|
|
|
|
|
 | ||
| ||
(We apologize if the links below no longer take you to information about these past conferences. In some cases, the past Proceedings are still available from the CPMT Society or directly from the IEEE's on-line store.)
|
Conferences in 2007 |
||
| Conference | Date; place | Contact |
| Int'l Conference on Thermal Issues in Emerging Technologies - Theory and Application (ThETA'07) | 3-6 January, 2007, Cairo Nile Hilton, Egypt | Dr. Nabil Sabry, nabla@link.net |
| 6th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007) | January 16-18, 2007; Tokyo, Japan | Ms. Natsuko KAWAMATA, The University of Tokyo, secret.natsuko@su.rcast.u-tokyo.ac.jp |
| 10th European Systems Packaging Workshop (ESPW) | January 29 - 31, 2007; Como, Italy | Carla Giachino, Politecnico di Torino, carla.giachino@delen.polito.it |
| 2007 23rd Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) | March 20-22, 2007; Fairmont Hotel, San Jose, CA USA | James Wilson, Raytheon, jsw@raytheon.com |
| 2007 IEEE International Conference on Portable Information Devices (PORTABLE) | March 25-29, 2007; Orange County Convention Ctr., Orlando, FL USA | Contact: Debora Kingston, IEEE, d.kingston@comsoc.org |
| 2007 Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Conference (EuroSimE) | April 15-18, 2007; Holiday Inn Kensington-Forum, London, England | Contact: Prof. Chris Bailey, Greenwich University, C.Bailey@gre.ac.uk |
| 2007 IEEE Workshop on Signal Propagation on Interconnects (SPI) | May 13-16, 2007; Portofino Kulm Hotel, Ruta di Camogli, Italy | Contact: Flavio Canavero, Politecnico di Torino, flavio.canavero@polito.it |
| 57th Electronic Components and Technology Conference (ECTC 2007) | May 29 - June 1, 2007 Reno, Nevada USA | Contact: Eric Perfecto, IBM Corporation, Hopewell Junction, NY 12533 USA; +1 845 894 4400; perfecto@us.ibm.com |
| 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) | June 11-12, 2007; Grand Hotel Bristol, Stresa, Italy | Contact: Margaret Kindling, SEMI, mkindling@semi.org |
| 9th Int'l IEEE-CPMT Symposium on High Density Design, Packaging and Microsystem Integration (HDP’07) | June 26-28, 2007; Shanghai, China | Contact: hdp07@hdpchina.com |
| IEEE International Workshop on Advances in Sensors and Interfaces (IWASI) | June 26-27, 2007; Villa Romanazzi Carducci, Bari, Italy | Contact: Prof. Daniela De Venuto, Politecnico di Bari, d.devenuto@poliba.it |
| 3rd Annual Organic Microelectronics Workshop | July 8-11, 2007; Seattle Crowne Plaza, Seattle, WA USA | Contact: the Organic Microelectronics Workshop at organic_microelectronics@acs.org |
| 8th International Conference on Electronics Packaging Technology (ICEPT 2007) | August 14-17, 2007; Shanghai, China | Contact: Dongyan Ding, Shanghai Jiao Tong University, icept2007@sjtu.edu.cn |
| 53rd IEEE Holm Conference on Electrical Contacts, and Intensive Course | September 16-19, 2007; Sheraton Station Square Hotel, Pittsburgh, PA USA | Contact: Elsie Cabrera, IEEE, e.cabrera@ieee.org |
| 3D System Integration Workshop – The Future Technology! | October 1-2, 2007; Fraunhofer Gesellschaft, München Germany | Contact: Simone Brand, Fraunhofer IZM, simone.brand@izm-m.fraunhofer.de |
| Int'l Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference | October 1-3, 2007; Taipei International Convention Center, Taiwan | Contact: Wendy Huang, Conference Secretariat, impact@itri.org.tw |
| 34th Int'l Electronics Manufacturing Technology Symposium (IEMT 2007) | October 3-5, 2007; Holiday Inn, San Jose (Silicon Valley), CA USA | Contact: Paul Wesling, p.wesling@ieee.org |
| Advanced Packaging Materials Symposium (APM 2007) | October 3-5, 2007; Holiday Inn, San Jose (Silicon Valley), CA USA | Contact: Paul Wesling, p.wesling@ieee.org |
| 16th Annual International Symposium on Semiconductor Manufacturing (ISSM'07) | October 15-17, 2007, Marriott Hotel, Santa Clara, CA USA | Contact: Maria Hess, AMD, maria.hess@amd.com |
| 2007 IEEE Electrical Performance of Electronic Packaging (EPEP) | October 29-31, 2007; Renaissance Atlanta Hotel Downtown, Atlanta, GA USA | Contact: Kelly Sutton, University of Arizona, epd@engr.arizona.edu |
| 2007 IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (AST) | October 31 - November 2, 2007; Greenbelt Marriot in Greenbelt, Maryland USA | Contact: Kirk Gray, Dell Computer, Kirk_Gray@Dell.com |
| 2007 International Symposium on Electronic Materials and Packaging (EMAP2007) | November 19-22, 2007; KAIST (Korea Advanced Institute of Science & Technology), Daejon, Korea | Contact: For more information, email emap@kaist.ac.kr |
