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SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC PACKAGES

Foreword

T.-Y. T. Lee, K. Ramakrishna, and C. H. Amon
[p. 3]

Thermal Design of an Ultra-Slim Notebook Computer

T. Kobayashi, T. Ogushi, N. Sumi, and M. Fujii
[p. 6]

Natural Convection Air Cooling of Electronic Components in Partially Open Compact Horizontal Enclosures

E. Yu and Y. K. Joshi
[p. 14]

Bayesian Surrogates for Integrating Numerical, Analytical, and Experimental Data: Application to Inverse Heat Transfer in Wearable Computers

N. Leoni and C. H. Amon
[p. 23]

Steady State Thermal Characterization and Junction Temperature Estimation of Multichip Module Packages Using the Response Surface Method

B. A. Zahn
[p. 33]

Calibration of Resistance Type Die Level Temperature Sensors Using a Single Temperature Technique

G. L. Solbrekken and C.-P. Chiu
[p. 40]

Thermal and Hydraulic Behavior of Plate Fin and Strip Fin Heat Sinks Under Varying Bypass Conditions

H. Jonsson and B. Palm
[p. 47]

Design Optimization of an Integrated Liquid-Cooled IGBT Power Module Using CFD Technique

T.-Y. T. Lee
[p. 55]

Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon

C. Ramaswamy, Y. K. Joshi, W. Nakayama, and W. B. Johnson
[p. 61]

Towards Optimizing Enhanced Surfaces for Passive Immersion Cooled Heat Sinks

C. S. Baldwin, S. H. Bhavnani, and R. C. Jaeger
[p. 70]

Fundamental Investigation of Roll Bond Heat Pipe as Heat Spreader Plate for Notebook Computers

K. Take, Y. Furukawa, and S. Ushioda
[p. 80]

Advanced Cooling System Using Miniature Heat Pipes in Mobile PC

T. Nguyen, M. Mochizuki, K. Mashiko, Y. Saito, I. Sauciuc, and R. Boggs
[p. 86]

Heat-Pipes for Electronic Devices Cooling and Evaluation of Their Thermal Performance

K. Namba, N. Kimura, J. Niekawa, Y. Kimura, and N. Hashimoto
[p. 91]

CONTRIBUTED PAPERS

Transient Thermal Behavior of High Power Diode Laser Arrays

R. Puchert, A. Bärwolff, M. Voß, U. Menzel, J. W. Tomm, and J. Luft
[p. 95]

Adhesion Measurement for Electronic Packaging Applications Using Double Cantilever Beam Method

X. Dai, M. V. Brillhart, and P. S. Ho
[p. 101]

Adhesion and Toughening Mechanisms at Underfill Interfaces for Flip-Chip-On-Organic-Substrate Packaging

X. Dai, M. V. Brillhart, M. Roesch, and P. S. Ho
[p. 117]

Effect of Bottom Electrodes on Resistance Degradation and Breakdown of (Ba,Sr)TiO_3 Thin Films

M. S. Tsai and T. Y. Tseng
[p. 128]

Corrosion of a Zinc-Coated Steel Enclosure at the Contact Interfaces of Gasket Joints

J. Xie, M. G. Pecht, S. K. Das, J. Neubel, and B. Zand
[p. 136]

Wave Soldering Bumping Process Incorporating Electroless Nickel UBM

K.-L. Lin and J.-W. Chen
[p. 143]

Study on Effect of Carbon Black on Behavior of Conductive Polymer Composites with Positive Temperature Coefficient

S. Luo and C. P. Wong
[p. 151]

Degradation of Road Tested Automotive Connectors

J. Swingler, J. W. McBride, and C. Maul
[p. 157]

Diagnosing Transmission Line Termination Faults by Means of Wavelet Based Crosstalk Signature Recognition

C. Buccella and A. Orlandi
[p. 165]

Assessing the Operating Reliability of Land Grid Array Elastomer Sockets

J. Xie, C. Hillman, P. Sandborn, M. G. Pecht, A. Hassanzadeh, and D. DeDonato
[p. 171]

Consequences for Automotive Relays of a 42 VDC Power Network in Vehicles

T. J. Schoepf and W. F. Rieder
[p. 177]

Full Software Analysis and Impedance Matching of Radio Frequency CMOS Integrated Circuits

K. H. Kim, H. J. Chung, S. H. Yoon, S. W. Hwang, J. W. Park, S. W. Kim, J. Choi, and D. Ahn
[p. 183]

OPEN FORUM

Editorial

M. G. Pecht and D. Das
[p. 190]

CORRESPONDENCE

Correction to "Influence of Contact and Current on Effective Erosion of Cu-Cr, Ag-WC, and Ag-Cr Vacuum Contact Materials"

M. B. Schulman, P. G. Slade, L. D. Loud, and W. Li
[p. 194]

IEEE Copyright Form

[p. 199]