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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

DECEMBER 1996, Volume 19, Issue 4

CONTRIBUTIONS FROM THE 12th SEMITHERM SYMPOSIUM

FOREWORD

V. P. Manno, R. E. Simon, and T. S. Tarter

[p. 449]

Thermal Performance of an MCM Flip-Chip Assembly in Liquid Nitrogen

R. K. Ulrich and S. Rajan

[p. 451]

Analysis of Thermally Enhanced SOIC Packages

B. M. Guenin, A. R. Chowdhury, R. L. Groover, and E. J. Derian

[p. 458]

Thermal Evaluation of a PowerPC 620 Multiprocessor in a Multiprocessor Computer

H. Wong and T.-Y. T. Lee

[p. 469]

Development of JEDEC Standard Thermal Measurement Test Boards

D. Edwards

[p. 478]

Design and Optimization of Pin Fin Heat Sinks for Low Velocity Applications

H. Shaukatullah, W. R. Storr, B. J. Hansen, and M. A. Gaynes

[p. 486]

Design Considerations for Air Cooling Electronic Systems in High Altitude Conditions

C. L. Belady

[p. 495]

Three-Dimensional Thermal Modeling Based on the Two-Port Network Theory for Hybrid or Monolithic Integrated Power Circuits

J.-M. Dorkel, P. Tounsi, and P. Leturcq

[p. 501]

REGULAR PAPERS

Improving the Frequency Response of Ceramic Dielectrics for High Power Applications in Power Electronic Converters

C. K. Campbell, J. D. van Wyk, and M. F. K. Holm

[p. 508]

Wafer Through-Hole Interconnections with High Vertical Wiring Densities

C. Christensen, P. Kersten, S. Henke, and S. Bouwstra

[p. 516]

Development of Modular Products

A. Kusiak and C.-C. Huang

[p. 523]

A Closed Form Solution of Junction to Substrate Thermal Resistance in Semiconductor Chips

F. N. Masana

[p. 539]

Mechanism of Electrical Conduction Through Anisotropically Conductive Adhesive Films

M. Mizuno, M. Saka, and H. Abé

[p. 546]

Laser Linking of Metal Interconnect: Linking Dynamics and Failure Analysis

R. L. Rasera and J. B. Bernstein

[p. 554]

In-Process Board Warpage Measurement in a Lab Scale Wave Soldering Oven

M. R. Stiteler, I. C. Ume, and B. Leutz

[p. 562]

OPEN FORUM

EDITORIAL

M. Pecht

[p. 570]

ANNOUNCEMENTS

Associate Editors

A. Bar-Cohen

[p. 574]

Papers Submitted for Publication

[p. 577]

1996 INDEX

Follows page

[p. 577]