Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely download the PDFs of any of these papers, at the XPLORE On-Line Library. Guests may access abstract/citation records free of charge.

Editorial

J. P. Krusius

[p. 109]

CONTRIBUTIONS FROM THE 48TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)

Foreword

J. P. Krusius

[p. 110]

RF Flip-Module BGA Package

Y. L. Low, Y. Degani, K. V. Guinn, T. D. Dudderrar, J. A. Gregus, and R. C. Frye

[p. 111]

New High-Density Multilayer Technology on PCB

T. Shimoto, K. Matsui, K. Kikuchi, Y. Shimada, and K. Utsumi

[p. 116]

Overmold Technology Applied to Cavity Down Ultrafine Pitch PBGA Package

S. Ouimet and M.-C. Paquet

[p. 123]

Evolution of Engineering Change and Repair Technology in High Performance Multichip Modules at IBM

E. D. Perfecto, S. K. Ray, T. A. Wassick, and H. Stoller

[p. 129]

An Innovative Technique for Packaging Power Electronic Building Blocks Using Metal Posts Interconnected Parallel Plate Structures

S. Haque, K. Xing, R.-L. Lin, C. T. A. Suchicital, G.-Q. Lu, D. J. Nelson, D. Borojevic, and F. C. Lee

[p. 136]

Hermetic-Equivalent Packaging of GPS MCM-L Modules for High Reliability Avionics Applications

J. K. Hagge and R. C. Camilletti

[p. 145]

Manufacturing Experience with High Performance Mixed Dielectric Circuit Boards

D. S. Farquhar, A. M. Seman, and M. D. Poliks

[p. 153]

A CMOS Image Sensor Module Applied for a Digital Still Camera Utilizing the TAB on Glass (TOG) Bonding Method

M. Segawa, M. Ono, S. Musha, Y. Kishimoto, and A. Ohashi

[p. 160]

REGULAR PAPERS

The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF)

M.-J. Yim and K.-W. Paik

[p. 166]

Evaluation of Closed-Form Crosstalk Models of Coupled Transmission Lines

W. Shi and J. Fang

[p. 174]

Influence of a Floating Plane on Effective Ground Plane Inductance in Multilayer and Coplanar Packages

M. Lopez, J. L. Prince, and A. C. Cangellaris

[p. 182]

Processing Thick Multilevel Polyimide Films for 3-D Stacked Memory

M. D. Caterer, T. H. Daubenspeck, T. G. Ference, S. J. Holmes, and R. M. Quinn

[p. 189]

On Resonant Effects in Multilayer RF/Microwave Printed Circuit Board Applications

N. Georgieva, Z. Chen, and W. Oberhammer

[p. 200]

Packaging-Compatible High Q Microinductors and Microfilters for Wireless Applications

J. Y. Park and M. G. Allen

[p. 207]

Surface Graft Copolymerization Enhanced Adhesion of an Epoxy-Based Printed Circuit Board Substrate (FR-4) to Copper

Y. X. Liu, E. T. Kang, K. G. Neoh, J. F. Zhang, C. Q. Cui, and T. B. Lim

[p. 214]

Frequency Response Characteristics of Reference Plane Effective Inductance and Resistance

X. Xie and J. L. Prince

[p. 221]