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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

November 1995, Volume 18, Issue 4

CONTRIBUTIONS FROM THE 1995 IEEE MULTICHIP MODULE CONFERENCE (MCM'95)

FOREWORD

D. B. Tuckerman

A Silicon-On-Silicon Field Programmable Multichip Module (FPMCM)---Integrating FPGA and MCM Technologies

J. Darnauer, T. Isshiki, P. Garay, J. Ramirez, V. Maheshwari and W. W.-M. Dai

Experimental Characterization of Simultaneous Switching Noise for Multichip Modules

K. Ito, K. Kato, N. Hirano, and T. Sudo

Fault Isolation and Performance Characterization of High Speed Digital Multichip Modules

D. C. Keezer

System Design Optimization for MCM-D/Flip-Chip

P. D. Franzon, A. Stanaski, Y. Tekmen, and S. Banerjia

REGULAR PAPERS

Multichip Module Modeling and Characterization

Modeling and Analysis of Multichip Module Power Supply Planes

K. Lee and A. Barber

A Clustered Yield Model for SMT Boards and MCM's

M. M. V. Tegethoff and T. W. Chen

Laddering Wave in Serpentine Delay Line

R.-B. Wu and F.-L. Chao

Application of Ring Oscillators to Characterize Transmission Lines in VLSI Circuits

L. S. Dutta and T. Hillmann-Ruge

Multichip Module Fabrication and Applications

Evaluation of Polymeric Coatings for MCM Applications

R. Kodnani, D. Jaffe, and R. Jaccodine

Automated X-Ray Inspection of Chip-to-Chip Interconnections of Si-on-Si MCM's

Z. Tong, T. W. Liao, and C. A. Strittmatter

Computer Vision for Automatic Inspection of Complex Metal Patterns on Multichip Modules (MCM-D)

M. E. Scaman and L. Economikos

Efficient Multimode Optical Fiber-to-Waveguide Coupling for Passive Alignment Applications in Multichip Modules

T. S. Barry, D. L. Rode, M. H. Cordaro, R. R. Krchnavek, and K. Nakagawa

Printed Circuits

A Novel Type of Low Dielectric and Heat-Resistant Resin for Printed Wiring Boards

K. Nawa and M. Ohkita

Diode Laser-Assisted Pyrolysis of Organometallic Films for the Fabrication of Metallic Conductors on Polyimide

S. Evoy, R. Izquierdo, M.-H. Bernier, M. Meunier, and E. Sacher

Reinforcing Effect of Coverlayers on the Fatigue Life of Copper--Kapton Flex Cables

A. T. Zehnder and A. R. Ingraffea

Corrosion and Adhesion of Multilayer Pad Structures for Packaging Applications

G. S. Frankel, S. Purushothaman, T. A. Petersen, S. Farooq, S. N. Reddy, and V. Brusic

Application of Direct Strain Measurement to Fatigue Studies in Surface Solder Joints

Y. C. Chan, D. J. Xie, J. K. L. Lai, and I. K. Hui

Integer Programming Approach to Printed Circuit Board Assembly Time Optimization

R. Kumar and H. Li

Single Chip Packaging

Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding

S.-Y. Kang, P. M. Williams, and Y.-C. Lee

Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages

A. Mertol

Effects of Fillers on Wire Sweep in Semiconductor Chip Encapsulation

S. Han and K. K. Wang

Low-Temperature, Low-Dielectric, Crystallizable Glass Composite

J.-H. Jean, S.-C. Lin, and C.-R. Chang

1995 INDEX