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IEEE Transaction on Components, Packaging, and Manufacturing Technology Part C:
Manufacturing
January 1996, Volume 19, Issue 1
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EDITORIAL
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W.
J. Trybula
NEURAL NETWORKS AND FUZZY LOGIC
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FOREWORD
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K.
F. Yeung and H. H. Li
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Reactive Ion Etch Modeling Using Neural Networks and
Simulated
Annealing
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B.
Kim and G. S. May
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Function Approximation and Neural-Fuzzy Approach to
Machining Process
Selection
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S.
H. Huang, H.-C. Zhang, S. Sun, and H. H.
Li
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Artificial Neural Network Model-Based Run-to-Run Process
Controller
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X.
A. Wang and R. L. Mahajan
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On the Optimization Aspects of
Parametrized Neurocontrol (PNC)
Design
-
T.
Samad and H.-T. Su
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Fuzzy Logic Models with Improved
Accuracy and Continuous
Differentiability
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B.
Schaible and Y.-C. Lee
REGULAR PAPERS
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Estimating Tools to Support Multi-Path Agility in
Electronics
Manufacturing
-
R.
J. Graves, A. Agrawal, and K. Haberle
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Modeling the Cost of Ownership of Assembly and
Inspection
-
D.
L. Dance, T. DiFloria, and D. W.
Jimenez
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A Novel Structure to Realize Crack-Free
Plastic Package During Reflow Soldering Process
---Development of Chip Side Support (CSS)
Package
-
T.
Nakazawa, Y. Inoue, K. Sawada, and T.
Sudo
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IEEE COPYRIGHT
FORM
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