Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely download the PDFs of any of these papers, at the XPLORE On-Line Library. Guests may access abstract/citation records free of charge.

IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

May 1998, Volume 21, Number 02

Editorial

J. P. Krusius

[p. 1]

REGULAR PAPERS

Optoelectronic Packaging

Packaging of Large-Scale Planar Lightwave Circuits

K. Kato, M. Ishii, and Y. Inoue

[p. 121]

Design and Qualification of Hermetically Packaged Lithium Niobate Optical Modulator

R. S. Moyer, R. Grencavich, F. F. Judd, R. C. Kershner, W. J. Minford, and R. W. Smith

[p. 130]

Wafer Scale Photonic-Die Attachment

R. Boudreau, P. Zhou, and T. Bowen

[p. 136]

Hybrid WDM Transmitter/Receiver Module Using Alignment Free Assembly Techniques

A. Goto, S. Nakamura, K. Kurata, K. Komatsu, and S. Ishikawa

[p. 140]

Microsystems and Wafer Processes for Volume Production of Highly Reliable Fiber Optic Components for Telecom- and Datacom-Application

H. L. Althaus, W. Gramann, and K. Panzer

[p. 147]

Electrical Modeling and Performance

Modeling, Simulation, and Measurement of Mid-Frequency Simultaneous Switching Noise in Computer Systems

W. D. Becker, J. Eckhardt, R. W. Frech, G. A. Katopis, E. Klink, M. F. McAllister, T. G. McNamara, P. Muench,S. R. Richter, and H. H. Smith

[p. 157]

Comparison of Electrical Performance of Enhanced BGA's

R. Kaw, B. Hanna, and N. Devnani

[p. 164]

Characterization of Thin Film Microstrip Lines on Polyimide

G. E. Ponchak and A. N. Downey

[p. 171]

Accurate, Rapid, High Frequency Empirically Based Predictive Modeling of Arbitrary Geometry Planar Resistive Passive Devices

R. Poddar, E. M. Moon, M. A. Brooke, and N. M. Jokerst

[p. 177]

Advanced Packaging Structures

A Novel Integrated Decoupling Capacitor for MCM-L Technology

P. Chahal, R. R. Tummala, M. G. Allen, and M. Swaminathan

[p. 184]

Laser Formed Metallic Connections

J. B. Bernstein, W. Zhang, and C. H. Nicholas

[p. 194]

Novel Technique for Measuring Through-Plane Modulus in Thin Polymer Films

K. S. Patel, P. A. Kohl, and S. A. Bidstrup-Allen

[p. 199]

ANNOUNCEMENTS

1997 List of Reviewers

[p. 203]

Call for Papers--Seventh Topical Meeting on Electrical Performance of Electronic Packaging

[p. 205]

IEEE Copyright Form

[p. 119]