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SPECIAL SECTION ON POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING

Foreword

J. Liu
[p. 419]

Flip Chip Underfill Flow Characteristics and Prediction

P. Fine, B. Cobb, and L. Nguyen
[p. 420]

Behaviors of Polymeric Materials and Their Effects on High Density PWB

S. X. Wu, S. Peng, and C.-P. Yeh
[p. 428]

An Improved Methodology for Determining Temperature Dependent Moduli of Underfill Encapsulants

Y. Rao, S. H. Shi, and C. P. Wong
[p. 434]

A Study of Contact Resistance of Conductive Adhesives Based on Anhydride-Cured Epoxy Systems

D. Lu and C. P. Wong
[p. 440]

Effect of Bump Height on the Strain Variation During the Thermal Cycling Test of ACA Flip-Chip Joints

K. Pinardi, Z. Lai, D. Vogel, Y. L. Kang, J. Liu, S. Liu, R. Haug, and M. Willander
[p. 447]

Development of Virtual Reliability Methodology for Area-Array Devices Used in Implantable and Automotive Applications [Best Transactions Paper, 2000]

S. K. Sitaraman, C. E. Hanna, and R. Raghunathan
[p. 452]

Reliability Investigations on Conductive Adhesive Joints with Emphasis on the Mechanics of the Conduction Mechanism

R. Dudek, H. Berek, T. Fritsch, and B. Michel
[p. 462]

CONTRIBUTED PAPERS

Compact Thermal Models of Packages Used in Conduction Cooled Applications

A. Aranyosi, A. Ortega, R. A. Griffin, S. West, and D. R. Edwards
[p. 470]

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

T.-Y. T. Lee
[p. 481]

An Upper Limit for High Power Switching with a Polymer Current Limiter Device

A. R. Duggal
[p. 490]

Warpage Measurement of Large Area Multitiled Silicon Substrates at Various Processing Conditions

S. K. Bhattacharya, I. C. Ume, and A. X. H. Dang
[p. 497]

A Simplified Random Vibration Analysis on Portable Electronic Products

W. Huang, D. B. Kececioglu, and J. L. Prince
[p. 505]

The Necessity of Reexamining Previous Life Prediction Analyses of Solder Joints in Electronic Packages

T. Anderson, I. Guven, E. Madenci, and G. Gustafsson
[p. 516]

Nonuniform Temperature and Strain Fields in a Powered Package

J. Wakil and P. S. Ho
[p. 521]

Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies

R. Ghaffarian and N. P. Kim
[p. 528]

Mechanism of Contact Enhancing Chemicals for Electrical Interconnection

G. Gao and D. Shangguan
[p. 535]

High-Frequency SPICE Model of Anisotropic Conductive Film Flip-Chip Interconnections Based on a Genetic Algorithm

W. Ryu, M.-J. Yim, S. Ahn, J. Lee, W. Kim, K.-W. Paik, and J. Kim
[p. 542]

CONTRIBUTIONS FROM THE 5TH THERMINIC WORKSHOP

Foreword

B. Courtois and C. Lasance
[p. 546]

Heat Transfer Enhancement at Solid-Liquid and Solid-Gas Interfaces by Near-Surface Coolant Agitation

A. Kruusing, T. Thelemann, H. Thust, S. Leppävuori, and K.-H. Drüe
[p. 548]

Parametric Compact Models for Flip Chip Assemblies

S. Van Dooren, . Vandevelde, E. Beyne, F. Christiaens, and D. Corlatan
[p. 555]

Scale Effects on Fluid Flow and Heat Transfer in Microchannels

M.-N. Sabry
[p. 562]

A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component-Printed Circuit Board Heat Transfer

V. Eveloy, J. Lohan, and P. Rodgers
[p. 568]

Experimental and Numerical Investigation into the Influence of Printed Circuit Board Construction on Component Operating Temperature in Natural Convection

J. Lohan, P. Tiilikka, P. Rodgers, and C.-M. Fager
[p. 578]

Thermal Dynamics and the Time Constant Domain

V. Szekely and M. Rencz
[p. 587]

OPEN FORUM

An Avionics Guide to Uprating of Electronic Parts

D. Humphrey, L. Condra, N. Pendse, D. Das, C. Wilkinson, and M. Pecht
[p. 595]

List of Reviewers

[p. 600]