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In Memorium: Morton Antler

M. Braunovic

[p. 203]

CONTRIBUTIONS FROM THE 44TH AND 45TH HOLM CONFERENCE ON ELECTRICAL CONTACTS

Foreword

J. W. McBride

[p. 204]

Polymeric Arc Chamber Walls Influence on AgW/AgC Contact Resistance

J. J. Shea

[p. 205]

The Volumetric Erosion of Electrical Contacts

J. W. McBride

[p. 211]

Influence of Contact Material Parameters on Contact Compatibility of Organic Vapours

H. P. Koidl, W. F. Rieder, and Q. R. Salzmann

[p. 222]

Performance of a Shape Memory Alloy Coil-Shaped Clamp for Enhanced Normal Force in Pin-and-Receptacle Electrical Connectors

I. Kulisic, G. L. Gray, T. J. Yurick, Jr., and S. E. Mohney

[p. 227]

Effect of Mg Doping on Increase in the Life with Low Contact Resistance of Ag-Pd Alloy Switching Contacts in Silicone Vapor Environments

T. Tamai, A. Sato, and S. Ito

[p. 234]

Make Arc Erosion and Welding in the Automotive Area

L. Morin, N. Ben Jemaa, and D. Jeannot

[p. 240]

Characteristics of Surface Film on Slip-Ring in the Low Atmospheric Pressure

T. Ueno and K. Sawa

[p. 247]

The Effect of Fretting at Elevated Temperatures on a Clad Material (65Au21Pd14Ag) and an Electroplated Soft Gold Over Palladium-Nickel Material System

N. Aukland, H. Hardee, A. Wehr-Auckland, and P. Lees

[p. 252]

Environmental Degradation of Utility Power Connectors in a Harsh Environment

B. W. Callen, B. Johnson, P. King, R. S. Timsit, and W. H. Abbott

[p. 261]

Investigation of Arcing Effects During Contact Blow Open Process

X. Zhou and P. Theisen

[p. 271]

The Impact of Sliding Motion and Current Load on the Deterioration of Tin-Coated Contact Terminals

T. Hammam

[p. 278]

Low Current Arc Modes of Short Length and Time: A Review

W. F. Rieder

[p. 286]

A Measurement on Electromagnetic Noise and Change of Surface in Arcing Electric Contacts

Y. Ebara, T. Koizumi, H. Sone, and Y. Nemoto

[p. 293]

CONTRIBUTED PAPERS

Enhancement of Air Jet Impingement Heat Transfer Using Pin-Fin Heat Sinks

H. A. El-Sheikh and S. V. Garimella

[p. 300]

Interfacial Shear Stress, Peeling Stress, and Die Cracking Stress in Trilayer Electronic Assemblies

K. Wang, Y. Huang, A. Chandra, and K. X. Hu

[p. 309]

Contact Resistance Changes of Silver, Silver Alloys, and Gold Plated Silver Coupons Exposed to Ozone

N. R. Aukland, H. C. Hardee, S. Hessefort, and J. P. Miller

[p. 317]

Effects of Underfill Material Properties on the Reliability of Solder Bumped Flip Chip on Board with Imperfect Underfill Encapsulants

J. H. Lau, S.-W. R. Lee, and C. Chang

[p. 323]

Anode Spot Vacuum Arc Model: Graphite Anode

I. I. Beilis

[p. 334]

A Simulation Study of IC Layout Effects on Thermal Management of Die Attached GaAs IC's

C. J. Reimer, T. Smy, D. J. Walkey, B. C. Beggs, and R. Surridge

[p. 341]

Dynamic Thermal Characterization and Modeling of Packaged AlGaAs/GaAs HBT's

M. Busani, R. Menozzi, M. Borgarino, and F. Fantini

[p. 352]

Gallium Alloy Interconnects For Flip-Chip Assembly Applications

D. F. Baldwin, R. D. Deshmukh, and C. S. Hau

[p. 360]

Contacts Materials Performances under Break Arc in Automotive Applications

L. Morin, N. Ben Jemaa, D. Jeannot, J. Pinard, and L. Nedelec

[p. 367]

CONTRIBUTIONS FROM THE 49TH IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

Foreword

S. Canumalla

[p. 376]

Fluxless Process of Fabricating In-Au Joints on Copper Substrates

W. W. So and C. C. Lee

[p. 377]

Solder Metallization Interdiffusion in Microelectronic Interconnects

A. Zribi, R. R. Chromik, R. Presthus, K. Teed,L. Zavalij, J. DeVita, J. Tova, E. J. Cotts, J. Clum, R. Erich, A. Primavera, G. Westby, R. J. Coyle, and G. M. Wenger

[p. 383]

A Testing Method and Device for Intrinsic Stress Measurement in Wafer Bumping Process

Y. Guo, D. Mitchell, V. Sarihan, T.-Y. T. Lee, and D. Zheng

[p. 388]

Integrated Temperature Microsensors for Characterization and Optimization of Thermosonic Ball Bonding Process

M. Mayer, O. Paul, D. Bolliger, and H. Baltes

[p. 393]

Advanced Flip Chip Bonding Techniques Using Transferred Microsolder Bumps

N. Koshoubu, S. Ishizawa, H. Tsunetsugu, and H. Takahara

[p. 399]

OPEN FORUM

Editorial

M. G. Pecht

[p. 405]

A Perspective on North American PWB Technology Hurdles and Barriers and a Strategy to Overcome Obstacles

J. T. Fisher and M. Andrews

[p. 406]