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1998 INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC PACKAGES

Foreword

K. Ramakrishna, B. G. Sammakia, G. Subbarayan, B. Mirman, and G. B. Kromann

[p. 481]

Void-Effect Modeling of Flip-Chip Encapsulation on Ceramic Substrate

T.-M. Niu, B. G. Sammakia, and S. Sathe

[p. 484]

Solder Joint Reliability of High I/O Ceramic-Ball-Grid Arrays and Ceramic Quad-Flat-Packs in Computer Environments: The PowerPC 603™ and PowerPC 604™ Microprocessors

R. D. Gerke and G. B. Kromann

[p. 488]

An Integrated Modeling Approach to Solder Joint Formation

C. Bailey, D. Wheeler, and M. Cross

[p. 497]

Finite Element Analysis of Interface Cracking in Semiconductor Packages

A. O. Ayhan and H. F. Nied

[p. 503]

Influence of Temperature, Humidity, and Defect Location on Delamination in Plastic IC Packages

A. A. O. Tay and T. Y. Lin

[p. 512]

Adhesion Issues in Flip-Chip on Organic Modules

S. K. Tran, D. L. Questad, and B. G. Sammakia

[p. 519]

The Accuracy of Structural Approximations Employed in Analysis of Area Array Packages

L. Zhang, B. Hunter, G. Subbarayan, and D. Rose

[p. 525]

REGULAR PAPERS

Properties of Molding Compounds to Improve Package Reliability of SMD's

K. Tada and H. Fujioka

[p. 534]

Transient Thermal Management of Temperature Fluctuations During Time Varying Workloads on Portable Electronics

M. J. Vesligaj and C. H. Amon

[p. 541]

Effect of BOE Etching Time on Wire Bonding Quality

C. M. Tan, K. Linggajaya, E. Er, and V. S.-H. Chai

[p. 551]

Numerical Analysis of Fine Lead Bonding--Effect of Pad Mechanical Properties on Interfacial Deformation

Y. Takahashi, M. Inoue, and K. Inoue

[p. 558]

Significant Increase of the Dielectric Performance of Plastic Sealed Telecom Relays

K. J. Fröhlich and W. Johler

[p. 567]

Microwave Model of Anisotropic Conductive Film Flip-Chip Interconnections for High Frequency Applications

M.-J. Yim, W. Ryu, Y.-D. Jeon, J. Lee, S. Ahn, J. Kim, and K.-W. Paik

[p. 575]

Resolution of Broadband Transducers in Acoustic Microscopy of Encapsulated ICs: Transducer Selection

S. Canumalla

[p. 582]

OPEN FORUM

Editorial

M. G. Pecht

[p. 593]

Address to the Fifth National Symposium on Reliability and Quality Control

W. T. Thurman

[p. 594]

ANNOUNCEMENTS

Call for Papers--12th Symposium on Mechanics of SMT Assemblies and Photonics Structures

[p. 597]

1999 INDEX Follows page

[p. 603]