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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

December 1997, Volume 20, Number 04

CONTRIBUTIONS FROM THE 13TH SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT (SEMI-THERM) SYMPOSIUM

Foreword

S. Lee, V. P. Manno, and R. E. Simons

[p. 382]

The World of Thermal Characterization According to DELPHI--Part I: Background to DELPHI

H. I. Rosten, C. J. M. Lasance, and J. D. Parry

[p. 384]

The World Of Thermal Characterization According To DELPHI--Part II: Experimental and Numerical Methods

C. J. M. Lasance, H. I. Rosten, and J. D. Parry

[p. 392]

Thermal Characterization of Chip Packages--Evolutionary Development of Compact Models

A. Bar-Cohen and W. B. Krueger

[p. 399]

Compact Models for Accurate Thermal Characterization of Electronic Parts

H. Vinke and C. J. M. Lasance

[p. 411]

Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems

V. H. Adams, D. L. Blackburn, Y. K. Joshi, and D. W. Berning

[p. 420]

High Power Multichip Modules Employing the Planar Embedding Technique and Microchannel Water Heat Sinks

R. Hahn, A. Kamp, A. Ginolas, M. Schmidt, J. Wolf, V. Glaw, M. Töpper, O. Ehrmann, and H. Reichl

[p. 432]

Compact Air-Cooled Heat Sinks for Power Packages

A. Aranyosi, L. M. R. Bolle, and H. A. Buyse

[p. 442]

Design of Circular Heat Spreaders on Semi-Infinite Heat Sinks in Microelectronics Device Applications

P. Hui, H. S. Tan, and Y. S. Lye

[p. 452]

Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow

C. R. Biber

[p. 458]

Pressure Loss Modeling for Surface Mounted Cuboid-Shaped Packages in Channel Flow

P. Teertstra, M. M. Yovanovich, and J. R. Culham

[p. 463]

REGULAR PAPERS

Materials Properties and Reliability

Electro-Thermo-Mechanical Responses of Conductive Adhesive Materials

K. X. Hu, C.-P. Yeh, and K. W. Wyatt

[p. 470]

Intermetallic Compound Layer Development During the Solid State Thermal Aging of 63Sn-37Pb Solder/Au-Pt-Pd Thick Film Couples

P. T. Vianco, J. J. Stephens, and J. A. Rejent

[p. 478]

The Effect of Varying the Cu/Au Ratio on the Thermal-Cycle Fatigue Life of 95/5 PbSn Bumps

M. Haji-Sheikh, D. Ulz, and M. Campbell

[p. 491]

Fatigue Crack Propagation Along Polymer-Metal Interfaces in Microelectronic Packages

J. Guzek, H. Azimi, and S. Suresh

[p. 496]

Study of Delaminated Plastic Packages by High Temperature Moiré and Finite Element Method

S. Liu, J. Zhu, D. Zou, and J. Benson

[p. 505]

Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?

E. Suhir

[p. 513]

Thermal Design and Analysis

CFD Applied to Electronic Systems: A Review

P. G. Tucker

[p. 518]

Finite Element Simulation of the Temperature Cycling Tests

C. Basaran and R. Chandaroy

[p. 530]

On the Effect of Nonlinear Boundary Conditions for Heat Conduction in Diamond Heat Spreaders with Temperature-Dependent Thermal Conductivity

P. Hui and H. S. Tan

[p. 537]

OPEN FORUM

Editorial

M. G. Pecht

[p. 541]

Perspectives to Understand Risks in the Electronic Industry

A. Dasgupta, E. B. Magrab, D. K. Anand, K. Eisinger, J. McLeish, M. Torres, P. Lall, T. Dishongh, and A. Govind

[p. 542]

Papers Submitted for Publication

[p. 548]

1997 INDEX

Follows page

[p. 551]