| 9th Electronics Packaging Technology Conference (EPTC 2007) | December 10-12, 2007; Singapore | Contact: Ms. Jasmine Leong, EPTC07 Secretariat, secretariat@eptc-ieee.net |
| 2007 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) | December 15-17, 2007; Taipei, Taiwan | Contact: Hui-Yun Hu, EDAPS Secretariat, edaps2007@tl.ntu.edu.tw |
| 2008 Systems Packaging Japan Worshop (SPJW) | January 28-30, 2008 Hotel de Yama, Hakone, Japan | Contact: Kishio Yokouchi, Fujitsu Interconnect Technologies Ltd., yokouchi.kishio@fict.fujitsu.com |
|
Conferences in 2006 |
||
| Conference | Date; place | Contact |
| IEEE Systems Packaging Japan Workshop | Jan 30 - Feb 1, 2006, Hakone, Japan | Hiroshi Go, Hitachi Corp, hiroshi.go.wt@hitachi.com |
| 22nd Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'06) | March 14-16, 2006, Dallas TX, USA | Bonnie Crystall, cscomm@earthlink.net, Ph +1-480-839-8988 |
| Int'l Symposium and Exhibition on Advanced Packaging Materials (APM 2006) | March 15-17, 2006, Atlanta, GA, USA | Prof. Jianmin Qu, Georgia Tech, E-Mail jianmin.qu@me.gatech.edu |
| Int'l Conference on Electronics Packaging (ICEP 2006) | April 19 -21, 2006, Tokyo, Japan | Contact: Secretariat of ICEP 2006, TEL:+81-3-5310-2010, E-Mail imaps-j@jiep.or.jp |
| 7th Int'l Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2006) | April 23-26, 2006, Milan, Italy | Contact: Secretariat of EuroSimE 2006, TEL:+33(0)1 3043 6388, E-Mail eurosime@astefo.com |
| IEEE Workshop on Signal Propagation on Interconnects (SPI 2006) | May 9-12, 2006, Berlin, Germany | Contact: Prof. Hartmut Grabinski, Laboratorium fur Informationstechnologie, Univ. of Hannover, Germany, Phone: +49-511-762-5030, E-Mail grabinski@lfi.uni-hannover.de |
| International Spring Seminar on Electronics Technology (ISSE 2006) | May 10-14, 2006, Dresden/St. Marienthal, Germany | Contact: Dr. Heinz Wohlrabe, TU-Dresden, Germany, E-Mail wohlrabe@zmp.et.tu-dresden.de |
| 56th Electronic Components and Technology Conference (ECTC 2006) | May 30 - June 2, 2006, San Diego, CA USA | Contact: Eric Perfecto, IBM Corporation, Hopewell Junction, NY 12533 USA, E-Mail perfecto@us.ibm.com |
| 10th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) | May 30 - June 2, 2006, San Diego, CA USA | Contact: Kelly Sutton, University of Arizona, Tucson, AZ 85719 USA, E-Mail epd@engr.arizona.edu |
| 8th Int'l Symposium on High Density Microsystem Design and Packaging and Component Failure Analysis in Electronics Manufacturing (HDP'06) | June 27-30, 2006, Shanghai, China | Contact: Prof. Johan Liu, Chalmers University, E-Mail Prof. Johan Liu, johan.liu@mc2.chalmers.se |
| 7th International Conference on Electronics Packaging Technology (ICEPT'06) | August 26-29, 2006, Shanghai, China | Contact: Prof. Sheng Liu, shengliu63@gmail.com |
| 1st Electronics Systemintegration Technology Conference (ESTC 2006) | 5-7 September, 2006, Dresden, Germany | Contact: Prof. Klaus-Jürgen Wolter, Dresden University of Technology, Germany; +49-351-463 36345; wolter@avt.et.tu-dresden.de |
| Workshop on Accelerated Stress Testing & Reliability (ASTR 2006) | October 4-6, 2006, San Francisco, CA USA | Contact: John Proulx General Motors |
| Electrical Performance of Electronic Packaging (EPEP 2006) | 23-25 October, 2006, Scottsdale, Arizona USA | Contact: Moises Cases, IBM |
| 31st International Electronics Manufacturing Technology Symposium (IEMT 2006) | 8-10 November, 2006, Kuala Lumpur, Malaysia | Contact: C. H. Chew |
| 8th VLSI Packaging Workshop in Japan | December 4-5, 2006, Kyoto, Japan | Contact: Mr. Tomoshi Ohde, Sony Corporation, E-Mail ohde@rd.scei.sony.co.jp |
| 5th Annual Printed Electronics USA 2006 | December 5-6, 2006, Phoenix, AZ | Contact: Mr. Chris Clare, IDTechEx, E-Mail c.clare@idtechex.com |
| 8th Electronics Packaging Technology Conference (EPTC 2006) | 6-8 December, 2006, Pan Pacific Hotel, Singapore | Contact: Prof. John H.L. Pang, General Chair, EPTC 2006, mhlpang@ntu.edu.sg |
| 8th International Conference on Electronics Materials And Packaging (EMAP 2006) | 11-14 December, 2006, HKUST, Hong Kong | Contact: Prof. Ricky Lee, General Chair, EMAP 2006, rickylee@ust.hk |
|
Conferences in 2005 |
||
| Conference | Date; place | Contact |
| 9th European System Packaging Workshop | January 31 - February 2, 2005; Berlin, Germany. | Christine Kallmeyer, Fraunhofer IZM, kallmayr@izm.fhg.de, Ph +49 30 46403 288 |
