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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A

June 1995, Volume 18, Issue 2

EDITORIAL

P. Wesling

CONTRIBUTIONS FROM THE SECOND INTERNATIONAL CONFERENCE ON ELECTRONIC COMPONENTS AND MATERIALS

FOREWORD

C. P. Wong, A. Lin, and Z. Zhou

Intelligent Materials in Future Electronics

K. Takahashi and S. Nozaki

A New Smart Material-Multilayer PTC Thermistor

L. Wang and Z. Zhou

Development of Gas Sensors for Environmental Protection

N. Yamazoe and N. Miura

A New Type of Linear Piezoelectric Stepper Motor

S. Dong, L. Li, Z. Gui, T. Zhou, and X.-W. Zhang

Piezoelectric Properties of “$d\_\{31\}$-Zero”, “$d\_\{33\}$-Zero” or “$d\_h$-Zero” 0-3, 1-3 or 2-2 Composite of Polymer and Ceramic Powder of PbTiO$\_3$ and/or PZT

H. Banno

Electrical Properties of Surfaces of Unirradiated and Irradiated Polymers in Humid Environments

D. K. Das-Gupta and W. F. Schmidt

Thermal-Mechanical Enhanced High Performance Silicone Gels and Elastomeric Encapsulants in Microelectronic Packaging

C. P. Wong

Approaches to Electronic Miniaturization

H. M. B. Bird

CONTRIBUTIONS FROM THE 16th ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM

FOREWORD

T. J. Maloney

Field-Induced ESD from CRT's: Its Cause and Cure

J. P. Franey and R. G. Renninger

Influence of Tester, Test Method, and Device Type on CDM ESD Testing

K. Verhaege, G. V. Groeseneken, H. E. Maes, P. Egger, and H. Gieser

A Correlation Study Between Different Types of CDM Testers and “Real” Manufacturing In-Line Leakage Failures

M. D. Chaine, C. T. Liong, and H. F. San

ESD Protection in a Mixed Voltage Interface and Multirail Disconnected Power Grid Environment in 0.50- and 0.25-$\backslash mu$m Channel Length CMOS Technologies

S. H. Voldman

The Impact of Technology Scaling on ESD Robustness and Protection Circuit Design

A. Amerasekera and C. Duvvury

CONTRIBUTIONS FROM THE 40TH IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS

FOREWORD

G. Horn

A Sensitive Device for the Measurement of the Force Exerted by the Arc on the Electrodes

J.-P. Chabrerie, J. Devautour, A. M. Gouega, and Ph. Teste

Effective Erosion Rates for Selected Contact Materials in Low-Voltage Contactors

M. B. Schulman, P. G. Slade, and J. A. Bindas

Polarity Effect of Unsymmetrical Material Combination on the Arc Erosion and Contact Resistance Behavior

Z.-K. Chen and K. Sawa

Estimation of Properties of Contact Materials Used in Vacuum Interrupters Based on the Investigations

H. Mo{\it \'{s}}cicka-Grzesiak, W. Ziomek, and K. Siodła

Effects of Cracks on Contacts Operating Under High Contact Force

H. A. Francisco and J. L. Wallace

Reliability of the Asperity Contact Model in Determining Charge Injection Across Interfaces

C. T. Dervos

Elaboration of Heat-Treated Thin Films of Polyacrylonitrile for Connector Applications

F. Houzé, S. Noël, P. Newton, L. Boyer, P. Viel, and G. Lécayon

Electrical Characteristics of Various Contact Contaminations

C. N. Neufeld and W. F. Rieder

Wear Rate Reductions in Carbon Brushes, Conducting Current, and Sliding Against Wavy Copper Surfaces

M. D. Bryant, A. Tewari, and J.-W. Lin

REGULAR PAPERS

Electrical Contacts

Computer Simulation for the Constriction Resistance Depending on the Form of Conduction Spots

M. Nakamura

Constriction Resistance of Microcone-Based Contacts

J. J. Gu, K. Warner, S. Qin, and C. Chan

Reliability of Electrically Conducting Knife-Edge Bearings of Switches

T. J. Sch\accent'177opf and W. F. Rieder

Carbon Contamination of Contacts Due to Organic Vapors

C. N. Neufeld and W. F. Rieder

Protective Treatment for Gold-Flashed Contact Finishes with a Nickel Substrate

H. H. Law, J. Sapjeta, and E. S. Sproles Jr.

Effect of Oxide Films and Arc Duration Characteristics on Ag Contact Resistance Behavior

Z.-K. Chen and K. Sawa

Sequential Modes of Drawn Vacuum Arcs Between Butt Contacts for Currents in the 1 kA to 16 kA Range

M. B. Schulman and P. G. Slade

Materials, Processes, and Design

Optimization of Copper Wire Bonding on Al-Cu Metallization

L. T. Nguyen, D. McDonald, A. R. Danker, and P. Ng

Shock Protection with a Nonlinear Spring

E. Suhir

Effect of Gallium Oxide on Crystallization and Thermal Expansion Behavior of Low

k Glass Composite

J.-H. Jean and T. K. Gupta

ANNOUNCEMENTS

Call for Papers: Highly Accelerated Stress Testing

Special Sections Planned for 1995--1996