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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies
June 1997, Volume 20, Number 02
CONTRIBUTIONS from the
InterSociety Conference on Thermal Phenomena in Electronic Systems (ITHERM '96)
- Foreword
- J.
S. Fitch
[p. 94]
- Manifold Microchannel Heat Sinks: Isothermal
Analysis
- D.
Copeland, M. Behnia, and W. Nakayama
[p. 96]
- Integrated Thermal Analysis of Indirect Air-Cooled
Electronic
Chassis
- L.
Tang and Y. K. Joshi
[p. 103]
- Analysis and Optimization of a Natural Draft Heat Sink
System
- T.
S. Fisher, K. E. Torrance, and K. K.
Sikka
[p. 111]
- Liquid Encapsulated MCM Package--Thermal
Demonstration
- T.-Y.
T. Lee, V. Hause, and M. Mahalingam
[p. 120]
- Thermal Management and Concurrent System Design of a
Wearable
Multicomputer
- C.
H. Amon, E. R. Egan, A. Smailagic,
and D. P. Siewiorek
[p. 128]
- Heat Transfer from Micro-Finned Surfaces to Flow of
Fluorinert Coolant
in Reduced-Size
Channels
- H.
Mizunuma, M. Behnia, and W. Nakayama
[p. 138]
- The Reliability Nomograph--Graphical Predictor of
Package/Module
Interconnect
Reliability
- R.
Iannuzzelli
[p. 146]
- Effects of Package Orientation and Mixed Convection on
Heat Transfer
from a
PQFP
- K.
K. Sikka, T. S. Fisher, K. E. Torrance, and C. R.
Lamb
[p. 152]
- Development of Prediction Technique for Cooling
Performance of Finned
Heat Sink in Uniform Flow
- Y. Sata, H.
Iwasaki, and M. Ishizuka
[p. 160]
- Distribution of Heat Transfer Coefficients from Small
Surfaces Cooled
with Submerged Jets of Fluorocarbon Liquid Determined by Inverse
Analysis of Heat Conduction
- A. Nishihara, S. Sasaki, Y. Ohsone,
and T. Nakajima
[p. 167]
CONTRIBUTIONS from the 1996
International Nonvolatile Memory Technology Conference (INVMTC '96)
- Foreword
- J.
E. Brewer
[p. 174]
- Ferroelectric Nonvolatile Memory Technology:
Applications and
Integration Challenges
- P. Zurcher, R. E. Jones, P. Y. Chu,
D. J. Taylor, B. E. White, Jr.,
S. Zafar, B. Jiang, Y.-J. T. Lii, and S. J.
Gillespie
[p. 175]
- A Dual Gate Flash EEPROM Cell with Two-Bit Storage
Capacity
- M.
Lorenzini, M. V. Rudan, and G.
Baccarani
[p. 182]
- A Low Voltage SONOS Nonvolatile Semiconductor Memory
Technology
- M. H. White, Y.
Yang, A. Purwar, and M. L. French
[p. 190]
- Voltage Variant Source Side Injection for Multilevel
Charge Storage in
Flash EEPROM
- D. Montanari, J. Van Houdt, D.
Wellekens, G. Vanhorebeek, L. Haspeslagh, L. Deferm, G. Groeseneken, and
H. E. Maes
[p. 196]
- Materials and Systems for Two Photon 3-D ROM
Devices
- A. S. Dvornikov, I.
Cokgor, M. Wang, F. B. McCormick, Jr., S. C. Esener, and P. M.
Rentzepis
[p. 203]
REGULAR PAPERS
- Heat Transfer and Nonlinear Thermal Stress Analysis of a
Convective
Surface Mount
Package
- B.
Z. Hong and T.-D. Yuan
[p. 213]
- Thermal Analysis of GaAs Power Monolithic Microwave IC's
Mounted with
Epoxy
Attachment
- K.
Nishihori, K. Ishida, Y. Kitaura, and N.
Uchitomi
[p. 220]
- A Simple Closed-Form Solution for Evaluation of Radiative
Heat Transfer from a Rectangular Fin
Array
- B.
M. Abramzon
[p. 225]
- Thermal Modeling of High Performance Packages in Portable
Computers
- R.
Viswanath and I. A. Ali
[p. 230]
- Stresses in Thin Film
Metallization
- T.
C. Hodge, S. A. Bidstrup-Allen, and P. A.
Kohl
[p. 241]
OPEN FORUM
- Editorial
- M. G.
Pecht
[p. 251]
- Uprating Electronic Components for Use Outside Their
Temperature Specification
Limits
- M.
B. Wright, D. Humphrey, and F. P.
McCluskey
[p. 252]
- Papers Submitted for
Publication
[p. 257]
ANNOUNCEMENTS
- Call for Papers--Sixth Intersociety Conference
on Thermal and Thermomechanical Phenomena
[p. 259]
- Call for Papers--Fourteenth Annual IEEE Semiconductor
Thermal Measurement and Management Symposium
[p. 260]
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