| 21st Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'05) | March 15-17, 2005, San Jose, CA, USA | Bonnie Crystall, cscomm@earthlink.net, Ph +1-480-839-8988 |
| Advanced Packaging Materials Symposium | March 16-18, 2005, Irvine, CA, USA | Dr. Goran Matijasevic, UC-Irvine, goran@uci.edu, Ph +1-949-824-9830 |
| 6th International Symposium on Quality Electronic Design (ISQED'05) | March 21-23, 2005, San Jose, CA, USA | Ali Iranmanesh, ISQED, alii@isqed.org |
| 2nd Int'l Workshop on Nano & Bio-Electronics Packaging (NanoPack'05) | March 22-23, 2005, Atlanta, GA, USA | Dr. Swapan Bhattacharya, Georgia Tech, swapan@ee.gatech.edu |
| 16th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (ASMC'05) | 11-12 April 2005, Munich, Germany | Margaret Kindling, SEMI, mkindling@semi.org |
| 6th Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE'05) | 17-20 April 2005, Berlin, Germany | Dag Andersson, IVF, dag.andersson@ivf.se |
| Workshop on Signal Propagation on Interconnects (SPI'05) | May 10-13, 2005, Garmisch-Partenkirchen, Germany | Hartmut Grabinski, Laboratorium fur Informationstechnologie, Hannover, Germany - grabinski@lfi.uni-hannover.de |
| 8th International Academic Conference on Electronic Packaging Education and Training | May 18-19, 2005, Vienna, Austria | Prof. Klaus-Jurgen Wolter, Technische Universität Dresden - wolter@avt.et.tu-dresden.de |
| 28th International Spring Seminar on Electronics Technology (ISSE'05) | May 19-22, 2005, Vienna, Austria | isse2005@matwiss.isas.tuwien.ac.at |
| 55th Electronic Components and Technology Conference (ECTC'05) | May 31 - June 3, 2005, Orlando, Florida, USA | Donna Noctor, noctor@ectc.net |
| Symposium on Design, Text, Integration and Packaging of MEMS/MOEMS (DTIP) | June 1-3, 2005, Montreux, Switzerland | Bernard Courtois, Bernard.Courtois@imag.fr |
| Organic Microelectronics Workshop (ACS/MRS/CPMT) | July 10-13, 2005 Newport, Rhode Island, USA |
Contact: +1-202-872-4600, acsprospectives@acs.org |
| 30th International Electronics Manufacturing Technology Symposium (IEMT'05) | San Francisco, CA USA July 11-12, 2005 |
Contact: Sheri Mukai, SEMI, +1-408-943-7920, smukai@semi.org |
| 11th International Workshop on THERMAL INVESTIGATIONS of ICs and Systems (THERMINIC) | 27 - 30 September 2005 Lake Maggiore, Italy |
Contact: Bernard Courtois, Phone +33 4 76 57 46 15, Therminic@imag.fr |
|
First Int'l Workshop on 3S Electronics Technologies System-on-Package, System-In-Package, System-on-Chip |
September 22 - 23, 2005 Atlanta, GA USA |
Contact: Boyd Wiedenman boyd.wiedenman@ece.gatech.edu |
| Workshop on Accelerated Stress Testing & Reliability (ASTR'05) | October 3 - 5, 2005 Austin, TX USA |
Contact: Rick Leeds, Registration Chair, cryores@aol.com |
| 5th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC'05) | 23-26 October, 2005 Wroclaw, Poland |
Contact: Prof. Jan Felba, Wroclaw University of Technology, Phone +48 (71) 332 44 88, organizers@polytronic2005.org |
| 14th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'05) | 24-26 October, 2005 Austin, TX USA |
Contact: Prof. Robert W. Jackson, University of Massachusetts, Phone +1 413 545 1386, jackson@ecs.umass.edu |
| 7th Electronics Packaging Technology Conference (EPTC 2005) | 7-9 December, 2005 Singapore |
Contact: Ms Shirley SOH, Nanyang Technological University, +(65) 6790-4826, enquiry@eptc-ieee.net |
| 7th International Conference on Electronics Materials and Packaging (EMAP 2005) | December 11-14, 2005 Tokyo Institute of Technology, Japan |
Contact: Prof. Satoru AIHARA, Tokyo Institute of Technology info@emap2005.sms.titech.ac.jp |
|
Conferences in 2004 |
||
| Conference | Date; place | Contact |
| Int'l IEEE Confer on Asian Green Electronics (AGEC) | January 5-9, 2004; Hong Kong; Shenzhen, China. | Angie Wong wywong@ee.cityu.edu.hk (852)2788-7379 (fax (852)2788-7579) |
| 2004 IEEE/CPMT 20th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) | March 9-11, 2004; San Jose CA | cscomm@earthlink.net Bonnie Crystall 1-480-839-8988 (fax: 1-480-345-1119) |
| 1st International Workshop in Nano Bio-Packaging (NanoBioPack) | March 22-23, 2004; Atlanta GA | wlp@ee.gatech.edu |
| 5th International Symposium on Quality Electronic Design (ISQED) | March 22-24, 2004; San Jose CA | Ali Keshavarzi ali.keshavarzi@intel.com |
| 9th International Symposium & Exhibition on Advanced Packaging Materials | March 24-26, 2004; Atlanta GA | petri.jo.savolainen@nokia.com +358-7180-39382 (fax +358-7180-37143) memount@ece.gatech.edu 1-404-894-9097 |
| 2004 IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop (ASMC) | May 4-6, 2004; Boston MA | mkindling@semi.org 1-202-289-0440, fax:1-202-289-0441 |
