Topics: Thermal packaging

Topics: Reliability stress testing; Emerging technologies in communication and Internet as they drive packaging; Engineering education in developing countries

Topics: 3D Integration, Advanced Substrates

Topics: Semiconductor and Electronics Industry Trends and Roadmap

Topics: Semiconductor devices physics, reliability and processing

Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems

Topics: 3DIC and 3D Packaging Application, Design and CAD; I/O Macromodeling, including IBIS; High-Speed, Low Power Chip to Chip Communications.

Topics: Thin film technology; IC packaging and interconnect; Microelectronic materials; 3D-IC integration

Topics: Wire Bond Packaging, Reliability in all Temperature Ranges/Conditions

Topics: Extreme Environment Electronics

Topics: Signal integrity issues including electronic noise; Electrical modeling of packaging structures

Topics: New interconnection and packaging technologies; Reliability of electronics

Topics: Electronics and Photonics 2D and 3D packaging and manufacturing

Topics: Photonics in: Communications, Displays, OLEDs, HBLEDs, Diode and Nondiode Lasers, Sensors, Industrial Applications, Consumer Products, Wireless Products, Plastics, Nanotechnology, Solar and PV, and Solid State Lighting.

Topics: Lead-free soldering including solder alloys, surface finishes, components, substrates, and other materials; Processes, reliability, failure modes, and troubleshooting; Advanced applications including packaging, and ultra-fine pitch applications

Topics: Solder Joint Reliability, 3D Packaging, and Through Silicon Via Technologies

Topics: Micro and nano-electronic electrically conductive adhesives

Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies

Topics: Electrically conductive adhesives (ACF, NCF, ACP, NC)

Topics: Accelerated Stress Testing, Power Supply Reliability

Topics: Prognostics and reliability of electronic products and systems

Topics: Flip Chip Issues/Technology; Area Array (1st & 2nd Level) Issues/Technology; Lead-free Issues/Technology

Topics: Thermal management of electronic systems; Thermal optimization of 3D chip stacks; Thermal interface materials for electronic systems; Optimized thermal management of data centers

Topics: Packaging, PCB Assembly, Solder Interconnect Reliability, Lead-free Solder

Topics: Accelerated Ageing for Reliability Assurance - theory and practical methods - including HAST (my invention originally); The use of encapsulation and plastic packaging and reliability evaluation method; PCB & Hybrid technologies; Thermal management and design.

Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations.

Topics: Memory testing; ESD control in manufacturing, Failure analysis of ICs; Reliability of IC packages – design and process; Total quality management

Topics: Flip Chip Technologies – on organic substrates, low temperature joining, barriers and future direction; Built-up Substrate Technologies – fine pitch line fabrication, barriers, and future direction

Topics: Electronics Packaging

Topics: Emerging Technology, Advanced Lithography, Nanotechnology, Nano manufacturing, Nanomaterials, Environmental issues of Nanotechnology, Business Requirements of Nanotechnology.

Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging

Topics: Using Xplore, and Google Scholar to Mine IEEE's On-line Repository of Technical Information.

Topics: Polymers for Electronic and Photonic Applications, Packaging Materials and Assembly and Nano Functional Materials.

Topics: Alternative energy and energy avoidance; Innovation issues

Topics: Thermal management technologies; Embedded passive component technologies; Chip to chip optical interconnection technologies