Assessment of high-heat-flux thermal management schemes
Mudawar, I.
Page(s): 122 -141

Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass
Jonsson, H.; Moshfegh, B.
Page(s): 142 -149

Design for manufacturability of SISE parallel plate forced convection heat sinks
Iyengar, M.; Bar-Cohen, A.
Page(s): 150 -158

Optimization of plate fin heat sinks using entropy generation minimization
Culham, J.R.; Muzychka, Y.S.
Page(s): 159 -165

Immersion-cooled heat sinks for electronics: insight from high-speed photography
Bhavnani, S.H.; Fournelle, G.; Jaeger, R.C.
Page(s): 166 -176

A methodology for the design of perforated tiles in raised floor data centers using computational flow analysis
Kang, S.; Schmidt, R.R.; Kelkar, K.M.; Radmehr, A.; Patankar, S.V.
Page(s): 177 -183

Computational parameter study of chip scale package array cooling
Watson, S.P.; Murray, B.T.; Sammakia, B.G.
Page(s): 184 -190

A study of compact thermal model topologies in CFD for a flip chip plastic ball grid array package
Shidore, S.; Adams, V.; Lee, T.T.
Page(s): 191 -198

A novel approach to the design of complex heat transfer systems: portable computer design-a case study
Nakayama, W.; Behnia, M.; Soodphakdee, D.
Page(s): 199 -206

Modeling contact between rigid sphere and elastic layer bonded to rigid substrate
Stevanovic, M.; Yovanovich, M.M.; Culham, J.R.
Page(s): 207 -212

Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins
Moores, K.A.; Joshi, Y.K.; Schiroky, G.H.
Page(s): 213 -219

High heat flux heat pipe mechanism for cooling of electronics
Zuo, Z.J.; North, M.T.; Wert, K.L.
Page(s): 220 -225

Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules
Sikka, K.K.
Page(s): 226 -232

RF electrical measurements of fine pitch BGA packages
Caggiano, M.F.; Ou, J.; Bulumulla, S.; Lischner, D.
Page(s): 233 -240

The effect of power cycling on the reliability of lead-free surface mount assemblies
Davitt, E.; Stam, F.A.; Barrett, J.
Page(s): 241 -249

Statistics of electric conductance through anisotropically conductive adhesive
Ying Fu; Willander, M.; Liu, J.
Page(s): 250 -255

Numerical modeling of interfacial delamination propagation in a novel peripheral array package
Harries, R.J.; Sitaraman, S.K.
Page(s): 256 -264

Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package
Sundararaman, V.; Sitaraman, S.K.
Page(s): 265 -270

Application of Al/PI composite bumps to COG bonding process
Jen-Huang Jeng; Hsieh, T.E.
Page(s): 271 -278

Software-based analysis of radio frequency plasma display panel for efficient design and impedance matching
Ki Hyuk Kim; Park, H.I.; Park, J.H.; Sung Woo Hwang; Kang, J.
Page(s): 279 -284

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
Lau, J.H.; Chang, C.; Lee, S.-W.R.
Page(s): 285 -292

Reliability of soldered joints in CSPs of various designs and mounting conditions
Sumikawa, M.; Sato, T.; Yoshioka, C.; Nukii, T.
Page(s): 293 -299

On the design parameters of flip-chip PBGA package assembly for optimum solder ball reliability
Verma, K.; Seung-Bae Park; Bongtae Han; Ackerman, W.
Page(s): 300 -307

Editorial
Pecht, M.G.
Page(s): 308 -308

Photonics challenge to electronic packaging
Gilleo, K.
Page(s): 309 -311