| 8th IEEE Workshop on Signal Propagation on Interconnects (SPI'04) | May 9-12, 2004; Heidelberg, Germany | Hartmut Grabinski, Universität Hannover Phone: +49-511-762-5030; Fax: +49-511-762-5051; email grabinski@lfi.uni-hannover.de |
| 5th int'l Conf on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE 2004 | May 10 - 12, 2004; Brussels, Belgium | Bart Vandevelde (Bart.Vandevelde@imec.be); Marion Hegemann (Marion.Hegemann@imec.be -(tel.: +32 16 281 849) |
| 27th International Spring Seminar on Electronics Technology (ISSE) | 13-16 May, 2004; Sofia, Bulgaria | |
| 2004 IEEE 54th Electronic Components & Technology Conference (ECTC'04) | June 1-4, 2004; Las Vegas NV | jadams@eia.org Judy Adams 1-703-907-7536 (fax: +1-703-907-7549) |
| Photomask Europa 2004 | June 21-24, 2004; Dresden, Germany | |
| 7th IEEE International Academic Conference on Next Generation Microsystem Packaging Research and Education | June 28-30, 2004; Shanghai, China | Ms Chen Jie, smit@mail.shu.edu.cn |
| 6th IEEE Conference on High Density Microsystem Design and Packaging and Failure Analysis (HDP'04) | June 30-July 3, 2004; Shanghai, China | Ms Chen Jie, smit@mail.shu.edu.cn |
| 29th International Electronics Manufacturing Technology Symposium<(IEMT) |
July 14-16, 2004 San Jose CA, held at SEMICON West |
Gloria Lou, SEMI glou@semi.org or +1.408.943.7048 |
| Polytronic 2004: 4th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics | 12-15 September 2004 Portland, Oregon, USA |
Contact: Dennis McCal dennis.mccal@ieee.org |
| 2004
IEEE Holm Conference on Electrical Contacts (HOLM) |
September 20-23, 2004 Seattle WA USA |
Contact: Jennifer Lambert (IEEE Conf Mgmt) - j.lambert@ieee.org 1-732-981-3870 |
| 7th VLSI Packaging Workshop of Japan | Nov 30 - Dec 2, 2004 Kyoto, Japan |
Contact: Dr. Max Kohno, Dow Chemical, +81-550-82-8030 mkohno@dow.com |
| 6th International Conference on Electronic Materials & Packaging (EMAP) | December 5-7, 2004 Penang, Malaysia |
Contact: Prof. K N Setharamu, USM, knseetharamu@hotmail.com |
| 6th Electronics Packaging Technology Conference (EPTC'04) | December 8-10, 2004 Singapore |
Contact: Prof. KC Toh, Nanyang Technological Univ, +65 6790 5583, mkctoh@ntu.edu.sg |
|
Conferences in 2003 |
||
| Conference | Date; place | Contact |
| International IEEE Conference on the Business of Electronic Product Reliability and Liability | January 13-14, 2003; Hong Kong & Shenzhen | Angie Wong wywong@ee.cityu.edu.hk (852)2788-7379 (fax (852)2788-7579) |
| 2003 !EEE/CPMT 19th Semiconductor Thermal Measurement & Management Symposium | March 11-13, 2003; San Jose CA | cscomm@earthlink.net Bonnie Crystall 1-480-839-8988 (fax: 1-480-345-1119) |
| 9th International Symposium & Exhibition on Advanced Packaging Materials | March 19-21, 2003; Atlanta GA | petri.jo.savolainen@nokia.com +358-7180-39382 (fax +358-7180-37143) msherrer@ee.gatech.edu 1-404-894-9097 |
| IEEE Internat Symposium on Quality Electronics Design (ISQED) | March 24-27, 2003; San Jose, CA | Ali Iranmanesh Alii@tavanza.com 1-408-330-1236 (fax 1-408-986-5095) |
| 4th Conf on Thermal & Mechanical Simulation & Expts in Microelec & Microsyst (EUROSIME) | March 30 - April 2, 2003; Aix-en-Provence, France | compete@mta.fr Tel: +33-1-4451-7400 Fax: +33-1-4451-7401 |
| 14th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference & Workshop (ASMC) | March 31 - 1 April, 2003; Munich, Germany | Margaret Kindling mkindling@semi.org fax: 1-202-289-0441 (USA) or Johanna Turpeinen, SEMI Europe europrograms@semi.org fax: 32.2.511.4345 |
| 2003 International Conference on Electronics Packaging (ICEP) | April 16-18, 2003; Tokyo, Japan | imaps-j@jiep.or.jp +81-3-5310-2010 (fax +81-3-5310-2011) |
| Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) | May 5-7, 2003; Cannes, France. | Bernard Courtois dtip2003@imag.fr fax:+33-4-76-47-38-14 |
| International Spring Seminar on Electronics Technology | May 8-11, 2003; High Tatra, Slovakia | alena.pietrikova@tuke.sk +421(55)6023194 (fax +421(55)6023195 |
| 7th IEEE Workshop on Signal Propagation on Interconnects (SPI'03) | May 11-14, 2003; Siena, Italy | canavero@polito.it +39-011-564-4060; maio@polito.it +39-011-564-4100 (fax +39-011-564-4099) |
| 2003 IEEE 52nd Electronic Components & Technology Conference | May 27-30, 2003; New Orleans LA | jadams@eia.org Judy Adams 1-703-907-7536 (fax:1-703-907-7549) |
| InterPACK'03 (Inter-society Packaging Confer) | July 6-11, 2003; Maui, Hawaii | S.K.Bahattacharya swapan@ee.gatech.edu (404385-0708 (fax (404)894-0957) |
