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Preface
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| This course will deal with fundamentals and applications
of using conductive adhesives in electronics packaging applications.
Firstly, different kinds of conductive adhesives and their conduction mechanisms and principles as well as their thermal and electrical conductivity in comparison with solders are introduced. A brief description of various characterization techniques for conductive adhesives is given including DSC, TGA, DMA, TMA, FTIR. Also application techniques of conductive adhesives will be discussed as well as process quality aspects. A strong effort is made in the cause in failure mechanism understanding of conductive adhesive joining issues including oxidation/hydration, moisture induced degradation, migration, creep and thermal fatigue. Reliability aspects of conductive adhesive joining in different applications will be discussed and a number of applications and their driving forces for these applications are briefly described. This is followed by a brief description of the electrical conduction, mechanical simulation, high frequency and thermal designing models for conductive adhesives. |
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Johan Liu Professor |
James E. Morris Professor |
