The 32nd International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Components Packaging and Manufacturing Technology (CPMT) Society of IEEE. IEMT 2007 is being co-organized by the Santa Clara Valley Chapter of CPMT.

Gathering in the relaxed, California atmosphere reminiscent of a campus or retreat center (yet still in the heart of Silicon Valley), we co-locate with the CPMT Society's Advanced Packaging Materials Symposium for several days of learning, networking, and sharing. Attendees pay one conference fee and can build their plans around sessions from both events. A full day of Professional Development Courses supplements the interchanges that are experienced within the conference itself.

Registration is now open -- Download the Advance Program and plan to attend this year's IEMT/APM Symposium!

GOLD SPONSOR: FRIDAY LUNCH SPONSOR:

SILVER SPONSORS:

EXHIBITORS:   70th Anniversary

Join our Platinum, Gold and Silver Sponsors and Exhibitors -- visit our Sponsorship Page

Technical Co-Sponsors:

Santa Clara Valley Chapter

To be added to our Distribution List for future information on IEMT, please send an email note to us: Paul Wesling.

Sponsored by:
Corporate Sponsors:

Int'l Advisory Committee:
Dr. Rolf Aschenbrenner, Fraunhofer IZM, Germany
Dr. Keyun Bi, Chinese Packaging Society, China
Dr. William Chen, ASE, USA
Natarajan (Raj) Chidambaram, Tessolve, India
Bob Chylak, K&S, USA
Prof. Paul Conway, Loughborough Univ, UK
Prof. Wayne Johnson, Auburn University, USA
Dr. John Lau, Institute of Microelectronics, Singapore
Sebastian Liau, ITRI, Taiwan
Ralf Plinenger, Infineon, Germany
HoMing Tong, ASE, Taiwan
Dr. Rao Tummala, Georgia Tech PRC, USA
Charles Vath, ASM, Singapore
Sung Yi, Samsung Electro Mechanics, Korea
Kishio Yokouchi, Fujitsu, Japan
Dr. G.Q. (Kouchi) Zhang, NXP Semiconductors, Netherlands