Editorial

M. G. Pecht

[p. 353]

Terminology For Use of Parts Outside Manufacturer-Specified Temperature Ranges

L. Condra, R. Hoad, D. Humphrey, T. Brennom, J. Fink, J. Heebink, C. Wilkinson, D. Marlborough, D. Das, N. Pendse, and M. G. Pecht

[p. 355]

REGULAR PAPERS

Contact Physics of Gold Microcontacts for MEMS Switches

D. Hyman and M. Mehregany

[p. 357]

A Study of Lubricants on Silver Flakes for Microelectronics Conductive Adhesives

D. Lu, Q. K. Tong, and C. P. Wong

[p. 365]

The Analysis of the Withdrawal Force Curve of the Wetting Balance Curve

J. Y. Park, J. P. Jung, and C. S. Kang

[p. 372]

Future Heat Transfer Concerns in Josephson Junction Computers

K. S. McFall and L. C. Chow

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Integrated Single and Two-Phase Micro Heat Sinks Under IGBT Chips

C. Gillot, L. Meysenc, C. Schaeffer, and A. Bricard

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X- and Gamma-Ray Hardness of Floating-Gate EEPROM Technology as Applied to Implantable Medical Devices

D. Prutchi, J. L. Prince, and L. J. Stotts

[p. 390]

Experimental Optimization of Confined Air Jet Impingement on a Pin Fin Heat Sink

L. A. Brignoni and S. V. Garimella

[p. 399]

Influence of Contact Geometry and Current on Effective Erosion of Cu-Cr, Ag-WC, and Ag-Cr Vacuum Contact Materials

M. B. Schulman, P. G. Slade, L. D. Loud, and W. Li

[p. 405]

Analysis of Thermal Warpage in a PCB with an Array of PTH Connectors

B. Djurovic, C. A. Puzzo, and J. K. Spelt

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In situ

Measurement of Thermomechanical Effects and Properties in Thin-Film Polymers

S. D. Bluestein, E. K. Chan, I. N. Miaoulis, and P. Y. Wong

[p. 421]

Evaluating IC-Package Interface Delamination by Considering Moisture-Induced Molding-Compound Swelling

N. Tanaka, M. Kitano, T. Kumazawa, and A. Nishimura

[p. 426]

Punchthrough Behavior in Short Channel NMOS and PMOS 6H-Silicon Carbide Transistors at Elevated Temperatures

M. P. Lam and K. T. Kornegay

[p. 433]

Influence of Physical/Chemical Characteristics of Organic Vapors and Gas Mixtures on their Contact Compatibility

H. P. Koidl, W. F. Rieder, and Q. R. Salzmann

[p. 439]

1/f Noise as a Diagnostic Tool to Investigate the Quality of Isotropic Conductive Adhesive Bonds

L. K. J. Vandamme, M. G. Perichaud, E. Noguera, Y. Danto, and U. Behner

[p. 446]

Characteristics of W-ThO₂ Thermionic Cathode Activated With Nanoscale Oxide

H. Zhang, Z. Yang, and B. Ding

[p. 455]

Nickel Matrix Composite Electrocoatings as Electrical Contacts

C. T. Dervos, C. Kollia, S. Psarrou, and P. Vassiliou

[p. 460]

The Preparation and the Properties of Microcrystalline and Nanocrystalline CuCr Contact Materials

Y. Wang and B. Ding

[p. 467]

ANNOUNCEMENTS

Call for Papers--50th IEEE Electronic Components and Technology Conference

[p. 473]