| International Electronics Manufacturing Technology (IEMT) Symposium | July 16-18, 2003; San Jose CA | Gloria Lou: glou@semi.org +1-408-943-7048 (fax +1-408-943-7913) |
| 9th International Workshop on Thermal Investigations of ICs & Systems (Therminic) | September 24-26, 2003; Aix-en-Provence, France | Bernard Courtois THERMINIC@imag.fr |
| 2003 IEEE International Symposium on Semiconductor Manufacturing (ISSM) | Sept 30-Oct 2, 2003; San Jose CA | Audrey Osborn issm@maritz.com 1-925-287-5388 fax:1-925-287-5398 |
| TC-7 2003 Workshop on Accelerated Stress Test & Reliability (AST'03) | October 1-3, 2003; Seattle WA | Mark Morelli Mark.Morelli@Otis.com +1-860-676-6140 |
| MST'03 (Microsystems Technologies) | October 7 -8, 2003; Munich, Germany | Erik Jung erju@izm.fhg.de Tel/fax: +49-30-46403-230/161 |
| 3rd Internat IEEE Confer on Polymers & Adhesives in Microelectronics & Photonics (Polytronic 2003) | October 20 - 23, 2003; Montreux, Switzerland | Bernard Courtois polytronic2003@imag.fr |
| 1st IEEE CPMT Regional Workshop on Microsystem Integration Technology | October 23-24, 2003; Shanghai, China | johan.liu@ivf.se (China & Scandinavian Chapters) |
| 2003 IEEE Electrical Performance of Electronic Packaging (EPEP) | Oct 27-29, 2003; Princeton, NJ | Paul Baltes baltes@engr.arizona.edu 1-560-621-5104 fax:1-520-621-1443 |
| 5th Intrnational Conference on Electronics Packaging Technology (ICEPT 2003) | Oct 28-30, 2003; Shanghai, China | jjwang@srcap.stc.sh.cn fax:86-21-65643529 (Reg: lgsong@fudan.ac.cn fax: 86-21-65103056) (Exhibits: asianinfo@online.sh.cn fax: 86-21-64697155) (Papers: icept2003@vip.163.com fax: 86-21-65103056) |
| 5th International Conference on Electronic Materials & Packaging (EMAP) | Nov 17-20, 2003; Singapore | Sung Yi sungyi@cecs.pdx.edu 1-503-725-5470 fax:1-503-725-8255 |
| 5th International Workshop on Flip Chip, CSP, Wafer Level Packaging | December 1-2, 2003; Berlin | elke.zakel@ieee.org (Germany Chapter) |
| 5th Electronics Packaging Technology Conference (EPTC'03) | December 10-12, 2003; Singapore | Mahadevan Iyer iyer@ime.a-star.edu.sg +65-6770-5424 (fax +65-6774-5747) |
|
Conferences in 2002 |
||
| Conference | Dates & Place | Contact |
| 2002 Japan Systems Packaging Workshop | Musashino, Japan February 4-6, 2002 | Tohru Kishimoto tohru@aecl.ntt.co.jp 81-422-59-4120 fax: 81-422-37-7595 |
| Commercialization of Military and Space Electronics Conference and Exhibition | Los Angeles Airport February 11-14, 2002 | Contact: dale@cti-us.com (256)536-1304, Fax (256)539-8477 |
| Wafer Level Packaging Workshop | March 1-2 2002, Atlanta GA | wlp@ee.gatech.edu |
| 8th International Symposium on Advanced Packaging Materials | March 3-6 2002, Atlanta GA | Rajen Chanchani chanchr@sandia.gov or Jianmin Qu jianmin.qu@me.gatech.edu 404-894-5687 |
| Journee Thematique: Le Packaging en Radiofrequence | March 11, 2002; Grenoble, France | tedjini@ieee.org Smail Tedjini +33-4-75-43-56-42 (fax) |
| Semiconductor Thermal Measurement & Management Symposium (SemiTHERM) | San Jose CA March 12-14, 2002 | Bonnie Leigh Crystall cscomm@earthlink.com (520)323-2870 fax:(520)323-2863 |
| Academic Packaging Conference | 19-22 March 2002, Dresden, Germany | Prof. Klaus Wolter wolter@iet.et.tu-dresden.de |
| 22nd Capacitor & Resistor Technology Symposium (CARTS 2002) | New Orleans 25-29 March 2002 | 1-256-536-1304 ; fax: 1-256-539-8477 |
| EuroSimE 2002 | 15-17 April 2002, Paris, France | Olivier de Saint Leger Compete@mta.fr |
| 2002 International Conference on Electronics Packaging (ICEP) | April 17-19 2002, Tokyo, Japan | 2002 ICEP Secretariat imaps-j@jiep.jp |
| 4th International Workshop on Flip Chip, CSP, Wafer Level Packaging | April 22-23, 2002; Berlin, Germany | elke.zakel@ieee.org |
| 2002 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (ASMC) | April 30 - May 2, 2002; Boston MA | Margaret Kindling (SEMI) mkindling@semi.org |
| International Symposium on Microelectronics Packaging | May 2, 2002; I-Shou University, Kaohsiung, Taiwan | szyi@isu.edu.tw Shen-Li Fu 886-7-6577001 fax: 886-7-6577051 |
| Symposium on Design, Test, Integration & Packaging (DITP 2002) of MEMS/MOEMS | Cannes-Mandelieu, France , 5-8 May 2002 | |
| 6th IEEE Workshop on Signal Propagation on Interconnects (SPI) | May 12-15, 2002; Castelvecchio-Pascoli (Pisa), Italy | Flavio Canavero canavero@polito.it or Ivan Maio maio@polito.it |
| 25th International Spring Seminar on Electronics Technology (ISSE'02) | 11-14 May, 2002, Prague, Czech Republic | Pavel Mach mach@feld.cvut.cz |
