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CPMT's Distinguished Lecturer Program

Your CPMT Society maintains a Distinguished Lecturer program, with key technologists available to give talks in various venues.


- These speakers are 'Fellow Caliber' members of our technical community;
- They are available for any CPMT (co)-sponsored venue;
- CPMT travel assistance of up to $1,000 may be available:
    - Requires inability of requesting organization and/or
        DL's employer to pay;
    - Any honoraria must first be used for travel expenses;
    - CPMT travel assistance is the last-used source
        of travel money.

To schedule a Distinguished Lecturer, contact the Distinguished Lecturer directly or contact the Program Director, Kitty Pearsall, CPMT VP of Education. (The DL him/herself should report all DL talks to Kitty Pearsall and Marsha Tickman -- whether or not travel assistance was requested/granted -- for our annual report.)

Also, contact the Program Director for details and approval.

 

Distinguished Lecturer Distinguished Lecturer (cont)
DL Program Director
Kitty Pearsall
IBM Corp.
100 Ridgewood Drive
Georgetown, Texas 78628 USA
Ph: +1-512-838-7215
Email: kittyp@us.ibm.com
Avram Bar-Cohen, Ph.D.
2181B Glenn L. Martin Hall
Department of Mechanical Engineering
University of Maryland
College Park, Maryland 20742 USA
Phone: 301-405-3173
Email: abc@umd.edu
Topics: Thermal packaging
H. Anthony Chan, Ph.D.
Huawei Technologies
1700 Alma Drive
Plano, TX 75093
Phone: 972-543-5806
Email: h.a.chan@verizon.net
Topics: Reliability stress testing; Emerging technologies in communication and Internet as they drive packaging; Engineering education in developing countries
Rajen Chanchani, Ph.D.
MS 1076, Org. 01715
Sandia National Labs
P.O. Box 5800 / Albuquerque, NM 87185 USA
Tel.: 505-844-3482
Email: chanchr@sandia.gov
Topics: 3D Integration, Advanced Substrates
William T. Chen, Ph.D.
ASE (U.S.) INC
3590 Peterson Way
Santa Clara, CA 95054 USA
Cell: 408 250 4290
Email: william.chen@aseus.com
Topics: Semiconductor and Electronics Industry Trends and Roadmap
Badih El-Kareh, Ph.D.
President, PIYE Company
2507 Ben Doran Court
Cedar Park, Texas 78613 USA
Phone: 512-219-9104
Email: bek@ieee.org
Topics: Semiconductor devices physics, reliability and processing
Xuejun Fan, Ph.D.
Department of Mechanical Engineering
Lamar University, PO Box 10028
Beaumont TX 77710 USA
Phone: 409-880-7792
Email: xuejun.fan@lamar.edu
Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems
Paul D. Franzon, Ph.D.
NC State University
ECE, Box 7911
Raleigh, NC 27695 USA
Tel.: 919-515-7351
Email: paulf@ncsu.edu
Topics: 3DIC and 3D Packaging Application, Design and CAD; I/O Macromodeling, including IBIS; High-Speed, Low Power Chip to Chip Communications.
Philip Garrou, Ph.D.
Microelectronic Consultants of North Carolina
Research Triangle Park, NC USA
Phone: 919-604-7798
Email: philgarrou@att.net
Topics: Thin film technology; IC packaging and interconnect; Microelectronic materials; 3D-IC integration
George G. Harman, Ph.D.
NIST Scientist Emeritus (Ret)
National Institute of Standards and Technology
Semiconductor Electronics Division
Gaithersburg, MD 20899 USA
Tel.: 301-975-2097
Email: g.harman@ieee.org
Topics: Wire Bond Packaging, Reliability in all Temperature Ranges/Conditions
R. Wayne Johnson, Ph.D.
Auburn University
162 Broun Hall/ECE Dept.
Auburn, AL 36849 USA
Tel: 334-844-1880
Email: johnsr7@auburn.edu
Topics: Extreme Environment Electronics
George A. Katopis, Ph.D.
IBM Corporation, Systems Group
2455 South Road (P310)
