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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

March 1998, Volume 21, Number 01

CONTRIBUTIONS FROM THE FORTY-SIXTH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

Foreword

J. E. Billigmeier

[p. 2]

A New Leadframe Design Solution for Improved Popcorn Cracking Performance

C. Lee, T. C. Wong, and H. Pape

[p. 3]

The Evaluation of Fast-Flow, Fast-Cure Underfills for Flip Chip on Organic Substrate

K.-L. B. Wun and G. Margaritis

[p. 13]

Development of High Conductivity Lead (Pb)-Free Conducting Adhesives

S. K. Kang, R. Rai, and S. Purushothaman

[p. 18]

Materials Characterization, Conduction Development, and Curing Effects on Reliability of Isotropically Conductive Adhesives

D. Klosterman, L. Li, and J. E. Morris

[p. 23]

CONTRIBUTIONS FROM THE FORTY-SECOND INTERNATIONAL HOLM CONFERENCE ON ELECTRICAL CONTACTS

Foreword--Electrical Contacts

R. S. Timsit

[p. 32]

Arc Motion and Pressure Formation in Low Voltage Switchgear

M. Lindmayer and J. Paulke

[p. 33]

Arc Mobility on Bouncing Contacts

E. Hetzmannseder and W. Rieder

[p. 40]

Measuring Equipment and Measurements of Adhesive Force Between Gold Electrical Contacts

A. Kobayashi, S. Takano, and T. Kubono

[p. 46]

Modeling of Energy Transport in Arcing Electrical Contacts to Determine Mass Loss

J. Swingler and J. W. McBride

[p. 54]

Arc Root Mobility During Contact Opening at High Current

J. W. McBride, P. M. Weaver, and P. A. Jeffery

[p. 61]

The Spatial Distributions of Spectral Intensity and Temperature in the Cross Section of an Arc Column Between Separating Pd Contacts

M. Takeuchi and T. Kubono

[p. 68]

Study of the Local Electrical Properties of Metal Surfaces Using an AFM with a Conducting Probe

O. Schneegans, F. Houze, R. Meyer, and L. Boyer

[p. 76]

Arc Lengthening Between Divergent Runners: Influence of Arc Current, Geometry, and Materials of Runners and Walls

E. Gauster and W. Rieder

[p. 82]

Simulation of the Gasdynamic and Electromagnetic Processes in Low Voltage Switching Arcs

F. Karetta and M. Lindmayer

[p. 96]

REGULAR PAPERS

The Development of Component-Level Thermal Compact Models of a C4/CBGA Interconnect Technology: The Motorola PowerPC 603 and PowerPC 604 RISC Microprocessors

J. Parry, H. Rosten, and G. B. Kromann

[p. 104]

Transient Thermal Management of Portable Electronics Using Heat Storage and Dynamic Power Dissipation Control

L. Cao, J. P. Krusius, M. A. Korhonen, and T. S. Fisher

[p. 113]

On the Positive Temperature Dependence of the Thermal Conductivity of a Diamond-Based Heat Sink Paste

D. P. H. Hasselman and K. Y. Donaldson

[p. 124]

Effects of Pre-Existing Interfacial Defects on the Stress Profile in Aluminum Interconnection Lines

Y.-L. Shen

[p. 127]

Efficient Design Using Fuzzy Logic Based Regression Models

B. Schaible, Y.-C. Lee, and H. Xie

[p. 132]

Multiobjective Optimal Placement of Convectively Cooled Electronic Components on Printed Wiring Boards

N. V. Queipo, J. A. C. Humphrey, and A. Ortega

[p. 142]

Green Design of Telecom Products: The ADSL High Speed Modem as a Case Study

P. De Langhe, S. Criel, and D. Ceuterick

[p. 154]

Analytical Modeling of Spreading Resistance in Flux Tubes, Half Spaces, and Compound Disks

M. M. Yovanovich, J. R. Culham, and P. Teertstra

[p. 168]

Thermo-Mechanical Models for Leadless Solder Interconnections in Flip Chip Assemblies

B. Vandevelde, F. Christiaens, E. Beyne, J. Roggen, J. Peeters, K. Allaert, D. Vandepitte, and J. Bergmans

[p. 177]

Modular Adapters for Fiber Optics

W. W. King and D. L. Stephenson

[p. 186]

OPEN FORUM

Editorial--Electronic Packaging: Cross-Discipline is the Only Discipline

M. G. Pecht

[p. 192]

ANNOUNCEMENTS

Call for Papers--ASME/IEEE-CPMT/IMAPS/SPE/AFM Workshop

[p. 195]

Call for Papers--7th Topical Meeting on Electrical Performance of Electronic Packaging

[p. 197]

Papers Submitted for Publication

[p. 198]

IEEE Copyright Form

[p. 203]