Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely
download the PDFs of any of these papers, at the XPLORE On-Line Library.
Guests may access abstract/citation records free of charge.
IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A
March 1995, Volume 18, Issue 1
ENVIRONMENTAL STRESS TESTING
-
FOREWORD
-
P. J. Englert
-
Environmental Stress Testing Experiment Using the Taguchi
Method
-
D. E.
Pachucki
-
Reliability Development and Qualification of a Low-Cost
PQFP-Based MCM
-
P. Thompson
-
Effects of Die Coatings, Mold Compounds, and Test
Conditions on Temperature Cycling
Failures
-
L. T. Nguyen, S. A. Gee, M. R. Johnson, H. E. Grimm, H. E. Berardi, and R.
L. Walberg
-
The Benefits of Stress
Testing
-
H. A.
Chan
CONTRIBUTIONS FROM THE TENTH SEMITHERM SYMPOSIUM
-
FOREWORD
-
V. P. Manno and R. E. Simons
-
An Exact Recursion Relation Solution for the Steady-State
Surface
Temperature of a General Multilayer
Structure
-
J. Albers
-
Analysis of Thermal Transient Data with Synthesized
Dynamic Models for
Semiconductor Devices
-
J. W.
Sofia
-
An Effective Alternative for Marginal Thermal Improvements
of
Semiconductor Devices
-
B. Siegal and M.
Berg
-
Thermal Enhancement of Plastic IC
Packages
-
D. R. Edwards, M. Hwang, and
B. Stearns
-
Liquid Cooling Performance for a 3-D Multichip Module and
Miniature Heat Sink
-
M. R.
Vogel
THERMAL FOCUS
-
FOREWORD
-
A. Bar-Cohen
-
Thermal Characterization of a Tape Carrier
Package
-
D. E. Pope and H. T.
Do
-
A Novel Active Area Bumped Flip Chip Technology for
Convergent Heat Transfer from Gallium Arsenide Power
Devices
-
D. Gupta
-
Thermal Modeling and Experimental Characterization of the
C4/Surface-Mount-Array Interconnect
Technologies
-
G. B. Kromann
-
Exceptional Performance from the Development,
Qualification and Implementation of a Silicone Adhesive for Bonding
Heatsinks to Semiconductor
Packages
-
S. Bosworth, S. C. Hsu, and
J. Polcari
-
Analysis of TAB Inner Lead Fatigue in Thermal Cycle
Environments
-
K. D.
Cluff
-
A Boundary Element Formulation of the Conjugate Heat
Transfer from a Convectively Cooled Discrete Heat Source Mounted on a
Conductive
Substrate
-
H. Kabir, A. Ortega, and C.
L. Chan
CONTRIBUTIONS FROM THE 44TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
FOREWORD
R. R. Tummala
Printed Circuit Boards And Interconnects
Process Considerations in the Fabrication of Fluoropolymer
Printed
Circuit Boards
D. N. Light and J. R.
Wilcox
Fine Line Circuit Manufacturing Technology with
Electroless Copper
Plating
H. Akahoshi, M. Kawamoto, T. Itabashi, O. Miura,
A. Takahashi, S. Kobayashi, M. Miyazaki, T. Mutoh, M.
Wajima, and T. Ishimaru
Carrier and Socket Technology for High Pin Count QFP
Packages
J. W. Foerstel
An Investigation of Solder Joint Fatigue Using Electrical
Resistance
Spectroscopy
J. H. Constable and C.
Lizzul
Influence of Temperature and Humidity on the Wettability
of Immersion
Tin Coated Printed Wiring
Boards
U. Ray, I. Artaki, and P. T. Vianco
Radio-Frequency Connector and Interconnect Reliability in
Spaceborne
Applications
E. Nhan, P. M. Lafferty, R. K. Stilwell, and K.
Chao
Passive Devices and Structures
High Reliability Internal Capacitor of
LTCC
Y. Baba, H. Ochi, and S.
Segawa
Thin-Film Decoupling Capacitors for Multichip
Modules
D. Dimos, S. J. Lockwood, R. W. Schwartz, and M. S. Rodgers
Capacitance Monitoring while Flex
Testing
J. D. Prymak and J.
Bergenthal
Semiconductor Technology and Processes
Silicon On Insulator-An Emerging High-Leverage
Technology
B. El-Kareh, B. Chen, and
T. Stanley
Plasma Resistant Modified
$I$-Line, Deep UV, and
$E$-Beam
Resists
J. E. Bousaba, F. M. Tranjan, L. E.
Qushair, T. D. DuBois, S. M. Bobbio, M. T. Jose, J. L. Nickel, S. K.
Jones, and B. W. Dudley
Manufacturing Stresses in the Die Due to the Die-Attach
Process
P.-H. Tsao and A. S.
Voloshin
REGULAR PAPERS
-
Intrinsic
Thermocouple Monitor for Laser
Wirebonding
-
B. W. Hussey, G. Arjavalingam, A. Gupta, P. A. Chalco, and H.
Tong
-
Simulations
and Measurements of Picosecond Signal Transients, Propagation, and
Crosstalk on Lossy VLSI
Interconnect
-
Y. Eo and W. R. Eisenstadt
-
Observations on Competing Mechanisms Governing the
- Responses of Nonlinear Ceramic
Capacitors
-
C. K. Campbell, J. D. Van Wyk, and M. F. K.
Holm
-
Gold Wire Weakening in the Thermosonic Bonding of the
First Bond
-
S. J. Hu, R. K. S. Lim, and
G. Y. Sow
CALL FOR PAPERS
-
ITHERM
'96
-
IEEE
COPYRIGHT
FORM
Return to CPMT Transactions' Tables of Contents