| 6th IEEE Workshop os Signal Propagation on Interconnects (SPI) | 12-15 May, 2002; Pisa, Italy | Ivan Maio maio@polito.it |
| TC-14 Systems Packaging Spring Workshop | 14-16 May, 2002; Research Triangle Park NC | |
| 52nd Electronic Component & Technology Conference | May 28-31, 2002, San Diego CA | m.mcshane@ieee.org |
| 8th Intersociety Conference on Thermal & Themomechanical Phenomena in Electronic Systems (I-THERM) | May 29 - June 1, 2002, San Diego, CA | Paul Baltes, epd@engr.arizona or Cristina Amon camon@cmu.edu |
| 2002 IEEE Intensive Course on Electrical Contacts | June 9-13, 2002; Washington DC | Jeanette Lopez (IEEE Confer Mgmt) j.m.lopez@ieee.org 1-732-981-3437 fax: 1-732-981-1203 |
| POLYTRONIC 2002 (2nd International IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics) | Zalaegerszeg, Hungary, June 23-26, 2002 | polytronic2002@ett.bme.hu +36 1 463 2740; fax:+36-1-463-4118 |
| 4th International Symposium High Density Packaging & Component Failure Analysis (HDP´02) | June 30 - July 3, 2002, Galaxy Hotel, Shanghai,China | Johan Liu johan.liu@pe.chalmers.se or Xiaomin Xie xmxie@itsvr.sim.ac.cn |
| International Electronics Manufacturing Technology (IEMT) Symposium | 17-18 July 2002; San Jose CA | Gloria Lou glou@semi.org 1-408-943-7048 (fax 1-408-943-7913) |
| 9th Annual International KGD Pakaging & Test Workshop | 8-11 September, 2002; Napa CA | kgd2002@dieproduct.com |
| 2002 Workshop on Accelerated Stress Testing (AST 2202) | 2 - 4 October, 2002; Montreal, Canada | Kirk Gray, k.a.gray@ieee.org 1-303-666-7692, fax 1-303-666-8726 |
| 2002 IEEE Holm Conference on Electrical Contacts | October 21-23, 2002; Orlando FL | Jeanette Lopez (IEEE Confer Mgmt) j.m.lopez@ieee.org 1-732-981-3437 fax: 1-732-981-1203 |
| Future Directions in IC & Package Design Workshop (FDIP) | 19 October 2002; Monterey CA | epd@engr.arizona.edu 1-520-621-3054/5104 (fax 1-520-621-1443) |
| 11th Topical Meeting on Electrical Performance & Packaging (EPEP 2002) | 21-23 October 2002; Monterey CA | epd@engr.arizona.edu 1-520-621-3054/5104 (fax 1-520-621-1443) |
| 6th VLSI Packaging Workshop of Japan | November 12-14, 2002; Kyoto, Japan | nakamura-atsushi4@sic.hitachi.co.jp +81-42-320-7301 Ext.3157, fax: +81-42-327-8631 |
| 4th International Workshop on Smart Card Technologies & Applications | November 18-20 2002, Germany | elke.zakel@ieee.org |
| 4th International Conference on Electronics Materials & Packaging (EMAP) | December 4-6, 2002; Kiaohsiung, Taiwan | Shen-Li Fu szyi@isu.edu.tw , 886-7-6577001 fax: 886-7-6577051 |
| Electrical Design of Advanced Packaging Systems (EDAPS) | 9 December 2002; Singapore | Karen Chin karen@ime.org.sg (65)-6770-5325 (fax (65)-6774-5747) |
| 4th Electronics Packaging Technology Conference (EPTC’2002) | December11-13, 2002; Singapore | Charles Lee Charles.Lee@infineon.com Jasmine Leong eptc_ieee@pacific.net.sg |
|
Conferences in 2001 |
||
| Conference | Dates & Place | Contact |
| 2001 European Systems Packaging Workshop | Jan 22-24 2001, Sitges/Barcelona | |
| MicroTech 2001 (IMAPS-UK/ CPMT-UK) | Jan 29-31 2001, London UK | IMAPS-UK Secretariat, Office@imaps.org.uk |
| Military and Space Electronics Conference and Exhibition Co-op (Previously: Commercialization of Military and Space Electronics International Workshop) | February? Los Angeles | Leon Hamiter lhamiter@cti-us.com |
| Wafer Level Packaging Workshop | 9-11 March 2001, Braselton GA | |
| Int'l Symposium on Advanced Packaging Materials | March 11-14, 2001, Braselton, GA USA | |
| IEEE Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium | March 20-22, 2001, San Jose, CA USA | |
| IEEE EuroSim-E 2001: 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics | 9-11 April 2001, Paris, France | Mr. Olivier de Saint Leger; email compete@mta.fr |
| 2001 International Conference on Electronics Packaging (ICEP) [formerly IEMT/IMC Symposium] | April 18-20, 2001 Tokyo Ryutsu Center, Japan | Secretariat 2001 ICEP Imaps-j@jiep.or.jp |
| Advanced Semiconductor Manufacturing Conference | April 24-26, 2001 Munich, Germany | Kathleen Hauwaert (SEMI) khauwaert@semi.org |
| Symposium on Design, Test, Integration & Packaging (DITP 2001) of MEMS/MOEMS | 25-27 April 2001 Cannes, France | A. Tay mpetayao@nus.edu.sg or J. Walker jwalker@tellium.com |
| 24th International Spring Seminar on Electronics Technology (ISSE) | May 5-9, 2001 Calimanesti-Caciulata, Romania | Paul Svasta isse01@cadtieccp.pub.ro |
| Systems Packaging Committee (TC-14) Spring Packaging Workshop | 8-10 May 2001, Scottsdale, AZ USA | |
