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Editorial

A. Bar-Cohen

[p. 3]

CONTRIBUTIONS FROM THE SECOND INTERNATIONAL SYMPOSIUM ON ELECTRONIC PACKAGING TECHNOLOGY

Foreword

C. P. Wong

[p. 5]

A Simplified Modeling Technique for Finite Element Thermal Analysis of a Plastic SOIC Package

T. W. C. Mak and L. G. Feinstein

[p. 6]

Effect of the Interdiffusion Reaction on the Compatibility in PZT/PNN Functionally Gradient Piezoelectric Materials

J. Xu, X. Zhu, and Z. Meng

[p. 11]

Some Aspects Affecting Transmittance Spectra of Composite Smart Film WO₃

A. Chen, N. Gao, Z. Zhu, Y. Han, and M. Wu

[p. 17]

Recent Advances in Plastic Packaging of Flip-Chip and Multichip Modules (MCM) of Microelectronics

C. P. Wong and M. M. Wong

[p. 21]

REGULAR PAPERS

Contacts and Connectors

Foreword

M. Braunovic

[p. 26]

The Net Zero Mass Loss Phenomenon on Opening Switching Contacts with AC Loading

J. Swingler and J. W. McBride

[p. 27]

Anode and Cathode Arc Root Movement During Contact Opening at High Current

J. W. McBride and P. A. Jeffery

[p. 38]

Solutions for Fretting Corrosion

P. van Dijk and F. van Meijl

[p. 47]

Accelerated Testing of Tin-Plated Copper Alloy Contacts

R. D. Malucci

[p. 53]

Recovery of Severely Degraded Tin-Lead Plated Connector Contacts Due to Fretting Corrosion

M. Antler, N. R. Aukland, H. Hardee, and A. Wehr-Aukland

[p. 61]

Thermal Cycling Induced Wiping Wear of Connector Contacts at 150 °C

C. H. Leung and A. Lee

[p. 72]

Self-Assembled Monolayers of Alkanethiols on Nickel Surfaces for Low Level Electrical Contact Applications

S. Noël, F. Houze, L. Boyer, Z. Mekhalif, J. Delhalle, and R. Caudano

[p. 79]

Electrical Contact Resistance: Properties of Stationary Interfaces

R. S. Timsit

[p. 85]

Materials and Devices

Nickel/Palladium Finish for Leadframes

D. C. Abbott

[p. 99]

Moisture Ingress Into Organic Laminates

M. G. Pecht, H. Ardebili, A. A. Shukla, J. K. Hagge, and D. Jennings

[p. 104]

Characterization of Underfill Materials for Functional Solder Bumped Flip Chips on Board Applications

J. H. Lau and C. Chang

[p. 111]

Low-Frequency Noise in Thick-Film Resistors Due to Two-Step Tunneling Process in Insulator Layer of Elemental MIM Cell [Best Transactions Paper, 1999]

M. M. Jevtic, Z. Stanimirovic, and I. Mrak

[p. 120]

OPEN FORUM

Editorial

M. G. Pecht

[p. 126]

Reliability Prediction and Assessment of Electronic Systems and Equipment

J. Cartwright, D. N. Donahoe, and M. Jackson

[p. 127]

ANNOUNCEMENTS

Short Course--How to Select and Use Electronic Parts Outside the Manufacturer's Data Sheet Temperature Limits

[p. 129]