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IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B:
Advanced Packaging
November 1997, Volume 20, Number 04
REGULAR PAPERS
- High-Speed Signal Transmission at the
Front of a Bookshelf Packaging
System
- S.
Koike, K. Kaizu, and T. Kishimoto
[p. 353]
- Long Lossy Lines (L3) and Their Impact Upon
Large Chip
Performance
- E.
E. Davidson, B. D. McCredie, and W. V.
Vilkelis
[p. 361]
- Optimization of High Pin Count
Cavity-Up Enhanced Plastic Ball Grid Array (EPGA) Packages for Robust
Design
- A.
Mertol
[p. 376]
- Physical Design and Assembly Process Development of a
Multichip Package Containing a Light Emitting Diode (LED) Array
Die
- N. R. Bonda, T. Fang, K. Kaskoun,
W. H. Lytle, B. Marlin, G. Swan, J. W. Stafford, and G.
Tam
[p. 389]
- Effect of Au Thickness on Laser Beam Penetration in
Semiconductor Laser
Packages
- W.-H.
Cheng, S.-C. Wang, Y.-D. Yang, S. Chi, M.-T. Sheen, and J.-H.
Kuang
[p. 396]
- The Packaging of Large Spot-Size Optoelectronic
Devices
- J.
V. Collins, I. F. Lealman, P. J. Fiddyment, A. R. Thurlow,
C. W. Ford, D. C. Rogers, and C. A.
Jones
[p. 403]
- Photonic Packaging Using Laser/Receiver Arrays and
Flexible Optical Circuits
- G. J.
Grimes,
J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest,
C. J. Sherman, S. R. Peck, D. J. Muehlner,
C.C.Faudskar,J.
S. Nyquist, J. S. Helton, G. L. Sonnier, J. V. Gates, W. K. Honea, and
J. R.
Bortolini
[p. 409]
- Rheological Characterization of Solder Pastes for Surface
Mount
Applications
- V.
G. Kolli, F. Gadala-Maria, and R.
Anderson
[p. 416]
- Analysis of the Flow of Encapsulant During Underfill
Encapsulation of
Flip-Chips
- S.
Han and K. K. Wang
[p. 424]
- Study on the Pressurized Underfill Encapsulation of
Flip-Chips
- S.
Han and K. K. Wang
[p. 434]
- Use of Surface Insulation Resistance and Contact
Angle Measurements to Characterize the Interactions of Three Water
Soluble Fluxes with FR-4 Substrates
- J.
A. Jachim, G. B. Freeman, and L. J.
Turbini
[p. 443]
- Solder Bump Size and Shape Modeling and Experimental
Validation
- M. J.
Pfeifer
[p. 452]
- Stress-Induced Parametric Shift in Plastic Packaged
Devices
- H.
Ali
[p. 458]
- Effect of Intermetallic Compounds on the Shear Fatigue of
Cu/63Sn-37Pb Solder
Joints
- Y.
C. Chan, P. L. Tu, A. C. K. So, and J. K. L.
Lai
[p. 463]
- 1997 INDEX
- Follows page
[p. 469]
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