| 5th IEEE Workshop on Signal Propagation in Interconnects (SPI) | 13-16 May 2001, (Cavallino) Venice, Italy | Ivan Maio maio@polito.it, Flavio Canavero canavero@polito.it |
| Electronic Components and Technology Conference (ECTC), The premiere components, materials and packaging conference | May 29 - June 1, 2001, Lake Buena Vista (Orlando), FL USA | |
| 4th International Symposium on Electronic Packaging Technology (ISEPT) | August 13-18 2001, Beijing, China | Prof Jusheng Ma temptm@mail.tsinghua.edu.cn |
| Advanced Semiconductor Manufacturing Conference and Workshop | September ???? Boston, MA | Margaret Kindling (SEMI) |
| 8th Annual IEEE/DPC Napa KGD Packaging & Test Workshop | September 9-12, 2001; Napa Valley, CA |
Larry Gilg (512)338-3748 gilg@mcc.com http://www.napakgd.com/Napa_Workshop/Napa_agenda.pdf |
| Holm Conference on Electrical Contacts | 10-12 September, 2001; Montreal, Quebec, Canada |
Gerry Witter wittergd@aol.com 847-244-6025/fax 847-244-6041 |
| 7th International (THERMINIC) Workshop on Thermal Investigations of ICs & Systems | September 24-27 2001, Paris, France | Bernard Courtois Therm2001@imag.fr |
| IEEE International Symposium on Semiconductor Manufacturing (ISSM 2001) | 8-10 October 2001, San Jose, CA USA | Suzanne Harkness |
| Future Directions in IC and Package Design Workshop | October 27, 2001, Cambridge, MA USA | Paul Baltes epd@engr.arizona.edu |
| 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP) | October 29-31 2001, Cambridge, MA | Paul Baltes epd@engr.arizona.edu |
| POLYTRONIC 2001 (1st International IEEE Conference on Polymers & Adhesives in Microelectronics & Photonics) incorporating Adhesives, PEP & POLY | October 21-24 2001, Potsdam, Germany | Rolf Aschenbrenner polyorg@izm.fhg.de |
| International Electronics Manufacturing Technology (IEMT) Symposium Cancelled | November 12-13, 2001, Santa Clara, CA USA | Ken Schramko kschramko@semi.org |
| Area Array Packaging Workshop | November 12-14 2001, Munich, Germany | elke.zakel@ieee.org |
| 3rd International Conference of Electronics Materials and Packaging (EMAP) | 19-22 November 2001, Jeju Island , Korea | Soon-Bok Lee, General Chair; KAIST (sblee@mail.kaist.ac.kr) |
| 2nd International Conference on Advances in Electronics Packaging (APACK 2001) | December 5-7 2001, Singapore | Stephen Wong samantha@gintic.gov.sg |
| IEEE Microelectronics Reliability & Qualification Workshop (MRQ) | December 11-12 2001, Los Angeles | James Weiler James.C.Weiler@jpl.nasa.gov |
2000 IEEE Computer Packaging Japan Workshop:
January 24-26, 2000, Hikone, Japan;
Website; Advance Program.
Second International Workshop on Chip Package Co-Design (CPD2000):
"Next Generation Systems Design: From Serial to Parallel"
March 14-16, 2000, Zürich, Switzerland;
Website; Call for Papers.
International Symposium on Advanced Packaging Materials:
Processing, Properties and Interfaces:
March 6-8, 2000, Braselton, GA USA;
Call for Papers.
IEEE Semiconductor Thermal Measurement and Management
(SEMI-THERM) Symposium
(March 21-23, 2000 , San Jose, CA) Call for Papers, Advance Program, Registration.
Int'l Electronics Manufacturing Technology (IEMT) Europe 2000 Symposium
April 6-7, 2000, Munich, Germany;
Website; registration information.
IEEE Computer Society/CPMT Spring Packaging Workshop
May 2-4, 2000, Indian Wells, CA, USA;
Website; Call for Papers.
23rd International Spring Seminar on Electronics Technology (ISSE 2000):
Networking Electronics Packaging Education
May 6-10, 2000, Balatonfüred, Hungary;
Website; Call for Papers.
Intersociety Conf on Thermal Phenomena (I-THERM2000)
May 23-26, 2000, Las Vegas, NV USA (co-located with the ECTC);
Website; Call for Papers;
past Proceedings
Workshop on VLSI and Microsystem Packaging Techniques and Manufacturing
Technologies
May 8-9, 2000, Cork, Ireland;
Call for Papers.
Adhesives in Electronics '2000
June 18-21, 2000, Helsinki, Finland;
website; Call for Papers.
Int'l Workshop on Integrated Power Packaging (IWIPP)
July 14-15, 2000, Waltham, MA USA;
website; Advance Program.
Electronics Goes Green 2000+
September 11-13, 2000, Berlin, Germany;
website; Advance Program.
46th Holm Conference on Electrical Contacts
September 25-27, 2000, Chicago, IL USA;
website; Advance Program.
Workshop on Accelerated Stress Testing (AST'2000)
October 2 - 4, 2000, Boulder, Colorado;
website; Call for Papers.
2nd IEEE Optoelectronics Packaging Workshop (OEP 2000)
October 4-6, 2000, Coeur D' Alene, Idaho USA;
website, Call for Papers.