Poughkeepsie, NY 12601 USA
Phone: 845-435-6719
Email: katopis@us.ibm.com
Topics: Signal integrity issues including electronic noise; Electrical modeling of packaging structures
Jorma Kalevi Kivilahti, D.Sc.
Helsinki University of Technology (HUT)
Department of Electrical and Communications Engineering
P.O. Box 3000, Otakaari 5A, 02015 TKK, Finland
Phone: 358 0 4512715
Email: jorma.kivilahti@hut.fi
Topics: New interconnection and packaging technologies; Reliability of electronics
John H. Lau, Ph.D.
Hong Kong University of Science and Technology
Clear Water Bay, Kowloon, Hong Kong
Email: johnlau@ust.hk
Topics: Electronics and Photonics 2D and 3D packaging and manufacturing
Michael Lebby, Ph.D
OIA
1133 Connecticut Ave., NW
Washington, DC 20036 USA
Tel.: 202-785-4426
Email: lebby@oida.gov
Topics: Photonics in: Communications, Displays, OLEDs, HBLEDs, Diode and Nondiode Lasers, Sensors, Industrial Applications, Consumer Products, Wireless Products, Plastics, Nanotechnology, Solar and PV, and Solid State Lighting.
Ning-Cheng Lee, Ph.D.
Indium Corporation of America
34 Robinson Road, Clinton, NY 13323 USA
Phone: +1 (315) 381-7613
Email: nclee@indium.com
Topics: Lead-free soldering including solder alloys, surface finishes, components, substrates, and other materials; Processes, reliability, failure modes, and troubleshooting; Advanced applications including packaging, and ultra-fine pitch applications
S. W. Ricky Lee, Ph.D.
Center for Advanced Microsystems Packaging
Hong Kong University of Science and Technology
Clear Water Bay, Kowloon, Hong Kong
Tel: +852-23587203
Email: rickylee@ust.hk
Topics: Solder Joint Reliability, 3D Packaging, and Through Silicon Via Technologies
Johan Liu, Ph.D.
SMIT Center and Bionano Systems Laboratory
Dept of Microtechnology and Nanoscience (MC2)
Chalmers University of Technology
Kemivägen 9, MC2 Building Room A517
Se 412 96 Gothenburg, Sweden
Phone: +46-31-772 3067
Email: jliu@chalmers.se
Topics: Micro and nano-electronic electrically conductive adhesives
James E. Morris, Ph.D.
Department of Electrical and Computer Engineering
Portland State University
P.O. Box 751
Portland, Oregon 97207 USA
Phone: 503-725-9588
Email: jmorris@cecs.pdx.edu
Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies
Kyung W. Paik, Ph.D.
Korea Advanced Institute of Science & Technology
KAIST Dept. of MS&E
Yusung-Gu Gusung-Dong 373-1, Daejon, Korea
Phone: 82-42-869-3335
E-mail: kwpaik@kaist.ac.kr
Topics: Electrically conductive adhesives (ACF, NCF, ACP, NC)
T. Paul Parker
Lineage Power
3000 Skyline Drive
Mesquite, Texas 75149 USA
Tel.: 972-284-2295
Email: paul.parker@lineagepower.com
Topics: Accelerated Stress Testing, Power Supply Reliability
Michael Pecht, Ph.D.
University of Maryland
CALCE Electronic Products and Systems Center
College Park, MD 20742 USA
Phone: 301-405-5323
Email: pecht@calce.umd.edu
Topics: Prognostics and reliability of electronic products and systems
Karl J. Puttlitz, Ph.D.
Puttlitz Engineering Consultancy, LLC
21 Central Avenue
Wappingers Falls, N.Y. 12590 USA
Phone: 845-297-0716
E-Mail: kjputtlitz@aol.com
Topics: Flip Chip Issues/Technology; Area Array (1st & 2nd Level) Issues/Technology; Lead-free Issues/Technology
Bahgat Sammakia, Ph.D.
Department of Mechanical Engineering
State University of New York
Phone: 607-777-6880
Email: bahgat@binghamton.edu
Topics: Thermal management of electronic systems; Thermal optimization of 3D chip stacks; Thermal interface materials for electronic systems; Optimized thermal management of data centers
Dongkai Shangguan, Ph.D.
