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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

June 1998, Volume 21, Number 02

CONTRIBUTIONS FROM THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING

Foreword--Polymeric Electronics Packaging

J. E. Morris and J. Liu

[p. 206]

Overview of Conductive Adhesive Interconnection Technologies for LCD's

H. Kristiansen and J. Liu

[p. 208]

Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art

J. C. Jagt

[p. 215]

Design and Understanding of Anisotropic Conductive Films (ACF's) for LCD Packaging

M.-J. Yim and K.-W. Paik

[p. 226]

Conduction Mechanisms in Anisotropic Conducting Adhesive Assembly

C. N. Oguibe, S. H. Mannan, D. C. Whalley, and D. J. Williams

[p. 235]

Characterization of Anisotropically Conductive Adhesive Interconnections by 1/f Noise Measurements

U. Behner, R. Haug, R. Schütz, and H. L. Hartnagel

[p. 243]

Quantitative Estimate of the Characteristics of Conductive Particles in ACA by Using Nano Indenter

X. Wang, Y. Wang, G. Chen, J. Liu, and Z. Lai

[p. 248]

Conductive Adhesive Materials for Lead Solder Replacement

K. Suzuki, O. Suzuki, and M. Komagata

[p. 252]

Current-Induced Degradation of Isotropically Conductive Adhesives

S. Kotthaus, R. Haug, H. Schäfer, and O.-D. Hennemann

[p. 259]

Underflow Process for Direct-Chip-Attachment Packaging

G. L. Lehmann, T. Driscoll. N. R. Guydosh, P. C. Li, and E. J. Cotts

[p. 266]

Impact of Underfill Filler Particles on Reliability of Flip-Chip Interconnects

K. Darbha, J. H. Okura, and A. Dasgupta

[p. 275]

Measurements of Solder Bump Lifetime as a Function of Underfill Material Properties

J. B. Nysæther, P. Lundström, and J. Liu

[p. 281]

A Low Temperature Interconnection Method for Electronics Assembly

K. Kulojarvi and J. K. Kivilahti

[p. 288]

Glob-Top Reliability Characterization: Evaluation and Analysis Methods

R. Doyle, B. O'Flynn, W. Lawton, J. Barrett, and J. Buckley

[p. 292]

FE-Simulation for Polymeric Packaging Materials

R. Dudek, M. Scherzer, A. Schubert, and B. Michel

[p. 301]

REGULAR PAPERS

Effect of Arc Behavior on Material Transfer: A Review

Z.-K. Chen and K. Sawa

[p. 310]

The Effect of Underfill Epoxy on Warpage in Flip-Chip Assemblies

W. Zhang, D. Wu, B. Su, S. A. Hareb, Y. C. Lee, and B. P. Masterson

[p. 323]

Bonding Mechanism of Electroless Ni-P Film with AlN Substrate and Cu Foil

C.-D. Young and J.-G. Duh

[p. 330]

Applicability and Correction of Temperature-Voltage Relation in the Case of Point Contact

Y. Sano and T. Kaneko

[p. 345]

Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions

F. P. McCluskey, E. B. Hakim, J. Fink, A. Fowler, and M. G. Pecht

[p. 352]

Fast-Flow Underfill Encapsulant: Flow Rate and Coefficient of Thermal Expansion

C. P. Wong, M. B. Vincent, and S. Shi

[p. 360]

Evaluation of the Creep of the SN₆₂Pb₃₆Ag₂ Solder Alloy by the Measurement of the Stresses in a Silicon Die

P. Rey, E. Woirgard, J.-M. Thebaud, and C. Zardini

[p. 365]

OPEN FORUM

Editorial

M. G. Pecht

[p. 373]

Why a New Parts Selection and Management Program?

B. Foucher, R. Kennedy, N. Kelkar, Y. Ranade, A. Govind, W. Blake, A. Mathur, and R. Solomon

[p. 375]

ANNOUNCEMENTS

Associate Editors

A. Bar-Cohen

[p. 383]

Call for Papers--ASME/IEEE-CPMT/IMAPS/SPE/AFM Workshop

[p. 386]

Call for Papers--15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

[p. 388]

Papers Submitted for Publication

[p. 389]