The CPMT Society -- Who We Are
The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacture.
The Components, Packaging, & Manufacturing Technology (CPMT) Society is a volunteer organization. Our Charter, as for all societies of the IEEE, is to advance the interests of our profession. You become a member of CPMT by first joining the IEEE , and then paying the additional $10 fee to become a CPMT member. An alternate path to membership, open to those individuals belonging to other major scientific or engineering societies, is to affiliate directly with CPMT. The following is an overview of the organization.
The Operating Committee (OpCom) of CPMT consists of the President; five Vice Presidents (Technical, Administrative, Conferences, Publications, and Education); the Treasurer; and the Secretary. Eighteen at-large Board of Governors members are elected by the CPMT membership for overlapping three- year terms (six elected each year). There are fourteen Technical Committees (TC's), organized to pursue the varied fields covered by CPMT. In addition, there are many other standing and ad hoc committees: for conferences, standards, chapter development, membership, international relations, bylaws, etc.
Many of our members belong to local chapters of CPMT. We have chapters in the U.S., Canada, Japan, China, Korea, Singapore, Taiwan, and throughout Europe. These entities sponsor local meetings, courses, and workshops.
The officers, elected members, committee chairs, and chapter chairs, together make up the Board of Governors. This body meets three times a year to formulate society policy, vote on expenditures, and act as a general forum. Between meetings, the OpCom conducts pressing business.
The above structures enable us to serve our members in a way that advances their technical and professional interests. CPMT sponsors 25-30 conferences per year throughout the world, and publishes Proceedings for many of these conferences. We publish three quarterly Transactions and a quarterly NEWSLETTER, and we also negotiate discounts for IEEE members on books of interest to the membership. We administer fellowships and provide seed money for conferences, chapters, and new publications.
To carry on these and other activities, the society is always looking for new members for its committees. Membership in these committees can involve as much or as little time as you wish to put into it, and need not involve travel. Do you consider your work to be not just your job, but your profession? Are you interested in the advancement of your profession? Would you benefit from the opportunity to broaden contacts with your peers at other companies and around the world? If so, I would encourage you to contact any of the officers , to discuss opportunities for a position in the CPMT Society.
CPMT Fields of Interest:
The CPMT Society's objectives are to provide a forum for the dissemination of technical information within its assigned areas. CPMT's fields of interest encompass the materials science, chemical processes, reliability technology, mathematical modeling, education and training utilized in the design and production of discretes, hybrids, and electronic packaging. Also included are fiber optics, connector technology, and semiconductor processing. Manufacturing technology includes systems, concepts, management, and quality as they relate to electronic component manufacturing.Components
Most of the Society's components activities are in the passive component field, e.g. the development of novel chip-based inductors, the reliability testing of new ceramic capacitor materials, the application of contact theory to sliding connectors and pin insertion, the integration of de-coupling capacitors into printed wiring board (PWB) structures, etc. Developments and results in this field are reported in the IEEE Transactions on Components and Packaging Technologies. The multichip module (MCM) is a very high technology component, and many CPMT members work on the design, manufacture, and test of such components for aerospace and high-speed computer applications. Within CPMT, the "components" field covers the broad scope of component technologies, and in many cases the Society cooperates with others where their interests overlap. It maintains an active role in semiconductor component engineering at the chip level in a number of specific areas, especially in semiconductor device manufacturing, for example, with its co-sponsorship of the IEEE Transactions on Semiconductor Manufacturing, and in other areas by conference support. But it is with the packaging of the die, as described in more detail below, and with the assembly of such devices in sub-systems such as printed wiring boards, as part of the manufacture of complete electronic systems, that the CPMT Society can claim responsibility for the broadest possible range of component design, manufacture, and application technologies. Packaging
The pace of microelectronics development at the chip level has out-stripped the capacity of the package to match the chip performance and carry it through to the system level. A simple example can make the point. Assume that over a period of time we can fabricate devices of half the area previously achievable, in chips of twice the previous size, giving four times the number of circuits per device, four times the power dissipation, and about twice as many leads required. For the same peripheral-lead package size, the leads must be closer together and thinner, producing increased inductance and crosstalk and a greater probability of fatigue failure, exacerbated by the higher power dissipation, which also creates higher mechanical stress in the package. And in a CMOS digital system, if one also takes advantage of the clock frequency increase possible with smaller devices, these problems increase even more. The example demonstrates that the semiconductor device package has become the bottleneck to the transfer of silicon capabilities to system performances. The obvious consequence of this development is the economic significance of packaging technologies to microelectronics industries (e.g. IBM, Motorola). Obviously the increasing importance of component packaging to industry also drives a growing need for engineering graduates with experience in the field. And the IEEE Transactions on Advanced Packaging reports developments for those engineers active in packaging development.
Electrical engineers in the packaging field are often primarily concerned with the electrical effects of shrinking device sizes and faster operation, i.e. pulse reflections on the "transmission line" interconnections, crosstalk, stray inductance, switching noise, electromagnetic compatibility (EMC), etc. These effects are the reason why the microelectronics industry is moving to lower power supply voltages, reducing noise margins which are already threatened by the increased noise levels. But notice that the traditional academic fields represented in the example above include electrical, mechanical, thermal, and materials engineering, to which one can add reliability, chemistry, applied physics, and math. The true "packaging engineer" needs a more multi-disciplinary background than is conventionally found in a single undergraduate major, and well-prepared graduates are therefore hard to find and are in demand. Electronics Packaging courses are only now starting to be found at the senior elective level, instead of just in graduate programs, and clearly more BS graduates will find jobs in this increasingly important field in the future. The best preparation for an EE student would be dual concentrations in Microelectronics (Materials & Devices) and Electromagnetism (Guided Waves), supplemented by a solid sophomore base (or more advanced) in Materials, Statics (Strength of Materials), Heat Transfer, etc. Packaging graduates also find jobs in Aerospace companies (e.g. Lockheed Martin), in the Computer field (e.g. Sun Microsystems), in Communications (e.g. Nokia or Ericsson), in the more recent optoelectronics device area (e.g. Lucent Technologies), etc.
Who Benefits? As an engineer/scientist, technologist, or student concerned with the advancement of electronic components, packaging, or manufacturing technology, you will benefit by joining or affiliating with the IEEE's CPMT Society. Through participation in Society activities you will strengthen your individual role in our profession, as well as enhance your company's reputation. When you contribute to the dissemination of technical knowledge, you contribute to society as a whole and enhance the engineering profession.
CPMT Programs and Services: CPMT offers a variety of member services: publications, specialized technical committees, chapters, conferences, educational opportunities, awards and fellowships. Join CPMT now and participate in these activities with your fellow professionals. You will be glad you did!