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CONTRIBUTED PAPERS

Planar Inductors on an LTCC Substrate Realized by the Gravure-Offset-Printing Technique

M. Lahti, V. Lantto, and S. Leppävuori

[p. 606]

Modeling and Simulation of Integrated Capacitors for High Frequency Chip Power Decoupling

E. Diaz-Alvarez, J. P. Krusius, and F. Kroeger

[p. 611]

Development of Conductive Adhesives for Solder Replacement

D. Lu and C. P. Wong

[p. 620]

An Experimental Characterization of Nonlinear Ceramic Capacitors for Small and Large Signals

O. Dejean, T. Lebey, and V. Bley

[p. 627]

Interfacial Thermal Resistance and Temperature Dependence of Three Adhesives for Electronic Packaging

D. P. H. Hasselman, K. Y. Donaldson, F. D. Barlow, A. A. Elshabini, G. H. Schiroky, J. P. Yaskoff, and R. L. Dietz

[p. 633]

The Corrosion Behavior of BK-7 Glasses for Use in Non-Hermetic Electro-Optic Devices

C. D. Theis, D. A. Fleming, J. W. Osenbach

[p. 638]

Soft Solder Die Bonding of Multiple Die Devices

S. Radeck, D. Kellenberger, and C. Luechinger

[p. 646]

Manufacturing and Materials Properties of Ti/Cu/Electroless Ni/Solder Bump on Si

K.-L. Lin and K.-T. Hsu

[p. 657]

Solder Thickness Variation with Respect to Soldering Parameters

K.-L. Lin and S. Yao

[p. 661]

Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology

C. Perret, J. Boussey, Ch. Schaeffer, and M. Coyaud

[p. 665]

Residual Thermomechanical Stresses in Thinned-Chip Assemblies

S. Leseduarte, S. Marco, E. Beyne, R. Van Hoof, A. Marty, S. Pinel, O. Vendier, and A. Coello-Vera

[p. 673]

A Precise Numerical Prediction of Effective Dielectric Constant for Polymer-Ceramic Composite Based on Effective- Medium Theory

Y. Rao, J. Qu, C. P. Wong, and T. Marinis

[p. 680]

Prediction of Paddle Shift via 3-D TSOP Modeling

F. Su, S.-J. Hwang, H.-H. Lee, D.-Y. Huang

[p. 684]

Conductive Aqueous Layer Formation at the Gel-Substrate Interface in Equilibrium with 100% RH Environment

M. Tencer

[p. 693]

Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep During PBGA Encapsulation

S.-Y. Yang, S.-C. Jiang, and W.-S. Lu

[p. 700]

Electronic Part Life Cycle Concepts and Obsolescence Forecasting

R. Solomon, P. Sandborn, and M. G. Pecht

[p. 707]

OPEN FORUM

Editorial

M. G. Pecht

[p. 718]

Telecommunications and PWBs

G. C. Munie

[p. 719]

2000 INDEX

[Follows page p. 727]