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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

August 1995, Volume 18, Issue 3

CONTRIBUTIONS FROM THE SEVENTH IEEE INTERNATIONAL CONFERENCE ON WAFER SCALE INTEGRATION

FOREWORD

G. H. Chapman, J. E. Brewer, and S. K. Tewksbury

A Device Life Cycle Analysis of the WSI Associative String Processor

C. Peacock, H. Bolouri, and R. M Lea

Defect and Fault Tolerant Interconnection Strategies for WASP Devices

M. B. A. Hussaini, H. Bolouri, and R. M. Lea

Influence of Process Parameter Variations on the Signal Distribution Behavior of Wafer Scale Integration Devices

T. Gneiting and I. P. Jalowiecki

Test Vehicle for a Wafer-Scale Field Programmable Gate Array

B. Dufort and G. H. Chapman

A Wafer Level Testability Approach Based on an Improved Scan Insertion Technique

C. Bolchini, G. Buonanno, F. Ferrandi, D. Sciuto, M. Bombana, and P. Cavalloro

Modeling Intermediate Tests for Fault-Tolerant Multichip Module Systems

S. Kim and F. Lombardi

CONTRIBUTIONS FROM THE 44TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

Single Chip Packaging

Design of 0.35-mm Pitch QFP Lead and Its Assembly Technology

M. Totani, Y. Teshima, N. Ito, M. Nagatake, and H. Otaguro

296 Lead Fine Pitch (0.4 mm) Thin Plastic QFP Package with TAB Interconnect

P. Jain

Development of 0.45-mm Thick Ultra-Thin Small Outline Package

S. Omi, T. Maruyama, T. Ishio, A. Narai, Y. Sota, K. Toyosawa, K. Fujita, and T. Maeda

A Test Chip Design for Detecting Thin-Film Cracking in Integrated Circuits

S. A. Gee, M. R. Johnson, and K. L. Chen

Moisture Sensitivity and Reliability of Plastic Thermally Enhanced QFP Packages

L. Yip

Popcorn Phenomena in a Ball Grid Array Package

S.-H. Ahn and Y.-S. Kwon

Simultaneous Switching Noise: Influence of Plane-Plane and Plane-Signal Trace Coupling

A. Vaidyanath, B. Thoroddsen, J. L. Prince, and A. C. Cangellaris

Flip Chip Packaging

Compliant Bumps for Adhesive Flip-Chip Assembly

K. Keswick, R. L. German, M. Breen, and R. Nolan

PAPERS

Application of CFD Technology to Electronic Thermal Management

T.-Y. T. Lee, B. Chambers, and M. Mahalingam

Analysis of Transient Behavior of Vertical Interconnects in Stacked Circuit Board Layers Using Quasi-Static Techniques

G.-W. Pan, X. Zhu, and B. K. Gilbert

Analysis of Multilayer-Multiconductor Structures on Anisotropic Substrates Using the Finite Difference Method

D. D. Jatkar and B. Beker

Metallurgical Reactions at the Interface of Sn/Pb Solder and Electroless Copper-Plated AlN Substrate

B.-S. Chiou, J.-H. Chang, and J.-G. Duh

Design of Solder Joints for Self-Aligned Optoelectronic Assemblies

W. Lin, S. K. Patra, and Y. C. Lee

A Self-Aligned Optical Subassembly for Multi-Mode Devices

M. F. Dautartas, G. E. Blonder, Y.-H. Wong, and Y. C. Chen

Multigigabit Multichannel Optical Interconnection Modules for Asynchronous Transfer Mode Switching Systems

Y. Arai, H. Takahara, K. Koyabu, S. Fujita, Y. Akahori, and J. Nishikido

Processing and Characterization of Benzocyclobutene Optical Waveguides

C. F. Kane and R. R. Krchnavek

Computer-Controlled Pressure-Dispensed Multimode Polymer Waveguides

B. P. Keyworth, J. N. McMullin, R. Narendra, and R. I. MacDonald

Electrical Packaging Impact on Source Components in Optical Interconnects

M. A. Neifeld and W.-C. Chou

Flip-Chip Bump Bonding and Thermal Design Optimization of an 1-D Edge-Emitting Uncooled InP Laser Array on Silicon Optical Bench---Application in Parallel Optical Interconnection

Y.-M. Wong, H. Z. Chen, D. P. Kossives, L. J. Anthony, C. J. Doherty, M. Y. Lau, R. C. Frye, K. L. Tai, and F. W. Warning, Jr.

CALL FOR PAPERS

International Symposium on Advanced Packaging Materials

Area Array Packaging Technologies