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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A:
Components and Packaging Technologies

December 1998, Volume 21, Number 04


CONTRIBUTIONS FROM THE 43RD IEEE HOLM CONFERENCE ON ELECTRICAL CONTACTS

Foreword
M. Braunovic

[p. 529]

The Effect of Contact Capacitance on Current-Voltage Characteristics of Stationary Metal Contacts
C. T. Dervos and J. M. Michaelides

[p. 530]

The Effect of Ion Neutralization Processes on Interfacial Energy of Stationary Contacts
C. T. Dervos and J. M. Michaelides

[p. 541]

Arc Restrikes Yielding Back-Commutations in the Contact Gap of Low Voltage Interrupters
E. Gauster and W. Rieder

[p. 549]

Modeling Contact Erosion in Three Phase Vacuum Contactors
J. J. Shea

[p. 556]


REGULAR PAPERS

A Generic Methodology for Deriving Compact Dynamic Thermal Models, Applied to the PSGA Package
F. Christiaens, B. Vandevelde, E. Beyne, R. Mertens, and J. Berghmans

[p. 565]

Coffin-Manson Based Fatigue Analysis of Underfilled DCAs
V. Gektin, A. Bar-Cohen, and S. Witzman

[p. 577]

Failure Analysis of Bond Pad Metal Peeling Using FIB and AFM
C. M. Tan, E. Er, Y. Hua, and V. Chai

[p. 585]

New Receptacle Optical Modules Using Ferrule-Integrated Chip Carrier With Solder-Bump-Bonded Photonic Device: Singlemode-Fiber-Based High-Speed PIN PD Receivers
T. Hayashi and H. Tsunetsugu

[p. 592]

Anodic to Cathodic Arc Transition According to Break Arc Lengthening
N. B. Jemaa, L. Morin, S. Benhenda, and L. Nedelec

[p. 599]

An Investigation of the Contact Behavior of Electric Distributed Filament Contacts
J. Xie, M. G. Pecht, J. A. Swift, and S. J. Wallace

[p. 604]


OPEN FORUM

Editorial
M. G. Pecht

[p. 610]

The Role of Physical Implementation in Virtual Prototyping of Electronic Systems
M. Lindell, P. Stoaks, D. Carey, and P. Sandborn

[p. 611]


ANNOUNCEMENTS

Call for Papers--ASME/IEEE-CPMT/IMAPS/SPE/AFM Workshop (POLY'99)
[p. 617]


1998 INDEX
Follows page

[p. 618]


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