We invite you to use the following modules, created under a variety of grants from the US National Science Foundation (NSF), Georgia Tech's Packaging Research Center, and the CPMT Society. We appreciate also the permission granted to us to host information about other multimedia labs and instructional modules created under other programs.

Our objective is to provide you with lightweight modules that can be easily streamed to users around the world. Some are ideal for use in undergraduate and graduate courses as supplemental material to assist student understanding; others give information to working engineers for understanding and solving problems and implementing new technologies.

Virtual Laboratories Virtual Laboratory for Electronics Packaging Technology - In Europe: T.U. Budapest Site - In North America: CPMT Web Server, USA - In Asia: Use North America site Created by Prof. Ilayfalvi-Vitez and Peter Gordon, this consists of 6 virtual "labs" to allow the student to visualize and simulate the processes for the following: PWB fabrication; Thin-Film technology; Thick-film technology; Laser laboratory; Surface-Mount-Devices laboratory; and Computer-Integrated Manufacturing technology. This is especially useful for Materials Science and EE students who do not have access to a "real" lab for the specified processes. A Professor can assign one or more of these modules as enrichment for students, or select a problem or simulation that can be conducted using knowledge gained from this activity. Interactive Electronics Packaging Laboratory - In Europe: Use North America site - In North America: CPMT Web Server, USA - Alt USA site: Georgia Tech server - In Asia: Use North America site - (This lab works with Netscape and IE, but not necessarily with Firefox; uses QuickTime and Java) Created by Prof. Gary May and Leigh Light, Georgia Tech, this site contains instruction, simulations, and Java applets covering the IC packaging cycle: Process Theory/Steps/Flow; interconnect design/testing; review of all the lab equipment and its operation; and the various process steps: Substrate cleaning, Dielectric deposition, pre-bake, photolithography, curing, etching, and metallization. Sensor Technologies and Applications - In Europe: T.U. Budapest Site - In North America: Use T.U. Budapest site in Europe - In Asia: Use T.U. Budapest site in Europe - (enable browser pop-ups to use this Lab) Created by Prof. Gabor Harsanyi, Budapest University of Technology and Economics, Dept. of Electronics Technology, this Internet course emphasizes theoretical and practical information for the successful design, production and application of sensors in practice. After a short introduction with a summary of the basic definitions, one can begin with a brief overview of three fundamental areas: sensor technologies, transducer structures, and operation principles of various structures. Than the applications of the various sensor types are described. The viewer will find a strong emphasis not only on "what" and "how" but also on "why". This site has wonderful animations and graphics, to assist you in understanding the principles involved.

Internet Courses: Conductive Adhesives for Electronics Packaging - In Europe: Chalmers University Site - In North America: CPMT Web Server, USA - In Asia: Use North America site This 15-hour, 12-chapter multimedia course (video, audio, and Powerpoint slides) deals with fundamentals and applications of using conductive adhesives in electronics packaging applications. We introduce different kinds of conductive adhesives and their conduction mechanisms and principles as well as their thermal and electrical conductivity in comparison with solders. A brief description of various characterization techniques for conductive adhesives is given including DSC, TGA, DMA, TMA, FTIR. Also application techniques of conductive adhesives are discussed as well as process quality aspects. A strong effort is made in the cause in failure mechanism understanding of conductive adhesive joining issues including oxidation/hydration, moisture induced degradation, migration, creep and thermal fatigue. Reliability aspects of conductive adhesive joining in different applications are discussed and a number of applications and their driving forces for these applications are briefly described. The student can download handouts (PDF) of the slides used in the lectures, and can navigate to the particular lectures and slides of interest. Lab "tours" and photos of equipment give a flavor for the processes. For the professor, exercises allow testing of mastery of concepts and computations. Additional Modules The Society has about 8 additional modules, but we need assistance in getting them ready for mounting onto our website. If someone has experience in this area, please contact Paul Wesling, the webmaster.