Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely
download the PDFs of any of these papers, at the XPLORE On-Line Library.
Guests may access abstract/citation records free of charge.
|
Three-dimensional
flip-chip on flex packaging for power electronics applications
|
|
Effect
of cooling rate on the isothermal fatigue behavior of CBGA solder joints in
shear |
|
The
effects of underfill and its material models on thermomechanical behaviors of
a flip chip package |
|
Reliability
studies /spl mu/BGA solder joints-effect of Ni-Sn intermetallic compound
|
|
Significance
of coating stress on substrate bow in large area processing of MCM
|
|
Development
of microwave multilayer plastic-based multichip modules |
|
Multilayer
planarization of polymer dielectrics |
|
A
novel high speed multitap bus structure |
|
Simulating
package behavior under power dissipation using uniform thermal loading
|
|
Integrated
transient thermal and mechanical analysis of molded PBGA packages during
thermal shock |
|
Experimental
verification of the use of metal filled via hole fences for crosstalk control
of microstrip lines in LTCC packages |
|
Post-weld-shift
in dual-in-line laser package |
|
Central
wavelength tunable mechanism for temperature compensated package of fiber
Bragg gratings |
|
A
100-Gb/s throughput ATM switch MCM with a 320-channel parallel optical I/O
interface |
|
A
method of investigating fine shorting whiskers within a leadframe molded
package |
|
Influence
of ceramic surface treatment on peel-off strength between aluminum nitride
and epoxy-modified polyaminobismaleimide adhesive |