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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A

December 1995, Volume 18, Issue 3

CONTRIBUTIONS FROM THE SEMITHERM XI CONFERENCE

FOREWORD

V. P. Manno and R. E. Simons

Thermal Characterization of Electronic Devices with Boundary Condition Independent Compact Models

C. J. M. Lasance, H. Vinke, and H. Rosten

Achieving Accurate Thermal Characterization Using a CFD Code---A Case Study of Plastic Packages

J. Burgos, V. P. Manno, and K. Azar

An Assessment of the Thermal Performance of the PBGA Family

S. Mulgaonker, B. Chambers, and M. Mahalingam

Analysis of a Thermally Enhanced Ball Grid Array Package

B. M. Guenin, R. C. Marrs, and R. J. Molnar

Methodology for Thermal Evaluation of Multichip Modules

B. S. Lall, B. M. Guenin, and R. J. Molnar

Thermal Characterization of Vertical Multichip Modules MCM-V

C. Cahill, A. Compagno, J. O'Donovan, O. Slattery, S. C. ó Mathuna, J. Barrett, I. Serthelon, C. Val, J.-P. Tigneres, J. Stern, P. Ivey, M. Masgrangeas, and A. Coello-Vera

A Methodology for Laser-Based Thermal Diffusivity Measurement of Advanced MultiChip Module Ceramic Materials

L. Kehoe, P. V. Kelly, G. M. O'Connor, M. O'Reilly, and G. M. Crean

Asymptotic Thermal Analysis of Electronic Packages and Printed-Circuit Boards

D.-G. Liu, V. Phanilatha, Q.-J. Zhang, and M. S. Nakhla

Experimental Investigation of Subcooled Liquid Nitrogen Impingement Cooling of a Silicon Chip

D. T. Vader, G. M. Chrysler, R. C. Chu, and R. E. Simons

High Performance Forced Air Cooling Scheme Employing Microchannel Heat Exchangers

M. B. Kleiner, S. A. K\"uhn, and K. Haberger

The Evolution of IBM High Performance Cooling Technology

R. E. Simons

Optimum Design and Selection of Heat Sinks

S. Lee

REGULAR PAPERS

Heat-Transfer Engineering in Systems Integration: Outlook for Closer Coupling of Thermal and Electrical Designs of Computers

W. Nakayama

Substrate Temperatures of Liquid Nitrogen Cooled Multichip Modules Utilizing Wirebonded Die

R. K. Ulrich and S. Rajan

Degradation of Gold-Aluminium Ball Bonds by Aging and Contamination

V. Koeninger, H. H. Uchida, and E. Fromm

Fine Line Thin Dielectric Circuit Board Characterization

C. S. Chang and A. P. Agrawal

Development of an Inspection Process for Ball-Grid-Array Technology Using Scanned-Beam X-Ray Laminography

S. M. Rooks, B. Benhabib, and K. C. Smith

CORRESPONDENCE

Correction to "A Simple Test Chip to Assess Chip and Package Design in the Case of Plastic Assembling"

P. Alpern, V. Wicher, and R. Tilgner

1995 INDEX