Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely download the PDFs of any of these papers, at the XPLORE On-Line Library. Guests may access abstract/citation records free of charge.

CONTRIBUTIONS FROM THE 48TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

Foreword

J. P. Krusius and R. A. Boudreau

[p. 533]

High-Density and Alignment-Tolerant Integration of Monitoring Photodetector Arrays onto Polymeric Guided-Wave Components

J. E. van der Linden, P. M. De Dobbelaere, P. P. Van Daele, and M. B. Diemeer

[p. 534]

A Compact Optical Active Connector: An Optical Interconnect Module with an Electrical Connector Interface

S. Sasaki, N. Tanaka, Y. Ando, and S. Yamaguchi

[p. 541]

Packaging for a 40-Channel Parallel Optical Interconnection Module with An Over-25-Gbit/s Throughput

K. Katsura, M. Usui, N. Sato, A. Ohki, N. Tanaka, N. Matsuura, T. Kagawa, K. Tateno, M. Hikita, R. Yoshimura, and Y. Ando

[p. 551]

Optoelectronic/VLSI

K. W. Goossen

[p. 561]

REGULAR PAPERS

Interconnects

Reflow and Property of Al/Cu/Electroless Nickel/Sn-Pb Solder Bumps

K.-L. Lin and Y.-C. Liu

[p. 568]

Manufacturing of Cu/Electroless Nickel/Sn-Pb Flip Chip Solder Bumps

K.-L. Lin and Y.-C. Liu

[p. 575]

Manufacturing of Solder Bumps with Cu/Ta/Cu as under Bump Metallurgy

K.-L. Lin and Y.-T. Liu

[p. 580]

A New Flip-Chip Bonding Technique Using Micromachined Conductive Polymer Bumps

K. W. Oh and C. H. Ahn

[p. 586]

Study of Fluxless Soldering Using Formic Acid Vapor

W. Lin and Y. C. Lee

[p. 592]

Reliability

Die Cracking and Reliable Die Design for Flip-Chip Assemblies

S. Michaelides and S. K. Sitaraman

[p. 602]

Reliability of Laser-Induced Metallic Vertical Links

W. Zhang, J.-H. Lee, Y. Chen, J. B. Bernstein, and J. S. Suehle

[p. 614]

Substrates and PWB's

Pulse CO₂ Laser Drilling of Green Alumina Ceramic

K. Imen and S. D. Allen

[p. 620]

Warpage Studies of HDI Test Vehicles During Various Thermal Profiling

G. J. Petriccione and I. C. Ume

[p. 624]

A Quantitative Analysis of the Stress Relaxation Effect of Thermoplastics in Multilayer Substrates

J. S. Kim, K. W. Paik, and H. S. Seo

[p. 638]

Probabilistic Prediction of Wiring Demand and Routing Requirements for High Density Interconnect Substrates

E. Diaz-Alvarez and J. P. Krusius

[p. 642]

System Design, Test, and Performance Modeling

Design and Test Methodology for an Analog-to-Digital Converter Multichip Module for Experimental All-Digital Radar Receiver Operating at 2 Gigasamples/s

R. L. Thompson, E. L. H. Amundsen, T. M. Schaefer, P. J. Riemer, M. J. Degerstrom, and B. K. Gilbert

[p. 649]

Efficient Computation of Frequency-Dependent Parameters for On-Chip Interconnects via Two-Dimensional FDTD and Time Signal Prediction Technique

Z. Yuan and Z. Li

[p. 665]