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Foreword

J. E. Morris

[p. 139]

CONTRIBUTIONS FROM THE 48TH IEEE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

Study of the Fluxing Agent Effects on the Properties of No-Flow Underfill Materials for Flip-Chip Applications

S. H. Shi and C. P. Wong

[p. 141]

Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills

Z. Qian, J. Wang, J. Yang, and S. Liu

[p. 152]

A Novel Flip Chip Technology Using Nonconductive Resin Sheet

S. Ito, M. Mizutani, H. Noro, M. Kuwamura, and A. Prabhu

[p. 158]

CONTRIBUTIONS FROM THE 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY

Development of Reworkable Underfills, Materials, Reliability and Processing

L. Crane, A. Torres-Filho, C. K. Ober, S. Yang, J.-S. Chen, and R. W. Johnson

[p. 163]

Underfill of Flip Chip on Laminates: Simulation and Validation

L. Nguyen, C. Quentin, P. Fine, B. Cobb, S. Bayyuk, H. Yang, and S. A. Bidstrup-Allen

[p. 168]

Flow Characterization and Thermo-Mechanical Response of Anisotropic Conductive Films

R. Dudek, S. Meinel, A. Schubert, B. Michel, L. Dorfmüller, P. M. Knoll, and J. Baumbach

[p. 177]

A Reliable and Environmentally Friendly Packaging Technology--Flip-Chip Joining Using Anisotropically Conductive Adhesive

J. Liu, A. Tolvga˚rd, J. Malmodin, and Z. Lai

[p. 186]

Continuous Electrical Resistance Monitoring, Pull Strength, and Fatigue Life of Isotropically Conductive Adhesive Joints

J. H. Constable, T. Kache, H. Teichmann, S. Mühle, and M. A. Gaynes

[p. 191]

Parametric Dependence of Fatigue of Electronic Adhesives

A. Gladkov and A. Bar-Cohen

[p. 200]

Fracture Behavior of Isotropically Conductive Adhesives

S. Gupta, R. M. Hydro, and R. A. Pearson

[p. 209]

Chemical Kinetic Model of Interfacial Degradation of Adhesive Joints

D. C. C. Lam, F. Yang, and P. Tong

[p. 215]

Effect of Cleaning and Non-Cleaning Situations on the Reliability of Flip-Chip Packages

J. Wang, W. Ren, D. Zou, and S. Liu

[p. 221]

Foreword

D. L. Blackburn and B. Courtois

[p. 229]

CONTRIBUTIONS FROM THE 4TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF IC'S AND MICROSTRUCTURES

Thermal Monitoring and Testing of Electronic Systems

V. Szekely, M. Rencz, A. Pahi, and B. Courtois

[p. 231]

A Time-Domain Method for the Analysis of Thermal Impedance Response Preserving the Convolution Form

M. Carmona, S. Marco, J. Palacin, and J. Samitier

[p. 238]

Spatially Resolved Thermal Characterization of Packaged Vertical Cavity Surface-Emitting Lasers

L. Pellegrino, P. E. Bagnoli, M. Madella, and A. Piccirillo

[p. 245]

Validation and Application of Different Experimental Techniques to Measure Electronic Component Operating Junction Temperature

J. Lohan, P. Rodgers, C.-M. Fager, R. Lehtiniemi, V. Eveloy, P. Tiilikka, and J. Rantala

[p. 252]

Image Processing Procedures for the Thermal Measurements

V. Szekely and M. Rencz

[p. 259]

REGULAR PAPERS

Packaging, Materials, and Interconnects

New Findings in the Occurrence of False-Healing in Plastic Encapsulated Microcircuits using Scanning Acoustic Microscopy

Y. Ranade, M. G. Pecht, and T. M. Moore

[p. 266]

Current Trends in Military Microelectronic Component Packaging

L. G. Vettraino and S. H. Risbud

[p. 270]

In Situ

Measurement of Mechanical Properties of Polyimide Films Using Micromachined Resonant String Structures

Y.-J. Kim and M. G. Allen

[p. 282]

Numerical Analysis of Fine Lead Bonding--Effect of Pad Thickness on Interfacial Deformation

Y. Takahashi, M. Inoue, and K. Inoue

[p. 291]

Electroless Remetallization of Aluminum Bond Pads on CMOS Driver Chip for Flip-Chip Attachment to Vertical Cavity Surface Emitting Lasers (VCSEL's)

M. Datta, S. A. Merritt, and M. Dagenais

[p. 299]

Electrical and Thermal Measurement

Experiments on Low Velocity Cooling of High Conductivity Substrates

K. K. Sikka, K. E. Torrance, and T. S. Fisher

[p. 307]

Estimation of Ground Bounce Effects on CMOS Circuits

A. Kabbani and A. J. Al-Khalili

[p. 316]

Electrical Contacts

Alternating Current Distribution in Heavy Current Contacts and Conductors of Arbitrary Shape

D. Podolsky and V. Kapustin

[p. 326]

Erosion and Resistance Characteristics of AgW and AgC Contacts at High Current Arcing in Air

J. J. Shea

[p. 331]

OPEN FORUM

Editorial

M. G. Pecht

[p. 337]

Nano-to-Millimeter Scale Integrated Systems

H. Last, M. Deeds, D. Garvick, B. Kavetsky, P. Sandborn, E. B. Magrab, and S. K. Gupta

[p. 338]

CORRESPONDENCE

Correction to "Anode and Cathode Arc Root Movement During Contact Opening at High Current"

J. W. McBride and P. A. Jeffery

[p. 344]

ANNOUNCEMENTS

Assembly Packaging Manufacturing: An Interactive Workshop

[p. 345]

Call for Papers--7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

[p. 346]

Call for Papers--50th IEEE Electronic Components and Technology Conference

[p. 347]

Call for Papers--5th International Workshop on Thermal Investigations of ICs and Systems

[p. 348]