Getting Copies of these Papers:
Subscribers to this Transactions (and subscribers to XPLORE/IEL/MDL) may freely download the PDFs of any of these papers, at the XPLORE On-Line Library. Guests may access abstract/citation records free of charge.

IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging

August 1998, Volume 21, Number 03

Editorial

J. P. Krusius

[p. 1]

REGULAR PAPERS

Electrical Modeling and Performance

Interconnect and Circuit Modeling Techniques for Full-Chip Power Supply Noise Analysis

H. H. Chen and J. S. Neely

[p. 209]

A New Approach for the Modeling and Simulation of Electromagnetic Interference

P. Nordholz and H. Grabinski

[p. 216]

Automatic Generation of Accurate Circuit Models of 3-D Interconnect

M. Kamon, N. A. Marques, L. M. Silveira, and J. White

[p. 225]

A Technique for Fast Calculation of Capacitance Matrices of Interconnect Structures

V. Veremey and R. Mittra

[p. 241]

Dynamic Analysis of V Transmission Lines

O. M. Ramahi, A. Z. Elsherbeni, and C. E. Smith

[p. 250]

Integrated Components

Characterization of Embedded Passives Using Macromodels in LTCC Technology

K. L. Choi, N. Na, and M. Swaminathan

[p. 258]

Characterization of a Planar Spiral Inductor on a Composite-Resin Low-Impedance Substrate and Its Application to Microwave Circuits

H. Okabe, H. Yamada, M. Yamasaki, O. Kagaya, K. Sekine, and K. Yamashita

[p. 269]

Composite and Multilayered TaO_x-TiO_y High Dielectric Constant Thin Films

M. C. Nielsen, J.-Y. Kim, E. J. Rymaszewski, T.-M. Lu, A. Kumar, and H. Bakhru

[p. 274]

Packaging and Interconnects

Figures-of-Merit for Package Electrical Roadmaps

B. Young

[p. 281]

S/390 Cost Performance Considerations for MCM Packaging Choices

G. A. Katopis and W. D. Becker

[p. 286]

Design Methodology for Chip-on-Chip Applications

Y. L. Low, R. C. Frye, and K. J. O'Connor

[p. 298]

Ultra Low Loss Millimeter Wave Multichip Module Interconnects

A.-V. H. Pham, J. Laskar, V. B. Krishnamurthy, H. S. Cole, and T. Sitnik-Nieters

[p. 302]

Low-Cost AlGaAs/GaAs HBT Multi-Gigabit Limiting Amplifier Packaged with a New Plastic Air Tight Cavity Encapsulation Process

B. Kwark, D. S. Ma, H. Seo, K. Ham, and M. S. Park

[p. 309]