9th Topical Meeting on Electrical Performance of
Electronic Packaging (EPEP '00)
October 23-25, 2000, Phoenix, Arizona USA;
Advance Program, registration information.
3rd Int'l Conference on Smart Card Technologies and Applications
November, 27 - 29, 2000 (after Electronica), Berlin, Germany:
Call for Papers.
International Symposium on Electronic Materials and Packaging
Nov 30-Dec 2, 2000, Kowloon, Hong Kong;
Call for Papers and information.
Workshop on Polymeric Materials for Microelectronics & Photonics Applications,
Dec 3-6, 2000, London, England;
Final Program, Registration Information.
Workshop on VLSI Chip Packaging
Dec 4-6, 2000, Kyoto, Japan;
Call for Papers (.doc file, 14 kB).
3rd Electronic Packaging Technology Conference (EPTC '2000)
Dec 5-7, 2000, Singapore;
Advance Program, Registration Information.
IEEE European Systems Packaging Workshop
January 25th - 27th 1999, Cork, Ireland:
Website;
Announcement
Commercialization of Military and Space Electronics
Feb. 7-10, 1999, Los Angeles, CA USA:
Website; Final Program
IEEE Semiconductor Thermal Measurement and Management
(SEMI-THERM) Symposium
(March 9-11, 1999, San Diego) Advance Program, Registration.
1999 Spring Systems Packaging Workshop
(April 14-16, 1999, Austin, TX) Preliminary Announcement,
registration information.
1999 MCM Applications Workshop
(June 23 - 25, 1999, Newport, Rhode Island) Preliminary Announcement,
registration information.
The 18th International Conference on
Thermoelectrics (ITC'99),
August 29 - September 2, 1999, Baltimore, MD USA:
Website; Call for Papers
IEEE CPMT & LEOS Workshop on Fiber-Optics, Optoelectronics, Photonics Assembly, Packaging and Manufacturing Technology,
Sept. 15-17, 1999,
Vail Cascade Hotel & Club, Vail, Colorado
45th HOLM Conference on Electrical Contacts
October 3-7, 1999, Pittsburgh, PA, USA:
Website; Final Program; registration.
PEP'99: Second International IEEE Symposium on
Polymeric Electronics Packaging
October 24-28, 1999, Gothenburg, Sweden:
Website; Call for Papers
5th International Workshop on
Thermal Investigations of ICs and
Microstructures (THERMINIC'99),
October 4-6, Roma, Italy:
Call for Papers
8th Topical Meeting on
Electrical Performance of Electronic Packaging (EPEP'99)
October 25-27, 1999, San Diego, CA, USA:
Website; Final Program/Registration
2nd Annual Microelectronics Reliability and Qualification Workshop
October 26-27, 1999, Pasadena, CA, USA:
Website; Final Program/Registration
AST'99: Accelerated Stress Testing Workshop
October 26-28, 1999, Boston, MA, USA:
Website; Call for Papers
Mechanics, Physics, and Reliability of Polymeric Materials
for Microelectronics and Photonics Applications (POLY'99),
Second Annual, December 12-15, 1999, Paris, France:
Website; Call for Papers
IC/Package Design Integration
Conference (Feb. 2-3, 1998): Advance Program (Website inactive; no past Proceedings)
IEEE Semiconductor Thermal Measurement and Management
(SEMI-THERM) Symposium
(March 10-12, 1998):
Website and Past Proceedings.
Workshop
on Chip Package Co-Design (CPD '98)
March 24-26, 1998, Zürich, Switzerland:
Website (past Proceedings
available from Conference).
Workshop on VLSI and Microsystem Packaging Techniques and Manufacturing
Technologies
May 4-5, 1998, Brugge, Belgium:
(no website; no past proceedings).
The Electronic Components
and Technology Conference (ECTC), was held May 25-28, 1998 in Seattle.
The Proceedings, in the form of the familiar book and also in a new CD-ROM are now available.
Our International Electronics Manufacturing Technology (IEMT)
Symposium was held in
Berlin, April 27-29, 1998.
Intersociety Conf on Thermal Phenomena (I-THERM '98)
May 27-30, 1998, Seattle, WA USA (held immediately after the ECTC);
Website; Final Program;
copy of Proceedings
International Non-Volatile Memory Technology Conference (INVMTC)
June 22-24, 1998, Albuquerque, New Mexico, USA;
Website; Advance Program, Exhibitor Information, Registration forms
Workshop on Accelerated Stress Testing,
September 22-24, 1998, Pasadena, CA, USA:
Website; Call for Papers
Adhesives in Electronics '98
September 27-30, 1998, Binghamton NY, USA:
Website; Call for Papers
7th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP'98)
October 26-28, 1998, West Point, NY, USA:
Website; Final Program/Registration
44th IEEE Holm Conference on Electrical Contacts
October 26-28, 1998, Arlington, VA, USA:
Final Program/Registration
Reliability of Polymeric Materials: Plastic Packages of IC Devices (POLY'98)
November 29 - December 3, 1998, Paris, France:
Website
Fourth VLSI Packaging Workshop of Japan
November 30 - December 2, 1998, Kyoto, Japan:
Advance Program & Registration Information
2nd Electronics Packaging Technology Conference (EPTC'98)
December 8-10, 1998, Singapore:
Website; Call for Papers
|
CPMT's Home Page |
Conference Proceedings |
Begin your CPMT membership |
|
Technical Committees |
CPMT Journals |
Email to Webmaster |
Revised 25 January 2004