Foreword: Papers from the HOLM Conference
McBride, J.W.; Braunovic, M.
Page(s): 319 -319

The unusual electrical erosion of high tungsten content, tungsten copper contacts switching load current in vacuum
Slade, P.G.; Wangfei Li; Loud, L.D.; Haskins, R.E., Jr.
Page(s): 320 -330

Arc root commutation from moving contacts in low voltage devices
McBride, J.W.; Pechrach, K.; Weaver, P.M.
Page(s): 331 -336

Arc structure, arc motion, and gas pressure between laterally enclosed arc runners
Zeller, P.R.; Rieder, W.F.
Page(s): 337 -341

The influence of arc chamber wall material on arc gap dielectric recovery voltage
Shea, J.J.
Page(s): 342 -348

An influence of commutation arc in gasoline on brush wear and commutator
Takaoka, M.; Sawa, K.
Page(s): 349 -352

Erosion and contact resistance performance of materials for sliding contacts under arcing
Jemaa, N.B.; Morin, L.; Jeannot, D.; Hauner, F.
Page(s): 353 -357

Short arc duration laws and distributions at low current (>1 A) and voltage (14-42 VDC)
Jemaa, N.B.
Page(s): 358 -362

A method to achieve arcless interruptions in low current power circuits
Chen, W.W.
Page(s): 363 -369

Intermittency phenomena in electrical connectors
Maul, C.; McBride, J.W.; Swingler, J.
Page(s): 370 -377

Fretting in copper-to-copper contacts under AC and DC current conditions
Gagnon, D.; Braunovic, M.
Page(s): 378 -383

Overheating of flexible tinned copper connectors
Braunovic, M.
Page(s): 384 -388

Shape memory alloy coils optimized for electrical connectors
Yurick, T.J., Jr.; Mohney, S.E.; Gray, G.L.
Page(s): 389 -398

Characteristics of films developed in fretting experiments on tin plated contacts
Malucci, R.D.
Page(s): 399 -407

Possible mechanism for observed dynamic resistance
Malucci, R.D.
Page(s): 408 -415

Chemical and mechanical adhesion mechanisms of sputter-deposited metal on epoxy dielectric for high density interconnect printed circuit boards
Martin, L.J.; Wong, C.P.
Page(s): 416 -424

Development of an etchant for selectively etching TiWN/sub x/ in the presence of electroplated 95%Pb-5%Sn solder
Ramanathan, L.N.; Mitchell, D.
Page(s): 425 -430

Development of conductive adhesive materials for via fill applications
Kang, S.K.; Buchwalter, S.L.; LaBianca, N.C.; Gelorme, J.; Purushothaman, S.; Papathomas, K.; Poliks, M.
Page(s): 431 -435

Thermal and mechanical characterization of ViaLUX/sup TM/ 81: a novel epoxy photo-dielectric dry film (PDDF) for microvia applications
Dunne, R.C.; Sitaraman, S.K.; Shijian Luo; Wong, C.P.; Estes, W.E.; Periyasamy, M.; Coburn, J.
Page(s): 436 -444

Conductive ink for through hole application
Xiao, A.Y.; Tong, Q.K.; Savoca, A.C.; van Oosten, H.
Page(s): 445 -449

Linkage-spring model in analyzing wirebonding loops
Yu-Lung Lo; Tien-Lou Ho; Jau-Liang Chen; Rong-Shean Lee; Tei-Chen Chen
Page(s): 450 -456

Design in triangle-profiles and T-profiles of a wirebond using a linkage-spring model
Yu-Lung Lo; Tei-Chen Chen; Tieh-Lou Ho
Page(s): 457 -467

The influence of wall slip in the measurement of solder paste viscosity
Ekere, N.N.; He, D.; Cai, L.
Page(s): 468 -473

Variable frequency microwave curing of photosensitive polyimides
Famsworth, K.D.; Manepalli, R.N.; Bidstrup-Allen, S.A.; Kohl, P.A.
Page(s): 474 -481

Growth kinetics of interfacial damage: epoxy coating on a generic dual inline package
Jongwoo Park; Harlow, D.G.; Nied, H.F.
Page(s): 482 -492

Internal stress and connection resistance correlation study of microbump bonding
Shyh-Ming Chan; Jwo-Huei Jou; Hsieh, A.; Tai-Hong Chen; Jui-Nin Jao; Hua-Shu Wu
Page(s): 493 -499

Self-organizing lightwave network (SOLNET) and its application to film optical circuit substrates
Yoshimura, T.; Roman, J.; Takahashi, Y.; Wang, W.-C.V.; Inao, M.; Ishitsuka, T.; Tsukamoto, K.; Aoki, S.; Motoyoshi, K.; Sotoyama, W.
Page(s): 500 -509

Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
Carchon, G.; Vaesen, K.; Brebels, S.; De Raedt, W.; Beyne, E.; Nauwelaers, B.
Page(s): 510 -519

Fundamental reliability issues associated with a commercial particle-in-elastomer interconnection system
Weifeng Liu; Pecht, M.G.; Jingsong Xie
Page(s): 520 -525

High frequency response of amorphous tantalum oxide thin films
Jin-Young Kim; Garg, A.; Rymaszewski, E.J.; Toh-Ming Lu
Page(s): 526 -533

Handling the migration to lead free
Ciocci, R.C.
Page(s): 536 -538