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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

May 1997, Volume 20, Number 02

REGULAR PAPERS

Substrate Design and Modeling

Study of Tantalum Oxide Thin Film Capacitors on Metallized Polymer Sheets for Advanced Packaging Applications

K. Chen, M. Nielsen, S. Soss, E. J. Rymaszewski, T.-M. Lu, and C. T. Wan

[p. 117]

Direct Computation of Capacitance in Integrated Passive Components Containing Floating Conductors

G. J. Cokkinides, B. Beker, and A. Templeton

[p. 123]

Multiconductor Transmission Line Characterization

D. F. Williams

[p. 129]

Bonding and Soldering

Etch Alignment of CCD Mosaic Hybrid

S. C. Chapman, G. S. Burley, G. A. H. Walker, and A. Parameswaran

[p. 133]

Controlled Solder Interdiffusion for High Power Semiconductor Laser Diode Die Bonding

S. A. Merritt, P. J. S. Heim, S. H. Cho, and M. Dagenais

[p. 141]

The Effect of Solder Paste Viscosity on Porosity and Mechanical Properties of Surface Mount Solder Joints

Y. Tian, Y. C. Chan, J. K. L. Lai, and S. T. F. Pak

[p. 146]

Thermosonic Bonding of an Optical Transceiver Based on an 8 x 8 Vertical Cavity Surface Emitting Laser Array

T. S. McLaren, S. Y. Kang, W. Zhang, T.-H. Ju, and Y.-C. Lee

[p. 152]

Package Reliability

Aging Studies of Cu-Sn Intermetallic Compounds in Annealed Surface Mount Solder Joints

A. C. K. So, Y. C. Chan, and J. K. L. Lai

[p. 161]

The Effect of the Oxidation of Cu-Base Leadframe on the Interface Adhesion Between Cu Metal and Epoxy Molding Compound

S.-J. Cho, K.-W. Paik, and Y.-G. Kim

[p. 167]

Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading--Part II: Using Alloy 42 as Leadframe Material

T. Saitoh and M. Toya

[p. 176]

ANNOUNCEMENTS

List of Reviewers

[p. 184]

Call for Abstracts--Workshop on Accelerated Stress Testing AST '97

[p. 185]

Call for Papers--6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

[p. 186]