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SPECIAL SECTION ON MICROSYSTEMS DESIGN AND PACKAGING

Foreword

T.-R. Hsu

[p. 594]

Packaging Design of Microsystems and Meso-Scale Devices

T.-R. Hsu

[p. 596]

Thermal Issues in Microsystems Packaging

W. Nakayama

[p. 602]

MEMs Post-Packaging by Localized Heating and Bonding

L. Lin

[p. 608]

An Embedded Overlay Concept for Microsystems Packaging

J. T. Butler and V. M. Bright

[p. 617]

Three-Dimensional Packaging Methodologies for Microsystems

G. Kelly, A. Morrissey, J. Alderman, and H. Camon

[p. 623]

CONTRIBUTED PAPERS

Area Array Connections

Study of Self-Alignment of µBGA Packages

K. C. Hung, Y. C., Chan, P. L. Tu, H. C. Ong, D. P. Webb, and J. K. L. Lai

[p. 631]

Mechanical Characterization of Plastic Ball Grid Array Package Flexure Using Moire: Interferometry

E. A. Stout, N. R. Sottos, and A. F. Skipor

[p. 637]

Plastic Strain in Thermally Cycled Flip-Clip PBGA Solder Bumps

E. S. Drexler

[p. 646]

Modeling and Evaluation Criterion for Thermocompression Flip-Chip Bonding

T. S. McLaren and Y.-C. Lee

[p. 652]

Package Structures

Low-Cost Large Area Processing Using Small Area Substrates--A Novel Multitiled Palletization Concept for MCM-D Thin Film Process

S. K. Bhattacharya, B. M. Gardner, J. Qu, D. F. Baldwin, and R. R. Tummala

[p. 661]

Optoelectronic Packaging

Fabrication of Semiconductor Optical Switch Module Using Laser Welding Technique

S.-G. Kang, M.-K. Song, S.-S. Park, S.-H. Lee, N. Hwang, H.-T. Lee, K.-R. Oh, G.-C. Joo, and D. Lee

[p. 672]

A Novel Bidirectional Optical Coupling Module for Subscribers

G.-C. Joo, S.-H. Lee, K.-S. Park, J.-S. Choi, N. Hwang, and M.-K. Song

[p. 681]

Package Performance

Escape Routing Design to Reduce the Number of Layers in Area Array Packaging

M. Horiuchi, E. Yoda, Y. Takeuchi

[p. 686]

Modeling Stripline Discontinuities by Neural Network with Knowledge-Based Neurons

B.-Z. Wang, D. Zhao, and J. Hong

[p. 692]

System Packaging

Optimal Design of Electronic System Utilizing an Integrated Multidisciplinary Process

B. D. Mottahed and S. Manoochehri

[p. 699]

Package Processing and Reliability

Residual Shear Strength of Sn-Ag and Sn-Bi Lead-Free SMT Joints After Thermal Shock

N. M. Poon, C. M. L. Wu, J. K. L. Lai, and Y. C. Chan

[p. 708]

Solder Bump Reliability--Issues on Bump Layout

T. Alander, P. Heino, and E. Ristolainen

[p. 715]

Evaluation and Characterization of Reliable Non-Hermetic Conformal Coatings for Microelectromechanical System (MEMS) Device Encapsulation

J. Wu, R. T. Pike, C. P. Wong, N. Kim, M. H. Tanielian

[p. 721]

Visualization Analysis of Melt Flow in IC Packaging Process along Thickness Direction

M. Sato and H. Yokoi

[p. 729]

Kinetics of Interface Reaction In 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu Systems During Aging In Solid State

Z.-M. Guan, G.-X. Liu, T. Liu

[p. 737]

Thermal Cycling Lifetime of Flip Chip On Board Circuits with Solder Bumps and Isotropically Conductive Adhesive Joints

J. B. Nysæther, Z. Lai, and J. Liu

[p. 743]

Comparative Study of Micro-BGA Reliability Under Bending Stress

P. L. Tu, Y. C. Chan, K. C. Hung, and J. K. L. Lai

[p. 750]

ANNOUNCEMENTS

Call for Papers--Third International Symposium on Polymer Surface Modification

[p. 757]

Call for Papers--International Symposium on Surface Contamination and Cleaning

[p. 757]

Call for Papers--Second International Symposium on Adhesion Aspects of Thin Films

[p. 758]

Call for Papers--Third International Symposium on Adhesion Measurement of Thin Films and Coatings

[p. 758]

Call for Papers--Second International Symposium on Polyimides and Other High Temperature Polymers

[p. 759]

Call for Papers--Eighth International Symposium on Metallized Plastics Fundamental and Applied Physics

[p. 759]

2000 INDEX

Follows Page [p. 765]