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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B:
Advanced Packaging
August 1997, Volume 20, Number 03
- Editorial
- P.
J. Krusius
[p. 190]
REGULAR PAPERS
- VCSEL Electrical Packaging Analysis and
Design Guidelines for Multi-GHz
Applications
- S. H. Hall, W. L.
Walters, L. F. Mattson, G. J.
Fokken,
and B. K. Gilbert
[p. 191]
- S
Parameter-Based Experimental Modeling of High
Q MCM Inductor with Exponential
Gradient Learning Algorithm
- J. Zhao, R. C. Frye,
W. W.-M. Dai, and K. L. Tai
[p. 202]
- Wetting Interactions Between the Ni-Cu-P
Deposit and
In-Sn Solders
- C.-J. Chen and
K.-L. Lin
[p. 211]
- Impedance and Crosstalk of Stripline and Microstrip
Transmission Lines
- A. J.
Rainal
[p. 217]
- Highly Efficient Coupling Between Single-Mode Fiber and
Polymer Optical
Waveguides
- T.
S. Barry, D. L. Rode, and R. R.
Krchnavek
[p. 225]
- Criteria for the Assessment of Reliability
Models
- M. G. Pecht, A. A. Shukla, N. Kelkar,
and J. Pecht
[p. 229]
- Fast Parameter Extraction for Multiconductor
Interconnects in
Multilayered Dielectric Media Using Mixture Method of Equivalent Source
and Measured Equation of
Invariance
- R. Jin, Y. Cao, and Z.
Li
[p. 235]
- Excimer Laser Machining and Metallization of Vias in
Aluminum
Nitride
- J. K.
Lumpp and S. D. Allen
[p. 241]
- Residual Stresses in Plastic IC Packages During
Surface Mounting Process Preceded by Moisture Soaking
Test
- S. Yi, J. S. Goh, and
J. C. Yang
[p. 247]
- Low-Cost Fabrication of Optical
Subassemblies
- M.
S. Cohen, G. W. Johnson, J. M. Trewhella, D. L. Lacey, M. M.
Oprysko,
D. L. Karst, S. M. DeFoster, W. K. Hogan, M. D. Peterson, and J. A.
Weirick
[p. 256]
CONTRIBUTIONS from the 5TH Topical Meeting on
Electrical Performance of Electronic Packaging
- Foreword
- J.
L. Prince and A. Deutsch
[p. 264]
- Measurement, Modeling, and Simulation of Flip-Chip
CMOS ASIC
Simultaneous Switching Noise on a Multilayer Ceramic
BGA
- J. P. Libous and D. P.
O'Connor
[p. 266]
- Power Distribution Fidelity of Wirebond Compared to
Flip Chip Devices in
Grid Array
Packages
- H.
Hashemi and D. J. Herrell
[p. 272]
- High Density Packaging of X-Band Active Array
Modules
- M. S. Hauhe and J. J.
Wooldridge
[p. 279]
- SSO Noise Electrical Performance Limitations for PQFP
Packages
- L. Lin and J. L.
Prince
[p. 292]
CONTRIBUTIONS from the
International Conference on Innovative
Systems in Silicon (ISIS '96)
- Foreword
- D.
Sciuto, S. K. Tewksbury, and G. H.
Chapman
[p. 298]
- Testability and Signal Integrity in a Low Cost Multichip
Module
- A.
Omer and A. Flint
[p. 300]
- Early Analysis of Cost/Performance Trade-Offs in MCM
Systems
- V.
Garg, D. J. Stogner, C. Ulmer, D. E. Schimmel, C. Dislis, S.
Yalamanchili, and D. S. Wills
[p. 308]
- Cost-Effective Multichip Module Manufacture Using
Passive Substrate Fault
Tolerance
- C.
Peacock, H. Bolouri, and C. Habiger
[p. 320]
- Versatile Multilayer MCM-D Structure for High
Reliability
Applications
- J.
Strandberg, H. Thiede, A. Karlsson, P.
Bodö, J. Haglund, S.
Valizadeh, and A. Weiland
[p. 327]
- Performance Analysis of MCM
Systems
- C. Truzzi, E. Beyne, and E.
Ringoot
[p. 334]
- Effects of Scanning and Biasing Circuit Restructuring
on the Response of
a Large Area Magnetic Field Sensor
Array
- Y. Audet and G. H.
Chapman
[p. 342]
ANNOUNCEMENTS
- Call for Papers--48th Electronic Components and
Technology Conference (ECTC '98)
[p. 349]
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