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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

September 1997, Volume 20, Number 03

CONTRIBUTIONS from the InterSociety Conference on Thermal Phenomena in Electronic Systems (ITHERM '96)

Foreword

J. S. Fitch

[p. 265]

Fatigue-Strength Prediction of Microelectronics Solder Joints Under Thermal Cyclic Loading

Q. Yu and M. Shiratori

[p. 266]

Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages

J. E. Galloway and B. M. Miles

[p. 274]

Modeling Thermally Induced Viscoplastic Deformation and Low Cycle Fatigue of CBGA Solder Joints in a Surface Mount Package

B. Z. Hong and L. G. Burrell

[p. 280]

Thermal Phenomena in Compact Electronic Enclosures: A Numerical Study

V. K. Maudgal

[p. 286]

REGULAR PAPERS

Finite Element Analysis of PWB Warpage Due to the Solder Masking Process

I. C. Ume, T. Martin, and J. T. Gatro

[p. 295]

Finite Element Analysis of PWB Warpage Due to Cured Solder Mask: Sensitivity Analysis

I. C. Ume and T. Martin

[p. 307]

Coffin-Manson Fatigue Model of Underfilled Flip-Chips

V. Gektin, A. Bar-Cohen, and J. Ames

[p. 317]

A Study on Thermal Stress Reliability of Si-Based PLC Substrate

I. Kitazawa, S. Mino, and Y. Hibino

[p. 327]

A High Heat Flux IGBT Micro Exchanger Setup

L. Meysenc, L. Saludjian, A. Bricard, S. Rael, and C. Schaeffer

[p. 334]

Adhesion Strength and Microstructural Evaluation in Electroless Ni-P Metallized AlN Substrate

C.-D. Young and J.-G. Duh

[p. 342]

1/f Noise in Bismuth Ruthenate Based Thick-Film Resistors

A. Peled, R. E. Johanson, Y. Zloof, and S. O. Kasap

[p. 355]

Three-Dimensional Visualization of Multilayered Assemblies using X-Ray Laminography

A. R. Kalukin and V. Sankaran

[p. 361]

OPEN FORUM

Editorial

M. G. Pecht

[p. 367]

Electronic Components Obsolescence

L. W. Condra, A. A. Anissipour, D. D. Mayfield, and M. G. Pecht

[p. 368]

Papers Submitted for Publication

[p. 372]

ANNOUNCEMENTS

Call for Papers--48th Electronic Components and Technology Conference

[p. 374]

Call for Papers--14th IEEE Semiconductor Thermal Measurement and Management Symposium

[p. 375]

IEEE 1997 International Conference on Innovative Systems in Silicon

[p. 376]