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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies
September 1998, Volume 21, Number 03
- Foreword--Thermal Investigations of IC's and
Microstructures
(THERMINIC)
- D.
L. Blackburn and B. Courtois
[p. 397]
- A Thermal Benchmark Chip: Design and
Applications
- V. Szekely, Cs.
Marta, M. Rencz, G. Vegh, Zs. Benedek, and S.
Török
[p. 399]
- Characterization of Self-Heating
in Advanced VLSI Interconnect Lines Based on Thermal Finite Element
Simulation
- S. Rzepka, K.
Banerjee, E. Meusel, and C. Hu
[p. 406]
- Adaptive Modeling of the Transients of Submicron
Integrated Circuits
- P. E. Raad, J. S. Wilson, and D. C.
Price
[p. 412]
- Propagation Analysis for Thermal
Modeling
- D. de
Cogan
[p. 418]
- Thermal Parameters Measurement Method of Electronics
Materials
- Z. Suszynski, M. Malinski,
and L. Bychto
[p. 424]
- Photothermal Examination of Adhesion in Semiconductor
Devices
- Z.
Suszynski
[p. 434]
- Radiative Properties of
SIMOX
- N. M. Ravindra, S. Abedrabbo, O. H.
Gokce, F. Tong, A. Patel, R. Velagapudi, G. D.
Williamson, and W. P. Maszara
[p. 441]
REGULAR PAPERS
- High Performance No-Flow Underfills for Low-Cost Flip-Chip
Applications:
Material
Characterization
- C.
P. Wong, S. H. Shi, and G. Jefferson
[p. 450]
- Packaging Factors Affecting the
Fatigue Life of Power Transistor Die
Bonds
- J. Evans and J. Y.
Evans
[p. 459]
- Conductive Adhesives for High-Frequency
Applications
- R. Sihlbom, M. Dernevik, Z. Lai, J.
P. Starski, and J. Liu
[p. 469]
- High Frequency Measurements and Simulations on Wire-Bonded
Modules on the Sequential Build-Up Boards
(SBU)
- R. Sihlbom, M.
Dernevik, M. Lindgren, J. P. Starski, Z. Lai, and J.
Liu
[p. 478]
- Development of Large-Area
BaTiO3 Ceramics with
Optimized Depletion Regions as Dielectrics for Planar Power Electronics
- C. K. Campbell, J. D. van Wyk, and
M. F. K. Holm
[p. 492]
- Effect of Surface Reactivity of Lubricants on the
Properties of Aluminum Electrical
Contacts
- R. S. Timsit, E. M.
Bock, and N. E. Corman
[p. 500]
- Precision Measurement and Mapping of Die-Attach Thermal
Resistance
- K. Kurabayashi and K. E.
Goodson
[p. 506]
- A Novel Lightweight Microwave Packaging
Technology
- D. M. Jacobson and S. P. S.
Sangha
[p. 515]
OPEN FORUM
- Editorial
- M. G.
Pecht
[p. 521]
- Getting the Quality and Reliability Terminology
Straight
- S.-B.
Lee, A. Katz, and C. Hillman
[p. 521]
- Papers Submitted for
Publication
[p. 524]
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