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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

August 1996, Volume 19, Issue 3

CONTRIBUTIONS FROM THE 4th IEEE TOPICAL MEETING ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING

FOREWORD

A. Deutsch

Modeling, Measurement, and Simulation of Simultaneous Switching Noise

B. D. McCredie and W. D. Becker

Effects and Modeling of Simultaneous Switching Noise for BiCMOS Off-Chip Drivers

D. A. Secker and J. L. Prince

Design Trade-Offs for the Last Stage of an Unregulated, Long-Channel CMOS Off-Chip Driver with Simultaneous Switching Noise and Switching Time Considerations

Y. Yang and J. R. Brews

Modeling and Design of Antennas for RF Wireless Systems

S. Ponnapalli

Multireflection Algorithm for Timed Statistical Coupled Noise Checking

H. H. Smith and G. A. Katopis

Characterization of a Small Peripheral Array Package

J. Hao, A. Richter, J. Laskar, M. Swaminathan, and J. Mosley

Time and Frequency Domain Analysis of Integral Decoupling Capacitors

M. P. Goetz

CONTRIBUTIONS FROM THE 45th ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE

FOREWORD: Special Section on Optoelectronic Packaging

R. A. Boudreau

A Surface Mount Single-Mode Laser Module Using Passive Alignment

K. Kurata, K. Yamauchi, A. Kawatani, H. Tanaka, H. Honmou, and S. Ishikawa

A Low-Cost High-Performance Optical Interconnect

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, and B. Webb

Thermal Management of VCSEL-Based Optoelectronic Modules

Y.-C. Lee, S. E. Swirhun, W. S. Fu, T. A. Keyser, J. L. Jewell, and W. E. Quinn

622 Mb/s/Channel Parallel Digital Optical Receiver Array Module Using Hybrid Packaging

S. Siala, V. Ramakrishnan, M. Govindarajan, Y. Dekovic, R. Kinter, J. Padilla, A. F. J. Levi, and R. N. Nottenburg

Optical Performance of Low-Cost Self-Aligned MCM-D Based Optical Data Links

M. F. Dautartas, A. M. Benzoni, S. L. Broutin, A. Coucoulas, D. T. Moser, Y.-H. Wong, and Y.-M. Wong

Design of a Compact, High Speed Optical Transceiver Using Two Step Overmolding

F. C. J. Anigbo, S. D. Robinson, S. L. Broutin, G. J. Shevchuk, and D. Stefanik

A Packaging Technique for an Optical 90^o-Hybrid Balanced Receiver Using a Planar Lightwave Circuit

H. Tsunetsugu, M. Hosoya, S. Norimatsu, N. Takachio, Y. Inoue, and S. Hata

Low Temperature Bonding of Epitaxial Lift Off Devices with AuSn

G. R. Dohle, T. J. Drabik, J. J. Callahan, and K. P. Martin

REGULAR PAPERS

Single Chip Packaging

Level 1 Crackfree Plastic Packaging Technology

G. S. Ganesan, G. Lewis, A. Woosley, W. S. Lindsay, and H. Berg

Advanced COPNA-Resin as a Low Temperature Curing Resin for High-Density Electronic Packages

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K. Nawa, S. Ueda, and H. Watanabe

Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages Under Temperature Cyclic Loading

T. Saitoh

Measurements of the Novel Thermal Conduction of a Porphoritic Heat Sink Paste

R. G. C. Artus

Electrical Modeling and Performance

Interconnect Propagation Delay Modeling and Validation for the 16-MB CMOS SRAM Chip

V. N. Rayapati and B. Kaminska

A Combined Finite Difference and Analytic Expression Approach to Crossover Capacitance in a Multilayer Dielectric Environment

G.-W. Pan, M. Toupikov, and B. K. Gilbert

Full Wave Analysis of Transmission Lines in a Multilayer Substrate with Heavy Dielectric Losses

J. Tan, G.-W. Pan, G.-T. Lei, and B. K. Gilbert

Multichip Packaging

Laser-Diode Array Packaging in Opto-Electronic Multichip Modules

S. Koike, S. Matsui, and H. Takahara

High Q-Factor Inductors Integrated on MCM Si Substrates

L. Zu, Y. Lu, R. C. Frye, M. Y. Lau, S.-C. S. Chen, D. P. Kossives, J. Lin, and King L. Tai

Chip Attachment and Reliability

Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates

Z. Lai and J. Liu

Reliability Studies of Surface Mount Solder Joints--Effect of Cu-Sn Intermetallic Compounds

A. C. K. So and Y. C. Chan

Fatigue Life Estimation of Surface Mount Solder Joints

D. J. Xie, Y. C. Chan, J. K. L. Lai, and I. K. Hui

Fatigue Life Studies on Defect-Free Solder Joints Fabricated from Modified Reflow Soldering

D. J. Xie, Y. C. Chan, J. K. L. Lai, and I. K. Hui

Reliability of Metallized Ceramic Packages

G. Subbarayan, M. G. Ferrill, and S. M. DeFoster

CORRESPONDENCE

Correction to "Efficient Transient Simulation of Lossy Packaging Interconnects Using Moment-Matching Techniques"

M. Celik and A. C. Cangellaris