Vice President & Sr. Technical Fellow, Technology Leadership Group
Flextronics
2090 Fortune Drive
San Jose, CA 95131 USA
Tel.: 408-428-1336
Email: dongkai.shangguan@flextronics.com
Topics: Packaging, PCB Assembly, Solder Interconnect Reliability, Lead-free Solder
Nihal Sinnadurai, Ph.D.
Bligh Manor
The Ferry
Felixstowe
Suffolk IP11 9RZ UK
Mobile: +44 7803 182769
email: sinnadurai@aol.com
Topics: Accelerated Ageing for Reliability Assurance - theory and practical methods - including HAST (my invention originally); The use of encapsulation and plastic packaging and reliability evaluation method; PCB & Hybrid technologies; Thermal management and design.
Ephraim Suhir, Ph.D.
727 Alvina Court
Los Altos, CA 94024 USA
Tel.: 650-969-1530
Email: suhire@aol.com
Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations.
Yong-Khim Swee
FeRmi Pte Ltd – powering RFID
30 Biopolis St.
138671 Singapore
Phone: +65-64788779
Email: sweeyk@fermi.com.sg
Topics: Memory testing; ESD control in manufacturing, Failure analysis of ICs; Reliability of IC packages – design and process; Total quality management
Yutaka Tsukada, Ph.D.
IPP-iPACKS representative
2093-97 Bodaiji, Konan-city, Shiga-pref. 520-3243 Japan
Phone: 81-90-5602-8324
Email: yutsukada@aol.com
Topics: Flip Chip Technologies – on organic substrates, low temperature joining, barriers and future direction; Built-up Substrate Technologies – fine pitch line fabrication, barriers, and future direction
Rao Tummala, Ph.D.
Director, Microsystems Packaging Research Center (PRC)
Joseph M. Pettit Chair Professor in Microsystems Packaging
Georgia Institute of Technology
813 Ferst Drive, NW
Atlanta, GA 30332 USA
Tel.: 404-894-9097
Email: rao.tummala@ece.gatech.edu
Topics: Electronics Packaging
Walter Trybula, Ph.D.
Trybula Foundation, Inc.
4621A Pinehurst Drive South
Austin, TX 78741 USA
Tel.: 512.356.3306
Nanomaterials Application Center – Texas State University
San Marcos, TX 78666 USA
Email: w.trybula@ieee.org
Topics: Emerging Technology, Advanced Lithography, Nanotechnology, Nano manufacturing, Nanomaterials, Environmental issues of Nanotechnology, Business Requirements of Nanotechnology.
E. Jan Vardaman
President, TechSearch International, Inc.
4801 Spicewood Springs Rd., Suite #150
Austin, TX 78759 USA
Phone: 512-372-8887
Email: jan@techsearchinc.com
Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging
Paul Wesling
12250 Saraglen Dr.
Saratoga, CA 95070 USA
Tel.:408-331-0114
Email: p.wesling@ieee.org
Topics: Using Xplore, and Google Scholar to Mine IEEE's On-line Repository of Technical Information.
CP Wong, Ph.D.
Regents Professor and Charles Smithgall Institute Chair
School of Materials Science & Engineering
771 Ferst Drive
Atlanta, GA 30332 USA
Tel.: 404-894-8391
Email: cp.wong@mse.gatech.edu
Topics: Polymers for Electronic and Photonic Applications, Packaging Materials and Assembly and Nano Functional Materials.
Ralph W. Wyndrum Jr., Ph.D.
CEO Executive Engineering Consultants
2009 Board Chairman, American Ass'n
of Engineering Societies, Washington DC
President, IEEE-USA Innovation Institute
35 Cooney Terrace
Fair Haven , NJ 07704 USA
Phone: 732-219-0005
Email: r.wyndrum@ieee.org
Topics: Alternative energy and energy avoidance; Innovation issues
Kishio Yokouchi, Ph.D.
Fujitsu Interconnect Technologies Ltd.,
36 Kita-Owaribe, Nagano City, Nagano 381-8501 Japan
Phone: +81-26-263-2711
Email: kyokouchi@jp.fujitsu.com
Topics: Thermal management technologies; Embedded passive component technologies; Chip to chip optical interconnection technologies

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