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- December 1-2: 9th VLSI Packaging Workshop in Japan (VPWJ 2008), Kyoto, Japan (Due May 31)
- December 9-12: 10th Electronics Packaging Technology Conference (EPTC 2008), Singapore (Due May 15)
- December 10-12: Electrical Design of Advanced Packaging and Systems (EDAPS 2008), Seoul, Korea (Due July 31)
- June 14-17, 2009: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy (Due Dec 31)
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Paul Wesling.