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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies
December 1998, Volume 21, Number 04
CONTRIBUTIONS FROM THE 43RD IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS
- Foreword
- M.
Braunovic
[p. 529]
- The Effect of Contact Capacitance on Current-Voltage
Characteristics of
Stationary Metal Contacts
- C. T. Dervos and J. M.
Michaelides
[p. 530]
- The Effect of Ion Neutralization Processes on Interfacial
Energy of
Stationary Contacts
- C. T. Dervos and J. M.
Michaelides
[p. 541]
- Arc Restrikes Yielding Back-Commutations in the Contact
Gap of Low
Voltage Interrupters
- E. Gauster and W.
Rieder
[p. 549]
- Modeling Contact Erosion in Three Phase Vacuum
Contactors
- J. J.
Shea
[p. 556]
REGULAR PAPERS
- A Generic Methodology for Deriving Compact Dynamic Thermal
Models, Applied to the PSGA
Package
- F. Christiaens, B.
Vandevelde, E. Beyne, R. Mertens, and J.
Berghmans
[p. 565]
- Coffin-Manson Based Fatigue Analysis of Underfilled
DCAs
- V. Gektin, A. Bar-Cohen,
and S. Witzman
[p. 577]
- Failure Analysis of Bond Pad Metal Peeling Using FIB and
AFM
- C. M.
Tan, E. Er, Y. Hua, and V. Chai
[p. 585]
- New Receptacle Optical Modules Using
Ferrule-Integrated Chip Carrier
With Solder-Bump-Bonded Photonic Device: Singlemode-Fiber-Based
High-Speed PIN PD
Receivers
- T.
Hayashi and H. Tsunetsugu
[p. 592]
- Anodic to Cathodic Arc Transition According to Break Arc
Lengthening
- N. B. Jemaa, L. Morin,
S. Benhenda, and L. Nedelec
[p. 599]
- An Investigation of the Contact Behavior of Electric
Distributed
Filament
Contacts
- J.
Xie, M. G. Pecht, J. A. Swift, and S. J.
Wallace
[p. 604]
OPEN FORUM
- Editorial
- M. G.
Pecht
[p. 610]
- The Role of Physical Implementation in Virtual Prototyping
of Electronic
Systems
- M. Lindell, P. Stoaks,
D. Carey, and P. Sandborn
[p. 611]
ANNOUNCEMENTS
- Call for
Papers--ASME/IEEE-CPMT/IMAPS/SPE/AFM Workshop
(POLY'99)
[p. 617]
- 1998 INDEX
- Follows page
[p. 618]
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