Your CPMT Society maintains a Distinguished Lecturer program, with key technologists available to give talks in various venues.

• These speakers are "Fellow Caliber" members of our technical community
• They are available for any CPMT (co)-sponsored venue
• CPMT travel assistance of up to $1,000 may be available:
  • Requires inability of requesting organization and/or DL's employer to pay,
  • Any honoraria must first be used for travel expenses,
  • CPMT travel assistance is the last-used source of travel money,
  .
• To schedule a Distinguished Lecturer, contact the Distinguished Lecturer directly or contact the Program Director, Dr. Albert F. Puttlitz, CPMT VP of Education.
• Also, contact the Program Director for details and approval.

DL Program Director

Distinguished Lecturers (cont)

Albert F. Puttlitz 7 Arcadia Circle Jericho,VT 05489 USA 802-899-4692 (O) 802-879-0466 (Fax-weekdays/daytime) 802-899-4692 (Fax-evenings/weekends) Distinguished Lecturers Avram Bar-Cohen 2181B Glenn L. Martin Hall Department of Mechanical Engineering University of Maryland College Park, Maryland 20742 USA 301-405-3173 (O) 301-314-9477 (Fax) Topic: Thermal Packaging H. Anthony Chan San Jose State University Electrical Engineering Department One Washington Square San José, CA 95192 408-924-3656 (O) Topic: Reliability Stress Testing Badih El-Kareh Texas Instruments Deutschland M/S 4297; Haggertystr. 1 D - 85356 Freising, Germany +49 8161 80 4202 (or 4776) (O) +49 (0) 174 973 5572 (Mobile) +49 8161 80 3350 (FAX) Topic: Semiconductor Devices Physics & Processing Paul Franzon NC State University 919-515-7351 Topic: Technology and Design of Complex Systems Incorporating VLSI, MEMS, Advanced Packaging, Optoelectronics and Nanotechnology; Future Perspectives in Signal Integrity, Design and Management George Katopis IBM Corporation 522 South Road Poughkeepsie, NY 12601 USA Tel: 914-435-6719 Fax: 914-435-1593 Topic: Third Generation Signal Integrity Tools and Issues John H. Lau Agilent Technologies, Inc. 961 Newell Road Phone: 408-553-2358 Fax: 408-246-5925 Topic: Electronics and Photonics Packaging and Manufacturing Michael Lebby Ignis Optics, Inc 482 West San Carlos Street San Jose CA 95110 USA 408-869-8484 (O) Topics: Optical Components Technology; Optical Networking Trends and Technology; Business and Technology aspects of Optical Networking Luc Martens INTEC University of Gent Sint-Pietersnieunstratt 41 900 Gent, Belgium Tel: 32-90264-3333 Topics: High Freqency Measurement Techniques for Characterization of Electrical Testing, Advanced Testing for Electronic Interconnections and Packaging in High-Speed Systems James E. Morris Dept of Electrical & Computer Engineering Portland State University P. O. Box 751 Portland, OR 97207-0751 USA 503-725-9588 (O) 503-725-3806 (ECE Office) 503-725-3807 (Fax) Topics: Electrically conductive adhesives; Electronics packaging T. Paul Parker Tyco Electronics Power Systems 3000 Skyline Dr. Mesquite, TX 75149 USA 972-284--2295 (O) (972 284-8282 (Fax) Topic: Reliability and Stress Testing

Michael Pecht University of Maryland CALCE Electronic Products and Systems Center College Park, MD 20742 USA 301-405-5323 (O) 301-314-9269 (Fax) Topic: Reliability of Electronic Products and Systems Karl Puttlitz IBM Microelectronics, ZIP 81A Bldg. 330 1580 Rt. 52 Hopewell Junction, NY 12533 USA 845-894-5086 (O) 845-892-6214 (Fax) Topic: Chip Level Packaging John M. Segelken Consultant 2721 Green Meadow Drive Blacksburg, VA 24060 USA 540-961-1685 (O) Topics: Electronics Packaging; Supply Line Engineering Ephraim Suhir 727 Alvina Court Los Altos, CA 94024 USA 650-969-1530 (O) 408-410-0886 (Cell) Topics: The future of microelectronics and photonics, and the role of materials, mechanical and reliability engineering; Accelerated testing in microelectronics and photonics: methodologies, challenges and pitfalls; Accelerated life testing in microelectronics and optoelectronics: its role, attributes, challenges, pitfalls, and interaction with the qualification testing and specifications; Adhesively bonded and soldered assemblies in microelectronics and photonics packaging: predictive modeling and design for reliability; Microelectronic and photonic structures and packages: physical design for reliability; Photonic packaging: physical design for reliability; Thermal stress failures in microelectronics and photonics: modeling, prediction and prevention; Predictive modeling of the mechanical behavior of materials in microelectronic and photonic packaging; Fiber optics structures: design for reliability; Thin film mechanics: modeling and design for reliability; Dynamic response of microelectronics and photonics systems to shocks and vibrations: prediction and optimization; Fundamentals of reliability engineering: probabilistic methods and modeling; Applied probability for engineers: fundamentals and applications; Challenges in engineering: a short course for engineering students and young engineers. Paul Totta IBM Microelectronics, ZIP 4-2B Bldg. 300 1580 Rt. 52 Hopewell Junction, NY 12533 USA (914) 894-2618 (O) (914) 892-6399 (Fax) Topic: Chip Level Packaging Walter Trybula 4621A Pinehurst Drive South Austin, TX 78741 USA +1.512.695.4026 (O) +1-512-282-8648 (Fax) Topic: Factory Automation Topic: Computer Modeling; Advanced Lithography; Nanotechnology Rao Tummala Georgia Institute of Technology Packaging Research Center 813 Ferst Drive, NW Atlanta, GA 30332 USA 404-894-9097 (O); 404-894-3842 (Fax) Topic: Electronics Packaging Paul Wesling 12250 Saraglen Dr Saratoga, CA 95070 USA +1-408-252-9051 (H) Topic: Multimedia Education C. P. Wong Georgia Institute of Technology Material Science Department 771 Ferst Dr. Atlanta, GA 30332 USA 404-894-8391 (O) 404-894-9140 (Fax) Topic: Electronic Materials Ralph W. Wyndrum, Jr 35 Cooney Terrace Fair Haven , NJ 07704 732-219-0005 (O) 732-219-0006 (Fax) Topics: Technology Management; R&D Portfolio Management (decision analysis)