Foreword: Papers from the 9th IEEE Topical Meeting on Electrical Performance of Electronics Packaging of Electronic Packaging (EPEP)
Kaw, R.; Prince, J.L.
Page(s): 234 -235

Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology
Waizman, A.; Chee-Yee Chung
Page(s): 236 -244

Fast modeling of core switching noise on distributed LRC power grid in ULSI circuits
Li-Rong Zheng; Tenhunen, H.
Page(s): 245 -254

Wideband scalable electrical model for microwave/millimeter wave flip chip interconnects
Staiculescu, D.; Sutono, A.; Laskar, J.
Page(s): 255 -259

Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection
Namhoon Kim; Myunghee Sung; Hyungsoo Kim; Seungyong Baek; Woonghwan Ryu; Jeong-Gyun An; Joungho Kim
Page(s): 260 -267

Efficient and accurate crosstalk prediction via neural net-based topological decomposition of 3-D interconnect
Ilumoka, A.A.
Page(s): 268 -276

Power plane SPICE models and simulated performance for materials and geometries
Smith, L.D.; Anderson, R.; Roy, T.
Page(s): 277 -287

Enhanced transmission characteristics of on-chip interconnects with orthogonal gridded shield
Lutz, R.D.; Tripathi, V.K.; Weisshaar, A.
Page(s): 288 -293

Mid-frequency delta-I noise analysis of complex computer system boards with multiprocessor modules and verification by measurements
Garben, B.; McAllister, M.F.; Becker, W.D.; Frech, R.
Page(s): 294 -303

On a passivity of the Arnoldi based model order reduction for full-wave electromagnetic modeling
Balk, I.
Page(s): 304 -308

Signal integrity and design consideration of an MCM for video graphic acceleration
Zemo Yang; Rahman, M.; Mourad, S.
Page(s): 309 -316

Nonlinear circuit-reduction of high-speed interconnect networks using congruent transformation techniques
Gunupudi, P.K.; Nakhla, M.S.
Page(s): 317 -325

Modeling of field penetration through planes in multilayered packages
Jifeng Mao; Srinivasan, J.; Jinseong Choi; Swaminathan, M.; Nhon Do
Page(s): 326 -333

Modeling of irregular shaped power distribution planes using transmission matrix method
Joong-Ho Kim; Swaminathan, M.
Page(s): 334 -346

Reaction analysis in stripline circuits
Kabir, S.; Dvorak, S.L.; Prince, J.L.
Page(s): 347 -356

Modeling differential via holes
Laermans, E.; De Geest, J.; De Zutter, D.; Olyslager, F.; Sercu, S.; Morlion, D.
Page(s): 357 -363

Foreword: Papers from the Workshop on Chip Package Co-Design
Troster, G.; Scheffler, M.
Page(s): 364 -365

High density interconnects and flexible hybrid assemblies for active biomedical implants
Meyer, J.-U.; Stieglitz, T.; Scholz, O.; Haberer, W.; Beutel, H.
Page(s): 366 -374

A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems
Griese, E.
Page(s): 375 -383

Single-package integration of RF blocks for a 5 GHz WLAN application
Diels, W.; Vaesen, K.; Wambacq, P.; Donnay, S.; De Raedt, W.; Engels, M.; Bolsens, I.
Page(s): 384 -391

Virtual prototyping for high density packaging systems
Hirt, E.; Scheffler, M.; Troster, G.
Page(s): 392 -400

Thermal component model for electrothermal analysis of IGBT module systems
Chan-Su Yun; Malberti, P.; Ciappa, M.; Fichtner, W.
Page(s): 401 -406

High performance modules of 2.5 Gbps modulator integrated DFB lasers using new RF impedance matching technique
Lee, S.H.; Ahn, J.H.; Oh, Y.K.; Ma, J.S.; Choo, A.G.; Kim, T.I.; Yonggyoo Kim; Jichai Jeong
Page(s): 407 -410

Correction to "lossy power distribution networks with thin dielectric layers and/or thin conductive layers"
Novak, I.; Smith, L.; Roy, T.; Anderson, R.
Page(s): 411 -411