com

2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009)
December 2-4, 2009   Hong Kong, China
Contact: edaps2009@ee.cuhk.edu.hk

2009 11th Electronics Packaging Technology Conference (EPTC 2009)
December 9-11, 2009   Singapore
Abstracts Due July 7 (extended deadline)
Contact: secretariat@eptc-ieee.net

CONFERENCES IN 2010:

2009 60th Electronic Components and Technology Conference (ECTC 2010)
June 1 - 4, 2010   Las Vegas, NV, USA
Contact: Jean Trewhella, jeanmh@us.ibm.com

2010 Electronics System-Integration Technology Conference (ESTC 2010)
September 13-16, 2010   Berlin, Germany
Contact: Rolf Aschenbrenner, rolf.aschenbrenner@izm.fraunhofer.de