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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

SEPTEMBER 1996, Volume 19, Issue 3

CONTRIBUTIONS from the HOLM Conference on Electrical Contacts

FOREWORD

R. S. Timsit

Aluminum Connectors

Mechanical and Electrical Contact Properties of Wedge-Connectors

J. J. Schindler, R. T. Axon, and R. S. Timsit

Shape-Memory Alloy Mechanical Contact Devices

M. Braunovic and C. Labrecque

Corrosion

Corrosion Control and Lubrication of Plated Noble Metal Connector Contacts

M. Antler

Arcing Fundamentals

Post Bridge Phenomena in Electrical Contacts at the Initial Stage

S. N. Kharin

Temperature Measurement and Metallurgical Study of Cathodes in DC Arcs

X. Zhou, B. Ding, and J. V. R. Heberlein

Relays: Contamination

Effect of Silicone Vapor and Humidity on Contact Reliability of Micro Relay Contacts

T. Tamai

A Two-Step Procedure to Evaluate Contact Compatibility of Organic Materials

W. F. Rieder and Q. R. Salzmann

Relays

Thermal Modeling of Electrical Contacts in Switches and Relays

C. H. Leung, A. Lee, and B.-J. Wang

Towards the Control of Contact Bounce

T. S. Davies, H. Nouri, and F. W. Britton

Sliding Contacts

Electrical Fiber Brushes--Theory and Observations

D. Kuhlmann-Wilsdorf

A Study on Brush Wear Under Commutation Arcs in Gasoline

T. Yamamoto, K. Bekki, and K. Sawa

High Current Switch Arcs

Arc-Wall Interaction Phenomena Immediately After Contact Separation in Magnet-Blast Interrupters

E. Gauster and W. F. Rieder

Silver CAD Oxide/Silver Tin Oxide

Make-and-Break Erosion of Ag/MeO Contact Materials

E. Hetzmannseder and W. F. Rieder

The Erosion and Arc Characteristics of Ag/CdO and Ag/SnO₂ Contact Materials Under DC Break Conditions

J. Swingler and J. W. McBride

REGULAR PAPERS

A Hybrid 6H-SiC Temperature Sensor Operational from 25 ^oC to 500 ^oC

J. B. Casady, W. C. Dillard, R. W. Johnson, and U. Rao

Grain-Boundary Surface States of (Ba, Pb)TiO₃ Positive Temperature Coefficient Ceramics Doped with Different Additives and Its Influence on Electrical Properties

L-F. Chen and T-Y. Tseng

Evaporation Cooling of High Power Electronic Devices

G. N. Dulnev, V. A. Korablyev, and A. V. Sharkov

Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During Drop Tests: Effect of Viscous Damping

E. Suhir

OPEN FORUM

EDITORIAL

M. Pecht

Honeywell's Experience with Screening Plastic Encapsulated Microcircuit

J. Jordan and J. Fink

Papers Submitted for Publication