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Foreword

A. Deutsch and M. Swaminathan

[p. 238]

CONTRIBUTIONS FROM THE 7TH TOPICAL MEETING ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING

Modeling of Power Distribution Systems for High-Performance Microprocessors

D. J. Herrell and B. Beker

[p. 240]

Contribution of Resonance to Ground Bounce in Lossy Thin Film Planes

S. Pannala, J. Bandyopadhyay, and M. Swaminathan

[p. 249]

Accurate Power Supply and Ground Plane Pair Models

H. H. Wu, J. W. Meyer, K. Lee, and A. Barber

[p. 259]

S-Parameter Based Technique for Simultaneous Switching Noise Analysis in Electronic Packages

Z. Jin, M. K. Iyer, Y. Qiu, B.-L. Ooi, and M.-S. Leong

[p. 267]

Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge Termination

I. Novak

[p. 274]

Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology

D. L. Smith, R. E. Anderson, D. W. Forehand, T. J. Pelc, and T. Roy

[p. 284]

Frequency-Dependent Crosstalk Simulation for On-Chip Interconnections

A. Deutsch, H. H. Smith, C. W. Surovic,G. V. Kopcsay, D. A. Webber, P. W. Coteus, G. A. Katopis, W. D. Becker, A. H. Dansky, G. A. Sai-Halasz, andP. J. Restle

[p. 292]

Modeling and Electrical Analysis of Seamless High Off-Chip Connectivity (SHOCC) Interconnects

S. Afonso, L. W. Schaper, J. P. Parkerson, W. D. Brown, S. S. Ang, and H. A. Naseem

[p. 309]

Electrical Performance of Chip-on-Chip Modules

Y. L. Low and K. J. O'Connor

[p. 321]

RF/Microwave Characterization of Multilayer Ceramic-Based MCM Technology

A. Sutono, A.-V. H. Pham, J. Laskar, and W. R. Smith

[p. 326]

Spiral Transmission-Line Baluns for RF Multichip Module Packages

Y. J. Yoon, Yicheng Lu, R. C. Frye, and P. R. Smith

[p. 332]

Electrical Characterization of Integrated Circuit Molding Compound

C. C. Green, J. M. Seligman, J. L. Prince, and K. L. Virga

[p. 337]

Electrical Characterization of Ball Grid Array Packages from

S

-Parameter Measurements Below 500 MHz

J. Jeong, S. Nam, Y. S. Shin, Y. S. Kim, and J. Jeong

[p. 343]

Efficient Computation of Interconnect Capacitances Using the Domain Decomposition Approach

V. V. Veremey and R. Mittra

[p. 348]

A New Discrete Transmission Line Model for Passive Model Order Reduction and Macromodeling of High-Speed Interconnections

A. C. Cangellaris, S. Pasha, J. L. Prince, and M. Celik

[p. 356]

Foreword

R. W. Johnson

[p. 365]

CONTRIBUTIONS FROM THE INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING

Packaging Properties of ALIVH-CSP using SBB Flip-Chip Bonding Technology

M. Itagaki, K. Amami, Y. Tomura, S. Yuhaku, Y. Ishimaru, Y. Bessho, K. Eda, and T. Ishida

[p. 366]

Evolution of a Unique Flip-Chip MCM-L Package

M. A. Jimarez, S. Tran, C. Le Coz, and G. O. Dearing

[p. 372]

Thermal Management for Multifunctional Structures

S. P. Rawal, D. M. Barnett, and D. E. Martin

[p. 379]

Foreword

J. P. Krusius

[p. 384]

CONTRIBUTIONS FROM THE 48TH IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

Epoxy-Based Aqueous-Processable Photodielectric Dry Film and Conductive ViaPlug for PCB Build-Up and IC Packaging

C. G. Gonzalez, R. A. Wessel, and S. A. Padlewski

[p. 385]

High Reliability, High Density, Low Cost Packaging Systems for Matrix Systems for Matrix BGA and CSP by VPES (Vacuum Printing Encapsulation Systems)

A. Okuno, N. Fujita, and Y. Ishikawa

[p. 391]

A Novel High Performance Adhesion Enhancing Zn-Cr Leadframe Coating for Popcorn Prevention

C. Lee, W. Hoesler, H. Cerva, R. von Criegern, and A. Parthasarathi

[p. 398]

Electrical Evaluation of Flip-Chip Package Alternatives for Next Generation Microprocessors

J. Darnauer, D. Chengson, B. Schmidt, E. Priest, D. A. Hanson, and W. G. Petefish

[p. 407]

Electrical Design and Simulation of High Density Printed Circuit Boards

T. Swirbel, A. Naujoks, and M. Watkins

[p. 416]

REGULAR PAPERS

A 3-D-Stacked Chip Packaging Solution for Miniaturized Massively Parallel Processing

R. M. Lea, I. P. Jalowiecki, D. K. Boughton, J. S. Yamaguchi, A. A. Pepe, V. H. Ozguz, and J. C. Carson

[p. 424]

Mechatronics for Automotive and Industrial Applications

M. Triantafyllou, K.-T. Neumann, H. Reichl, F. Ansorge, V. Großer, K.-F. Becker, E. Schmidt, and R. Maier

[p. 433]

Ten-Channel Optical Transmitter Module for Subsystem Interconnection Operating at \lambda = 1.3 &mgr;m Up to 12.5 Gbit/s

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, and L. Pesando

[p. 442]

A Compact MU-Interface, 2.5-Gb/s Optical Transmitter Module with LD-Driver IC Embedded in L-Shaped Wiring Substrate

F. Ishitsuka, N. Iwasaki, M. Hirose, M. Yanagibashi, H. Ichino, and Y. Ando

[p. 451]

Design and Characteristics of a Newly Developed Cavity-Up Plastic and Ceramic Laminated Thin BGA Package

H. Asai, K. Yano, K. Iyogi, N. Iwase, and T. Fujiwara

[p. 460]

Thermosonic Flip Chip Bonding System with a Self-Planarization Feature Using Polymer

Q. Tan, B. Schaible, L. J. Bond, and Y.-C. Lee

[p. 468]

Transient Two-Dimensional Thermal Analysis of Electronic Packages by the Boundary Element Method

I. Guven, C. L. Chan, and E. Madenci

[p. 476]

Stress-Buffer and Passivation Processes for Si and GaAs IC's and Passive Components Using Photosensitive BCB: Process Technology and Reliability Data

P. E. Garrou, W. B. Rogers, D. M. Scheck, A. J. G. Strandjord, Y. Ida, and K. Ohba

[p. 487]

Characterization of Thin Film Tantalum Oxide Capacitors on Polyimide Substrates

G. Morcan, S. S. Ang, T. Lenihan, L. W. Schaper, and W. D. Brown

[p. 499]

Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper

P. Heino and E. Ristolainen

[p. 510]

Moisture Sensitivity Characterization of Build-Up Ball Grid Array Substrates

M. G. Pecht

[p. 515]

CORRESPONDENCE

Correction to "Frequency Response Characteristics of Reference Plane Effective Inductance and Resistance"

X. Xie and J. L. Prince

[p. 524]

ANNOUNCEMENTS

Call for Papers--50th Electronic Components and Technology Conference

[p. 525]

Call for Papers--Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

[p. 526]