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Editorial--Golden Era for Electronic Packaging Approaching

J. P. Krusius
[p. 2]

Area Array Connections

Redistribution and Bumping of a High I/O Device for Flip Chip Assembly

L. A. Keser, R. Bajaj, and T. Fang
[p. 3]

On Enhancing Eutectic Solder Joint Reliability Using a Second-Reflow-Process Approach

K.-N. Chiang, Y.-T. Lin, and H.-C. Cheng
[p. 9]

Experimental and Theoretical Characterization of Electrical Contact in Anisotropically Conductive Adhesive

Y. Fu, Y. Wang, X. Wang, J. Liu, Z. Lai, G. Chen, and M. Willander
[p. 15]

Package Structures

Ultra-Thin Electronic Device Package

K. Y. Chen, R. L. D. Zenner, M. Arneson, and D. Mountain
[p. 22]

High Performance Chip to Substrate Interconnects Utilizing Embedded Structure

T. A. Juhola, B. Kerzar, M. Mokhtari, and L. F. Eastman
[p. 27]

Optoelectronic Packaging

Design and Development of Optical Fiber Joining Techniques for Efficient Construction of Aerial Distribution Cable Systems

M. Takaya, T. Katagiri, S. Nagasawa, Y. Murakami, and S. Hatano
[p. 36]

Low-Cost, Multi-GHZ Electrical Packaging for Serial Optoelectronic Links Utilizing Vertical Cavity Surface Emitting Lasers

G. J. Fokken, W. L. Walters, L. F. Mattson, and B. K. Gilbert
[p. 42]

Package Performance

Extraction of SPICE-Type Equivalent Circuits of Microwave Components and Discontinuities Using The Genetic Algorithm Optimization Technique

P. L. Werner, R. Mittra, and D. H. Werner
[p. 55]

An Analytical Model of Simultaneous Switching Noise in CMOS Systems

H.-R. Cha and O.-K. Kwon
[p. 62]

Electromagnetic Simulation of Bonding Wires and Comparison with Wide Band Measurements

C. Schuster, G. Leonhardt, and W. Fichtner
[p. 69]

Nondestructive Defect Detection in Multilayer Ceramic Capacitors Using an Improved Digital Speckle Correlation Method with Wavelet Packet Noise Reduction Processing

Y. C. Chan, K. C. Hung, and X. Dai
[p. 80]

The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages

G. E. Ponchak, D. Chun, J.-G. Yook, and L. P. B. Katehi
[p. 88]

Reliability

Characterization of Interfacial Adhesion Damage Induced by Accelerated Life Testing

J. Park, D. G. Harlow, and H. F. Nied
[p. 100]

Reliability of Thick Al Wire Bonds in IGBT Modules for Traction Motor Drives

J. Onuki, M. Koizumi, and M. Suwa
[p. 108]

Cooling

Heat Transfer from Pin-Fin Heat Sinks Under Multiple Impinging Jets

H. A. El-Sheikh and S. V. Garimella
[p. 113]

CORRESPONDENCE

Correction to "Die-Cracking and Reliable Die Design for Flip-Chip Assemblies"

S. Michaelides and S. K. Sitaraman
[p. 121]

ANNOUNCEMENTS

Call for Papers--9th Topical Meeting on Electrical Performance of Electronic Packaging

[p. 122]

IEEE Copyright Form

[p. 127]