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Parametric
optimization of multichanneled heat sinks for VLSI chip cooling
Murakami, Y.; Mikic,
B.B.
Page(s): 2 -9
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Thermal cycling
aging effects on microstructural and mechanical properties of a single PBGA
solder joint specimen
Pang, J.H.L.; Kwang
Hong Tan; Xunqing Shi; Wang, Z.P.
Page(s): 10 -15
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Nonuniform
temperature distribution in electronic devices cooled by flow in parallel
microchannels
Hestroni, G.; Mosyak,
A.; Segal, Z.
Page(s): 16 -23
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Effect of
nonconducting filler additions on ACA properties and the reliability of ACA
flip-chip on organic substrates
Myung-Jin Yim; Kyung-Wook
Paik
Page(s): 24 -32
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A
voltage-controlled tunable thin-film distributed RC notch filter
Won-Youl Choi; Trolier-McKinstry,
S.
Page(s): 33 -37
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Study on effect of
coupling agents on underfill material in flip chip packaging
Shijian Luo; Wong, C.P.
Page(s): 38 -42
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Effect of UV/ozone
treatment on surface tension and adhesion in electronic packaging
Shijian Luo; Wong, C.P.
Page(s): 43 -49
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Contact resistance
calculations: generalizations of Greenwood's formula including interface
films
Boyer, L.
Page(s): 50 -58
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Development of
no-flow underfill materials for lead-free solder bumped flip-chip
applications
Zhang, Z.Q.; Shi, S.H.;
Wong, C.P.
Page(s): 59 -66
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Polymer
thick-films on silicon: a route to hybrid microsystems
Papakostas, T.V.;
White, N.M.
Page(s): 67 -75
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Mapping of
mechanical, thermomechanical and wire-bond strain fields in packaged Si
integrated circuits using synchrotron white beam X-ray topography
McNally, P.J.;
Rantamaki, R.; Tuomi, T.; Danilewsky, A.N.; Lowney, D.; Curley, J.W.;
Herbert, P.A.F.
Page(s): 76 -83
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Investigation of
the underfill delamination and cracking in flip-chip modules under
temperature cyclic loading
Fan, X.-J.; Wang, H.B.;
Lim, T.B.
Page(s): 84 -91
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Bonding stress and
reliability of high power GaAs-based lasers
Lisak, D.; Cassidy,
D.T.; Moore, A.H.
Page(s): 92 -98
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Design of
accelerated corrosion tests for electronic components in automotive
applications
Eriksson, P.; Carlsson,
B.; Wallinder, I.O.
Page(s): 99 -107
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Prognostic
methodology for deep submicron semiconductor failure modes
Goodman, D.L.
Page(s): 109 -111
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